Patent Application
20170305790
The invention relates to a method for integrating a non-metal part with a metal part.
Conventionally, frames of electronic equipment including mobile phones and tablet computers use alloy material. The metal frames formed by alloy material have a better appearance and can protect the fragile panel or backplane of the electronic equipment. Specifically, the panel, backplane, or plastic component of the electronic equipment is embedded in a processed metal frame, and then the metal frame is assembled with a corresponding part. However, the assembly method leaves certain gaps between the metal frame and the panel or backplane of the electronic product, and the assembly gaps cannot be eliminated completely even using precision machining.
Chinese Patent No. CN101815594 discloses a method for imbedding a glass insert in a metal frame and electronic equipment prepared using the method. The method includes placing a metal frame on the surface or the edge of a transparent component using a metal modeling process. To be specific, the transparent component is placed in the chamber of a mold. Liquid metal is poured into the chamber, and when the metal is cooled, a metal frame is formed on the surface or the edge of the transparent component. By using the method, the assembly gaps are eliminated, and the transparent component is integrated with the metal frame. However, during operation, the metal requires heating, casting, and cooling quickly, which involves a complex process, and the product yield is low. The above patent also discloses a method for shaping metal powders at the edge of a transparent component using a Metal Injection Molding (MIM) process. Specifically, the metal powders are shaped at the edge of the transparent component using a high-temperature sintering process. The metal frame formed by high-temperature sintering process has relatively loose interior structure, which is unfavorable to subsequent surface treatments including polishing, oxidization, and electroplating, and the appearance of the electronic product leaves much to be desired.
The method of the above-mentioned patent CN101815594 only discloses integrating a transparent component such as glass or sapphire with metal material. In the modeling process or MIM process, the transparent component is exposed under high temperatures, which adversely affects the properties and the organizational structure of the transparent component, as a result, when the transparent component is integrated with the metal material, the combination thereof is not tight thus affecting the appearance of the electronic products.
In view of the above-described problems, it is one objective of the invention to provide a method for integrating a non-metal part with a metal part. The method is easy to operate, has high product yield, and facilitates the surface treatment of the metal part. In addition, the integrated product formed by the method has beautiful appearance.
To achieve the above objective, in accordance with one embodiment of the invention, there is provided the method for integrating a non-metal part with a metal part, the method comprising:
In a class of this embodiment, the metal part is aluminum magnesium alloy, aluminum copper alloy, aluminum nickel alloy, zirconium alloy, or titanium alloy.
In a class of this embodiment, the edge of the non-metal part is provided with a clamping structure.
In a class of this embodiment, the clamping structure is a groove or a lug boss on the edge of the non-metal part.
In a class of this embodiment, a thermal expansion coefficient of the metal part is greater than or equal to a thermal expansion coefficient of the non-metal part.
In a class of this embodiment, prior to 3), a buffer is disposed between the metal part and the non-metal part. The buffer is a continuous structure along the edge of the non-metal part.
In a class of this embodiment, the non-metal part is ceramic.
Advantages of the method according to embodiments of the invention are summarized as follows:
Compared with the method in the prior art, the method in the embodiments of the invention uses a hot pressing process, and the metal part is integrated on the edge of the opaque non-metal part. The method is easy to operate, and has high product yield. The pressed metal part features relatively high density and intensity. In addition, the method facilitates the surface treatment of the metal part.
The invention is described hereinbelow with reference to the accompanying drawings, in which:
For further illustrating the invention, experiments detailing a method for integrating a non-metal part with a metal part are described below.
As shown in
In the above method, 3), 4), 5) are conducted under vacuum environment to avoid oxidation of the metal frame 60 under high temperatures. Specifically, following 2), the air in the chamber of the mold is exhausted by an external vacuum device.
The integrated component prepared by the above method can be applied to the electronic products having a ceramic back plate and a metal frame. The ceramic plate 50, which is used as the back plate, compared with the existing metal mobile phone shell, is unlikely to shield the network signal, and can enhance the WiFi signal of the phone. Meanwhile, by using the ceramic plate, Near Field Communication (NFC) and wireless charging of the phone can be realized. In addition, single crystal silicon on the outside makes it possible for the phone to be charged using solar energy.
As the integrated component is applied to the electronic products, after separating from the mold, the integrated component needs to be polished, plated, oxidized, etc. In the above method, the metal frame 60 is processed using a semi-solid metal technique, and the metal frame 60 features a dense interior structure and high intensity, thus laying a favorable foundation for the surface treatments such as polish, plating, oxidization, etc.
In the example, favorably, the metal frame 60 is aluminum copper alloy, aluminum nickel alloy, zirconium alloy, or titanium alloy. Other metal materials that can be used for preparing the metal frame 60 of the electronic products are optional.
The edge of the ceramic plate 50 is provided with a clamping structure to increase the bonding intensity. Specifically, the clamping structure is a groove formed by extending the edge of the ceramic plate 50. While the semi-solid metal frame 60 is extruded, part of the inner surface forms a structure embedding in the groove. Optionally, the clamping structure is a lug boss formed by extending the edge of the ceramic plate 50. While the semi-solid metal frame 60 is extruded, the metal frame experiences deformation so as to clamp the lug boss.
In selecting the materials, a metal frame 60 which has a thermal expansion coefficient larger than or equal to a thermal expansion coefficient of the ceramic plate 50 is preferable, therefore, when the metal frame 60 is heated, the thermal expansion of the ceramic plate 50 can be effectively controlled, and the adverse influence of the temperature on the ceramic plate 50 is reduced. As a component of electronic products, optionally, the ceramic plate 50 uses plate-shaped high-temperature resistant materials such as quartz stone or marble, or other materials such as boride, carbide, fluoride, silicide, phosphide, sulfide.
In the example, prior to 3), a buffer is disposed between the metal frame 60 and the edge of the ceramic plate 50. The buffer is a continuous structure along the edge of the ceramic plate 50. Optionally, the buffer can be a component which works to facilitate the integration of the ceramic plate 50 and the metal frame 60; or the buffer is an elastic component, for example, the buffer is 65 Mn. The buffer which is made of 65 Mn features favorable elasticity, therefore, as the buffer is disposed in the integrated component comprising the metal frame 60 and the ceramic plate 50, the buffer can buffer the impact force and effectively protect the ceramic plate 50 when the electronic product falls down and the metal frame 60 faces the impact force.
The method in the example of the invention is also applicable for other integration of a metal part with an opaque non-metal part such as ceramic. However, no matter what the method is applied, the steps are mostly the same as those in the method in the example of the invention, and no need to be illustrated here.
While particular embodiments of the invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspects, and therefore, the aim in the appended claims is to cover all such changes and modifications as fall within the true spirit and scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014104013922 | Aug 2014 | CN | national |
This application is a National Stage Appl. filed under 35 USC 371 of International Patent Application No. PCT/CN2014/085136 with an international filing date of Aug. 26, 2014, designating the United States, now pending, and further claims foreign priority benefits to Chinese Patent Application No. 201410401392.2 filed Aug. 14, 2014. Inquiries from the public to applicants or assignees concerning this document or the related applications should be directed to: Matthias Scholl P.C., Attn.: Dr. Matthias Scholl Esq., 245 First Street, 18th Floor, and Cambridge, Mass. 02142.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2014/085136 | 8/26/2014 | WO | 00 |
