The present application is a continuation-in-part of now abandoned U.S. application Ser. No. 08/656,235, filed Aug. 27, 1996 which is incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
1614752 | Mitchell | Jan 1927 | |
1643304 | Korsunsky | Sep 1927 | |
1720894 | Gray et al. | Jul 1929 | |
1970319 | Kern | Aug 1934 | |
2052142 | Kern | Aug 1936 | |
4124380 | Youdelis | Nov 1978 | |
4973446 | Bernhard et al. | Nov 1990 | |
5039479 | Bernhard et al. | Aug 1991 |
Number | Date | Country |
---|---|---|
508 528 | Sep 1929 | DE |
4213897 | Nov 1992 | DE |
0 067 983 | Dec 1982 | EP |
0 248 914 | Dec 1987 | EP |
925182 | May 1963 | GB |
2 255 348 | Nov 1992 | GB |
63-317289 | Dec 1988 | JP |
0052237 | Feb 1992 | JP |
0339590 | Nov 1992 | JP |
1810259 | Apr 1993 | SU |
9514112 | May 1995 | WO |
Entry |
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Welding Journal, vol. 41, No. 4, Apr. 1962, pp. 106S-166S Miami, US: “Diffusion Bonding Beryllium Copper for Ultra High-Strength Joints”. |
AWS Welding Handbook, pp. 312-313, vol. 3, 7th Ed. (1980 AWS, Miami) W.H. Kearns. |
Chemical Abstracts, vol. 122, No. 10, Mar. 5, 1990: Lyubeshkin et al., “Solder for Soldering Electronic Components” (Abstract No. 89488). |
ASM Handbook, vol. 6, pp. 156-159; 301-302 (Dec. 1993), “Welding, Brazing, and Soldering”. |
Number | Date | Country | |
---|---|---|---|
Parent | 08/656235 | Aug 1996 | US |
Child | 09/170924 | US |