Patent Application
20230044332
The present invention relates to a method for laser machining a workpiece, an apparatus for laser machining a workpiece and a use of an apparatus for laser machining a workpiece.
Laser machining apparatuses are used in laser machining workpieces, in particular in methods for the thermal separation of materials by means of a laser beam, such as laser cutting. In many cases, a laser machining head is used to guide the machining laser beam onto the workpiece, for example onto a metal sheet to be machined.
When laser cutting with an active cutting gas, such as oxygen, the metallic material of the workpiece is burned, for example, after it has been heated to the ignition temperature by the laser beam. This type of laser cutting is also called flame cutting. The reaction between oxygen and the material of the workpiece generates additional heat that supports the cutting process. The melted liquid material, which has a low viscosity, can be removed from the cut edge or from the cutting gap by the shear forces of the gas. When cutting with an inert gas such as nitrogen or argon, the material of the workpiece is only melted by the laser power and can be blown out of the cutting gap by the kinetic energy of the gas stream. This type of laser cutting is also called fusion cutting. The process illumination (inherent illumination) generated during the laser cutting process and emitted by the workpiece, which are recorded with suitable detectors, can be used to monitor the cutting process and the cutting gap. In addition, the laser machining zone of the workpiece can be illuminated, whereby the beam reflected and/or emitted by the workpiece can be detected.
The focus of the machining laser beam can experience a focus shift (shifting of the focus) over time and with increasing power, in particular due to the heating of optical elements that are used for optical imaging of the laser beam. This undesirably induced focus shift affects the machining result. To counteract a focus shift and to be able to cut stably, process parameters can be given sufficiently large tolerances. However, the focus often shifts to an unfavourable position or location, which leads to a reduced cut quality.
US2018029164 A1 describes a measurement of the focus position. However, the focus position is measured in the cutting head, which makes the cutting head expensive, heavy, and complicated.
According to DE 100 45 191 A1, thermal variables in the cutting head and computational derivatives thereof are used to be able to compensate for beam changes in real time.
DE102016219928 A1 relates to a method in which the focus position relative to the workpiece is determined by means of camera-based cutting gap measurement. The focus position is determined by the determined cutting gap width. For this purpose, the caustic of the laser beam must be measured, which makes calibration steps necessary. Furthermore, the focus position must be determined repeatedly in the course of the method. The process is therefore complex.
The methods to compensate for a focus shift from the aforementioned documents are therefore dependent on indirect measurements, and are complicated and/or time-consuming to carry out.
DE102010020183 A1 relates to a laser cutting head and a method for cutting a workpiece. The control process includes the acquisition of current process parameters such as cutting gas pressure, feed rate, focus position or laser power of the laser cutting head and the setting of the process parameters by a control unit in order to adjust the current width of the cutting gap to a predetermined value.
WO2016/181359 A1 describes a laser processing device with an arrangement for generating and guiding a working laser beam and with at least one group of detector arrangements which are sensitive to radiation characteristic of the processing operation.US 2016/0193692 A1 relates to devices and methods for monitoring or regulating a cutting process on a workpiece.
JP2002331383 A describes a monitoring device for cutting, with which the current cutting width is compared with a previously specified cutting width and a cutting error is determined in the event of a deviation resulting therefrom.
The object of the invention is to provide a method and an apparatus with which an undesired focus shift can be counteracted in a simple manner.
This object is achieved by a method according to claim 1, an apparatus according to claim 10, and a use according to claim 17.
In one embodiment, a method for laser machining a workpiece is provided, with a) generating a machining laser beam and imaging the machining laser beam on the workpiece with at least one optical element; b) machining the workpiece with the imaged machining laser beam and generating a cutting gap in the workpiece; c) monitoring at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap, wherein step d) is carried out by varying a position of the focus of the machining laser beam in the direction of propagation thereof and additionally by varying at least one parameter selected from a width of the machining laser beam, a diameter of the machining laser beam, and an intensity distribution of the machining laser beam, in particular an intensity distribution of the machining laser beam perpendicular to the direction of propagation thereof; wherein step d) is carried out independently of a caustic of the machining laser beam.
Since the at least one geometric parameter of the cutting gap is monitored and controlled during laser machining, the focus position need not be determined. The method is therefore not very time-consuming, does not require calibration, and is easy to implement.
Step d) can be carried out by adapting the imaging of the machining laser beam on the workpiece. If one or more of the monitored geometric parameters of the cutting gap deviates from the respective desired target value, for example, the focus position is corrected.
In the method of embodiments, step d) can be carried out independently of a position of the beam waist of the machining laser beam. The method is therefore not very time-consuming, does not require calibration, and is easy to implement.
In embodiments, the target value of the geometric parameter used in step d) can be or is determined as a function of at least one element selected from: a type of laser machining; a material of the workpiece; a thickness of the workpiece; a shape of the workpiece; a power of the machining laser source with which the machining laser beam is generated; an angle of incidence of the machining laser beam on the workpiece; a beam parameter product (BPP) of the machining laser beam; a focus diameter of the machining laser beam; and, a divergence angle of the machining laser beam. For example, the target value of the respective geometric parameter can be determined as a function of the type of laser cutting. For example, a target value can be selected for flame cutting that differs from that for fusion cutting. The target value can be determined by a device for regulating the monitored geometric parameter and/or a controller and/or can be specified by an operator. For example, the target value can be taken from a look-up table.
In the method of embodiments, the at least one geometric parameter can be selected or is selected from a width of the cutting gap, a cutting front angle of the cutting gap, a surface structure of a cut edge of the cutting gap, a roughness of a cut edge of the cutting gap, a shape of the workpiece at the cutting gap, a width of a beam reflected and/or emitted by the workpiece, and/or a shape of a beam reflected and/or emitted by the workpiece. For example, the cutting gap is observed and the width thereof is monitored. The cutting gap symmetry of the cutting gap can be used to monitor the surface structure thereof. The at least one geometric parameter can/be determined by a device for regulating the monitored geometric parameter and/or a controller and/or can be specified by an operator. For example, the at least one geometric parameter can be taken from a look-up table.
According to embodiments of the method, the geometric parameter, in particular the width of the cutting gap, can be kept constant in step d). Alternatively or additionally, in step d) the geometric parameter, in particular the width of the cutting gap, can be kept independent of the power of the machining laser source. These embodiments allow flexible and, at the same time, simple regulation of the geometric parameter.
In further embodiments, flame cutting can be carried out and step d) can be carried out by repeated and/or continuous adaptation of the focus of the machining laser beam in the upper half of the cutting gap or above the cutting gap. Furthermore, fusion cutting can be carried out and step d) can be carried out by repeated and/or continuous adaptation of the focus of the machining laser beam in the lower half of the cutting gap. In this way, with different types of laser cutting, by varying the focus position of the machining laser beam, the geometric parameters of the cutting gap can be corrected in the event of deviations from the target value.
In methods from embodiments, in step c) a beam reflected and/or emitted by the workpiece, in particular by a laser machining zone of the workpiece, can be recorded with a detector, in particular with a camera. This enables precise and simple monitoring of the geometric parameter of the cutting gap.
According to embodiments of the method, the workpiece, in particular a laser machining zone of the workpiece, can be illuminated in step c), in particular with an illumination source or an illuminating laser beam. In this way, the monitoring of the geometric parameter is supported.
In embodiments of the method, the at least one optical element can be heated by the machining laser beam in step a). Furthermore, in step a) the machining laser beam can be shaped, deflected, diverted, and/or reflected by the at least one optical element. In all these cases, the method enables undesired deviations of the geometric parameter from the target value to be compensated.
A further embodiment provides an apparatus for laser machining a workpiece, in particular for laser cutting, in particular with a method according to any one of the preceding embodiments. The apparatus is provided with
The device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that the imaging of the machining laser beam on the workpiece is adjusted. Suitable optical components, for example suitable for static and/or dynamic beam shaping, can be used as the at least one optical element to vary the aforementioned parameters. For example, an adjustable focusing lens, an adjustable collimating lens, a mirror with adjustable surface curvature, or a combination thereof can be provided as an optical element.
In further embodiments, the device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that the geometric parameter is regulated independently of a position of the beam waist of the machining laser beam.
In embodiments of the apparatus, the target value of the geometric parameter used in step d) can be determined as a function of at least one element selected from: a type of laser machining; a material of the workpiece; a thickness of the workpiece; a shape of the workpiece; a power of the machining laser source with which the machining laser beam is generated; an angle of incidence of the machining laser beam on the workpiece; a beam parameter product (BPP) of the machining laser beam; a focus diameter of the machining laser beam; and, a divergence angle of the machining laser beam. The target value can be determined by the device for regulating the monitored geometric parameter and/or a control of the apparatus and/or can be specified by an operator. For example, the target value can be taken from a look-up table.
In embodiments, the at least one geometric parameter can be selected from a width of the cutting gap, a cutting front angle of the cutting gap, a surface structure of a cut edge of the cutting gap, a roughness of a cut edge of the cutting gap, a shape of the workpiece at the cutting gap, a width of a beam reflected and/or emitted by the workpiece, and/or a shape of a beam reflected and/or emitted by the workpiece. The cutting gap symmetry of the cutting gap can be used to monitor the surface structure thereof. The at least one geometric parameter can be determined by the device for regulating the monitored geometric parameter and/or a control of the apparatus and/or can be specified by an operator. For example, the at least one geometric parameter can be taken from a look-up table.
In the apparatus of embodiments, the device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that the geometric parameter, in particular the width of the cutting gap, is kept constant. Alternatively or additionally, the device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that the geometric parameter, in particular the width of the cutting gap, is kept independent of the power of the machining laser source.
Furthermore, the device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that for flame cutting the focus of the machining laser beam is repeatedly and/or continuously adjusted in the upper half of the cutting gap or above the cutting gap. Alternatively or additionally, the device for regulating the monitored geometric parameter can be designed or be adaptable in such a way that for fusion cutting the focus of the machining laser beam is repeatedly and/or continuously adapted in the lower half of the cutting gap.
Furthermore, the device for monitoring the at least one geometric parameter can include a detector, in particular a camera, for recording a beam reflected and/or emitted by the workpiece, in particular by a laser machining zone of the workpiece. Furthermore, a device for illuminating the workpiece, in particular a laser machining zone of the workpiece, in particular an illumination source or an illuminating laser beam, can be provided in the apparatus of embodiments. In addition, the at least one optical element can be designed or be adaptable in such a way that the machining laser beam is shaped, deflected, diverted, and/or reflected.
One embodiment provides a use of an apparatus according to one of the preceding embodiments, wherein the laser machining comprises at least one machining operation selected from laser cutting, fusion cutting, and flame cutting.
With the apparatus for laser machining a workpiece of the above embodiments, the same advantages and functions can be realised as with the embodiments of the method for laser machining a workpiece, in particular with identical and/or analogous features.
Further features and advantages arise from the following description of embodiments, the figures, and the dependent claims.
All non-mutually exclusive features of embodiments described here can be combined with one another. The same elements of the embodiments are given the same reference symbols in the following description. Individual or a plurality of elements of one embodiment can be used in the other embodiments without further mention. Embodiments of the invention are now described in more detail using the following examples with reference to figures, without intending any limitation thereby. In the figures:
The apparatus for laser machining according to the embodiments of the invention is described below, inter alia, by way of examples with a machining head, without limiting the invention thereto, The apparatus and the method according to the embodiments of the invention can also be realised without a machining head.
The terms “laser beam” and “machining laser beam” are used synonymously. The apparatus for laser machining is also called a machining apparatus here. The terms “optical imaging” and/or “imaging the laser beam on the workpiece” in the present case mean that the laser beam is directed onto the workpiece, for example by refraction, reflection, diffraction, and/or beam shaping. The term “caustic” of the laser beam denotes in particular the envelope of the beam waist of the laser beam and/or the change in the diameter of the laser beam perpendicular to the direction of propagation thereof in the region of the beam waist thereof. The terms “width of the cutting gap” and “cutting gap width” are used synonymously. The position of the focus is also called the focus position or focus location here. The term “upper half of the cutting gap” means the half of the cutting gap that is arranged on the surface of the workpiece that faces the machining laser beam and/or the apparatus for the laser machining. The term “lower half of the cutting gap” means the half of the cutting gap that is arranged on the surface of the workpiece that faces away from the machining laser beam and/or the apparatus for the laser machining. The term “above the cutting gap” means the region adjacent to the cutting gap that is arranged on the surface of the workpiece that faces the machining laser beam and/or the apparatus for the laser machining. The above also applies analogously to modifications of these terms.
Furthermore, where value ranges are described here, the specification of a broad range with narrower alternative or preferred ranges is also considered to disclose ranges that can be formed by any combination of specified lower range limits and specified upper range limits.
In the present example, the apparatus 10 has a machining head 11. A machining laser source 14a for generating a machining laser beam 16 is coupled laterally thereto via a transport fibre 14b. In alternative examples, the coupling of the laser source can also take place at another point on the machining head. The machining laser source 14a has a power of approximately 6 kW and generates the machining laser beam 16 in a spectral range which includes a wavelength of 1070 nm. However, other powers and/or spectral ranges suitable for the laser machining, in particular laser cutting, can also be selected.
In the present example, a dichroic mirror 17 is provided as an optical element in the machining head 11, which diverts the machining laser beam 16 in the direction of an exit opening 19 of the machining head. The dichroic mirror 17 is at least partially transparent to a beam emitted by the workpiece 12.
In the region of the machining head 11 between the dichroic mirror 17 and the exit opening 19, a focusing lens 18 is provided as a further optical element, which can be displaced parallel to the direction of propagation of the machining laser beam 16 to adjust the position of the focus of the machining laser beam, e.g., by means of a holder. The focusing lens 18 is at least partially transparent to a beam emitted by the workpiece 12.
A detector 20 is also provided in the machining head 11 in such a way that the dichroic mirror 17 is located between the focusing lens 18 and the detector 20. The detector 20 serves as a device for monitoring at least one geometric parameter of a cutting gap generated in the workpiece 12 with the machining laser beam 16 and coaxially records the laser machining zone during the laser machining. The recordings obtained in this way are reproduced at the moment of laser machining, i.e., live, on a monitor (not shown) and optionally saved. In the present example, the detector 20 is designed as a high-resolution video camera which is at least partially sensitive to the beam emitted by the workpiece 12. If, for example, a workpiece made of metal such as stainless steel is processed, the inherent emission during laser machining is thermal and lies in the near-infrared range of 760 to 2500 nm. Since the inherent emission of the workpiece is observed in the present example, the detector 20 is at least partially sensitive to the corresponding wavelength range.
In alternative examples, the detector 20 can also be arranged elsewhere in or outside of the machining head 11 and detect a beam emitted and/or reflected by the workpiece 12 there. In further examples, other radiation-sensitive detectors, such as photodiodes, can be provided. If, alternatively or additionally, the workpiece is illuminated by means of an illumination source or an illuminating laser beam, in particular to clearly see the cutting gap width, and if the beam reflected by the workpiece is detected, the detector is (also) at least partially sensitive thereto and is the at least one optical element (also) at least partially transparent therefor.
The detector 20 and the focusing lens 18 are connected to one another in a data-conducting manner via a device 22 for regulating the monitored geometric parameter of the cutting gap. The device 22 can be implemented in a controller of the apparatus 10 for the laser machining. In the present example, the geometric parameter to be monitored and an associated target value for the regulation by an operator of the apparatus 10 are specified. For this purpose, the operator inputs the geometric parameter and the target value into the device 22 for regulating the monitored geometric parameter. Alternatively, the geometric parameter to be monitored and/or the target value for the regulation can be determined and specified by the device 22 for regulating the monitored geometric parameter or the controller.
A method for laser machining the workpiece 12 according to embodiments is shown schematically in
When the apparatus 10 is in operation, the machining laser beam 16 is generated and imaged on the workpiece with the dichroic mirror 17 and the focusing lens 18. The workpiece is machined with the machining laser beam 16, wherein the machining laser beam 16 is guided over the workpiece. In the process, a cut with a cutting gap 164 is produced in the workpiece 12. The beam produced during laser cutting by the inherent emission of the workpiece 12 reaches at least through the exit opening 19 into the machining head 11. There it penetrates the focusing lens 18 and the dichroic mirror 17, both of which are at least partially transparent to the beam of the workpiece's inherent emission. The beam from the inherent emission finally reaches the detector 20 and is recorded there by the video camera. In this way, in the present example, the width B of the cutting gap is monitored as a geometric parameter of the cutting gap 164. The video recordings obtained in this way are passed into the device 22 for regulating the monitored geometric parameter, stored, and evaluated. The video recordings can be played back on a monitor (not shown) at the moment of laser machining, i.e., live.
In the present example, the device 22 for regulating the geometric parameter of the cutting gap is used to compare the width B thereof as the geometric parameter with the predetermined target value. For this purpose, an actual value for the current cutting gap width B is determined from the images of the inherent emission recorded with the video camera. As long as the end of the cut to be produced in the workpiece 12 has not been reached, the device 22 checks whether the width B of the cutting gap corresponds to the predetermined target value. If this is the case, machining of the workpiece and monitoring of the cutting gap width are continued with the previously adjusted imaging of the machining laser beam 16. If the cutting gap width B does not correspond to the specified target value, the imaging of the machining laser beam 16 on the workpiece 12 is changed by means of the focusing lens 18 in such a way that the cutting gap width B corresponds to the desired target value. This is done by shifting the focusing lens 18 parallel to the direction of propagation of the machining laser beam 16. As a result, the position of the focus 162 of the machining laser beam 16 is adjusted in such a way that the cutting gap width B is corrected to the target value. The method with the regulation carried out in this way is continued until reaching the end of the cut to be produced.
If the method of the above example is carried out as fusion cutting, the cutting gap 164 is produced with a desired width B in that the focus 162 of the machining laser beam is adjusted and held in the lower region of the workpiece 12, as shown in
In the present example, the cutting gap 164 is observed with the video camera of the detector 20 and the cutting gap width B is monitored as a geometric parameter. For example, the cutting gap width can change in the course of the laser cutting through heating of the focusing lens 18 and/or other optical elements. If the cutting gap width B deviates from the ideal width, that is to say from the target value, the focus position is shifted by the device 22 for regulating the cutting gap width. In the method of this example, the shift of the focus position takes place by shifting the focusing lens 18. The direction in which the focus position for the cutting gap width correction is shifted can result from suitable focus positions for the respective type of laser cutting. Focus positions are suitable for the present example, as explained above for
During fusion cutting in the present example, the focus 162 is first adjusted in the lower region of the cutting gap, as shown in
The method of the above example and the regulation of the cutting gap width as a geometric parameter are carried out with the aid of the adjustable focusing lens 18. In machining heads (cutting heads) that do not have an adjustable focusing lens, the focus position can be shifted analogously with other optical elements, for example with adjustable collimation lenses or mirrors with adjustable surface curvature. For example, the dichroic mirror 17 can have a mirror surface, the curvature of which can be adjusted by means of actuators, while the focusing lens 18 is not adjustable. However, a combination of several adjustable optical elements, for example a combination of a mirror with adjustable curvature and an adjustable focusing lens, can also be used.
Furthermore, the method of the above example and the regulation of the cutting gap width can be carried out as geometric parameters not only by varying a position of the focus of the machining laser beam in the direction of propagation thereof, but alternatively or additionally also by varying at least one parameter selected from a width of the machining laser beam, a diameter of the machining laser beam, a position of at least one of the optical elements parallel to the direction of propagation of the machining laser beam, a surface curvature of at least one of the optical elements, a focal length of an optical system that includes the at least one optical element, and/or an intensity distribution of the machining laser beam, in particular an intensity distribution of the machining laser beam perpendicular to the direction of propagation thereof. An intensity distribution can be varied, for example, with static and/or dynamic beam shaping.
In a modification of the above example, an illuminating laser source (not shown) is provided on the machining head 11 in the apparatus 10 in addition to the machining laser source 14a. The illuminating laser source together with the machining laser source 14a is coupled to the transport fibre 14b in such a way that the machining laser beam 16 and the illuminating laser beam generated by the illuminating laser source are guided coaxially into and through the machining head 11 and finally coaxially through the exit opening 19. The illuminating laser source can, however, also be provided at a different position, starting from which the illuminating laser beam is guided onto the laser machining zone of the workpiece 12. The illuminating laser source has a power of approximately 1000 mW and generates the illuminating laser beam with a central wavelength within a spectral range of 973 to 979 nm, with a wavelength band of 6 nm. The focusing lens 18 and the dichroic mirror 17 are at least partially transparent to a beam in this wavelength range. The video camera of the detector 20 is at least partially sensitive to this wavelength range.
For machining a workpiece 12, the machining laser source 14a and the illuminating laser source are put into operation with the powers and spectral ranges described above. The machining laser beam and illuminating laser beam generated in this way are directed onto the workpiece 11 by means of the machining head 11. In this way, the workpiece is processed with the machining laser beam 16, as a result of which inherent emission of the workpiece is generated in the laser machining zone. In addition, the laser machining zone of the workpiece 12 is illuminated by the illuminating laser beam. The illuminating laser beam, which is at least partially reflected by the workpiece 12, strikes at least partially through the focusing lens 18 and the dichroic mirror 13 on the video camera of the detector 20. By illuminating the laser machining zone, the environment of the laser machining zone, in particular the cutting gap geometry and thus the cutting gap width, can be made particularly clearly visible. The laser machining of the workpiece 12 is thus observed and the width B of the cutting gap produced is monitored with the detector 20. The width of the cutting gap is controlled with the device 22 for regulating the geometric parameter by adjusting the focusing lens 18 in such a way that the width of the cutting gap corresponds to the target value, as explained above. In this way, the cutting gap width is kept essentially constant.
Alternatively, an actual value for the cutting gap width and the regulation thereof can be used, for the determination of which no calibrated known diameter of the circle 166 shown in
Alternatively, the crosses 169 in the example in
The actual value determinations described with reference to
The target value determination for the cutting gap width in the above example and in modifications thereof can take place on the basis of cut workpieces produced with an optimal cutting gap width and based on data and process parameters that were recorded with the detector 20 when these workpieces were produced. This can be carried out taking into account not only one type of laser machining but, alternatively or additionally, also taking into account a material of the workpiece, a thickness of the workpiece, a shape of the workpiece, a power of the machining laser source with which the machining laser beam is generated, an angle of incidence machining laser beam on the workpiece, a beam parameter product (BPP, Beam Parameter Product) of the machining laser beam, a focus diameter of the machining laser beam, and/or a divergence angle of the machining laser beam. For example, the target value can be taken from a corresponding look-up table.
The explanations of the above example and modifications thereof apply analogously to examples and embodiments in which, alternatively or additionally to the cutting gap width, other geometric parameters of the cutting gap are monitored and controlled. These include a cutting front angle of the cutting gap, a surface structure of a cut edge of the cutting gap, a roughness of a cut edge of the cutting gap, and/or a shape of the workpiece at the cutting gap. Furthermore, this includes a width of a beam reflected and/or emitted by the workpiece and/or a shape of a beam reflected and/or emitted by the workpiece. The process illumination that occurs during the laser machining process can be understood as a beam emitted by the workpiece.
Finally, should be noted that the description of the invention and the exemplary embodiments are not to be understood as Limiting in terms of a particular physical realisation of the invention. All of the features explained and shown in connection with individual embodiments of the invention can be provided in different combinations in the subject matter according to the invention to simultaneously realise the advantageous effects thereof.
The scope of protection of the present invention is given by the claims and is not limited by the features illustrated in the description or shown in the figures.
It is particularly obvious to a person skilled in the art that the invention can be used not only for laser machining systems, but also for other devices comprising lasers. Furthermore, the components of the machining apparatus for laser machining workpieces can be produced so as to be distributed over several physical products.
| Number | Date | Country | Kind |
|---|---|---|---|
| 20153052.4 | Jan 2020 | EP | regional |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2021/051474 | 1/22/2021 | WO |
