This application is the U.S. National Phase Application of PCT International Application No. PCT/EP2016/001441, filed Aug. 26, 2016, which claims priority to French Patent Application No. 1559538, filed Oct. 7, 2015, the contents of such applications being incorporated by reference herein.
The present invention relates to the field of electronics.
The present invention has particularly advantageous applications in the field of electronics for motor vehicles, and in particular in the field of ‘H-bridge’ devices and power drivers.
In ‘H-bridge’ circuits, protective measures are implemented against currents having an excessively high magnitude, termed ‘overcurrents’, for each of the power transistors.
When a transistor detects a high stress phenomenon, termed ‘overstress’, all of the transistors are turned off at the same time.
In the case of an inductive load, this involves a phase of discharging through a freewheeling diode to ground and to the positive power supply.
The inductive discharge phase in the freewheeling diodes brings about a substrate injection into the electronic circuits and means that expensive semiconductor processes have to be implemented to resist this.
The inductive discharge phase in the freewheeling diodes also brings about, on the ‘high side’ (that is to say on the side linked to the supply voltage), an increase in the supply voltage. This means that the decoupling capacitances, and therefore the cost, have to be increased.
An aspect of the present invention aims to mitigate the drawbacks of the prior art by proposing a method that makes it possible to eliminate, or in any case to very greatly reduce, freewheeling diode injection in the event of detection of a current having an excessively high magnitude, termed ‘overcurrent’, or of detection of ‘thermal shutdown’ phenomena, that is to say switching off due to excessive temperature.
To this end, an aspect of the present invention relates, in its broadest sense, to a method for limiting the current in an ‘H-bridge’ device including a plurality of transistors, which method is noteworthy in that it includes the following steps:
Thus, the method according to an aspect of the present invention makes it possible to eliminate or very greatly reduce freewheeling diode injection in the event of detection of a current having an excessively high magnitude, termed ‘overcurrent’, or of a thermal phenomenon, termed ‘thermal shutdown’.
The method according to an aspect of the present invention makes it possible to implement a semiconductor process with low immunity to substrate injection.
The method according to an aspect of the present invention also makes it possible to reduce phenomena, termed ‘overshoot’, of the supply voltage, and therefore to reduce the decoupling capacitances.
The method according to an aspect of the present invention also makes it possible to reduce the size of the freewheeling diodes.
According to one embodiment, said failure is linked to a current having an excessively high magnitude, termed ‘overcurrent’.
According to one embodiment, said failure is linked to a thermal phenomenon.
According to one embodiment, said detection, on the transistors opposite said transistor, of the discharge of the accumulated output power is performed by a current detector on the opposite transistors.
According to one embodiment, said detection, on the transistors opposite said transistor, of the discharge of the accumulated output power is performed by a voltage detector on the opposite transistors.
An aspect of the present invention also relates to a system for limiting the current in an ‘H-bridge’ device including a plurality of transistors, which system is noteworthy in that it includes means for:
Aspects of the invention will be better understood with the aid of the description, given hereinafter purely by way of explanation, of one embodiment of the invention, with reference to the figures, in which:
The present invention, as illustrated in
In one embodiment, the failure is linked to a current having an excessively high magnitude, termed ‘overcurrent’.
In one embodiment, the failure is linked to a thermal phenomenon.
In one embodiment, the detection, on the transistors opposite said transistor T, of the discharge of the accumulated output power is performed by a current detector on the opposite transistors.
In one embodiment, the detection, on the transistors opposite said transistor T, of the discharge of the accumulated output power is performed by a voltage detector on the opposite transistors.
An aspect of the present invention also relates to a system for limiting the current in an ‘H-bridge’ device including a plurality of transistors T1, T2, T3, T4. This system includes means for:
A description is given hereinafter of one exemplary embodiment of the present invention. Consideration is given to a device including four transistors T1, T2, T3 and T4. If a current having an excessively high magnitude is detected in the transistor T1, the transistor T1 is turned off, but the transistors T2, T3 and T4 are not turned off. To this end, detection is awaited, on the transistors opposite the transistor T1, of the discharge of the accumulated output power. It is only at this moment that the other transistors are turned off, in contrast to the prior art solutions. This method is similar if a current having an excessively high magnitude is detected in the transistor T2, T3 or T4.
Thus, the method according to an aspect of the present invention makes it possible to eliminate or very greatly reduce freewheeling diode injection in the event of detection of a current having an excessively high magnitude, termed ‘overcurrent’, or of a thermal phenomenon outlined above.
The method according to an aspect of the present invention makes it possible to implement a semiconductor process with low immunity to substrate injection.
The method according to an aspect of the present invention also makes it possible to reduce phenomena, termed ‘overshoot’, of the supply voltage, and therefore to reduce the decoupling capacitances.
An aspect of the present invention is applicable to all types of circuits having ‘high sides’ or circuits having a plurality of MOSs with freewheeling diode phases.
The invention is described above by way of example. It is understood that those skilled in the art are able to produce various variants of the invention without however departing from the scope of the patent.
Number | Date | Country | Kind |
---|---|---|---|
15 59538 | Oct 2015 | FR | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2016/001441 | 8/26/2016 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2017/059939 | 4/13/2017 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5111378 | Nowak et al. | May 1992 | A |
5642247 | Giordano | Jun 1997 | A |
7457136 | Ozaki | Nov 2008 | B2 |
9245540 | Agness | Jan 2016 | B1 |
9417983 | Metzner | Aug 2016 | B2 |
9568560 | Pasqualetto | Feb 2017 | B2 |
20040257737 | Lepage | Dec 2004 | A1 |
20080253047 | Takihara | Oct 2008 | A1 |
20100097737 | Hirata | Apr 2010 | A1 |
20110096581 | Hallak | Apr 2011 | A1 |
20130083434 | Barth | Apr 2013 | A1 |
20140028233 | Lee | Jan 2014 | A1 |
20140028234 | Lee et al. | Jan 2014 | A1 |
20140077736 | Donner et al. | Mar 2014 | A1 |
Number | Date | Country |
---|---|---|
201846068 | May 2011 | CN |
202373968 | Aug 2012 | CN |
103872998 | Jun 2014 | CN |
4024160 | Feb 1991 | DE |
1467462 | Oct 2004 | EP |
2112051 | Oct 2009 | EP |
101353102 | Jan 2014 | KR |
101353234 | Jan 2014 | KR |
03077322 | Sep 2003 | WO |
2009156230 | Dec 2009 | WO |
Entry |
---|
International Search Report and Written Opinion for International Application No. PCT/EP2016/001441, dated Oct. 11, 2016, 7 pages. |
English translation of the Written Opinion for International Application No. PCT/EP2016/001441, dated Oct. 11, 2016, 5 pages. |
Number | Date | Country | |
---|---|---|---|
20180294634 A1 | Oct 2018 | US |