Claims
- 1. A method of constructing a card with embedded electronic circuitry comprising:
printing first card graphics on a first surface of a first core member; printing second card graphics on a first surface of a second core member; milling corresponding cavities in a second surface of the first core member and a second surface of the second core member; installing electronic components within the corresponding cavities; aligning the second surface of the first core member with the second surface of the second core member; placing a first overlay over the first surface of the first core member; placing a second overlay over the first surface of the second core member; laminating together the first overlay, the first core member, the second core member and the second overlay.
- 2. The method of claim 1 wherein the first overlay, the first core member, the second core member and the second overlay are laminated together using a hot lamination process.
- 3. A method of constructing a card with embedded electronic circuitry comprising:
printing first card graphics on a first surface of a first core member; printing second card graphics on a first surface of a second core member; laminating a first overlay to the first surface of the first core member; laminating a second overlay to the first surface of the second core member; milling a cavity in a second surface of the first core member; installing electronic components in the cavity; aligning the second surface of the first core member with a second surface of the second core member; laminating together the first and second core members.
- 4. The method of claim 3 further comprising, prior to milling the cavity:
laminating a first overlay to the first surface of the first core member; laminating a second overlay to the first surface of the second core member.
- 5. The method of claim 4 wherein the first and second core members are laminated together using a cold lamination process.
- 6. The method of claim 3 further comprising, prior to laminating together the first and second core members:
placing a first overlay over the first surface of the first core member; placing a second overlay over the first surface of the second core member; laminating together the first overlay, the first core member, the second core member and the second overlay.
- 7. The method of claim 6 wherein the first overlay, the first core member, the second core member and the second overlay are laminated together using a hot lamination process.
- 8. A method of constructing a card with embedded electronic circuitry comprising:
milling a first cavity in a first surface of a first core member; milling a second cavity in a first surface of a second core member; installing electronic components within a space defined by the first and second cavities; aligning the first surface of the first core member with the first surface of the second core member; laminating together the first and second core members; reducing the laminated first and second core members to a thickness of less than 30 mils.
- 9. The method of claim 8 further comprising:
printing first card graphics on a first surface of a third core member; printing second card graphics on a first surface of a fourth core member; placing a first overlay over the first surface of the third core member; placing a second overlay over the first surface of the fourth core member; laminating together the first overlay, the third core member, the laminated first and second core members, the fourth core member and the second overlay.
- 10. The method of claim 8 further comprising:
printing first card graphics on a second surface of the first core member; printing second card graphics on a second surface of the second core member; placing a first overlay over the second surface of the first core member; placing a second overlay over the second surface of the second core member; laminating together the first overlay, the laminated first and second core members and the second overlay.
- 11. The method of claim 8 further comprising:
reverse printing first card graphics on a first surface of a first overlay; reverse printing second card graphics on a first surface of a second overlay; aligning the first surface of the first overlay with a second surface of the first core member; aligning the first surface of the second overlay with a second surface of the second core member; laminating together the first overlay, the laminated first and second core members and the second overlay.
RELATED APPLICATIONS
[0001] This is a continuation-in-part of co-pending U.S. patent application Ser. No. 10/167,259 filed Jun. 11, 2002, the disclosure of which is hereby incorporated by reference.
[0002] This application is also related to U.S. patent application Ser. No. 09/767,317 filed Jan. 22, 2001, which is a continuation-in-part of U.S. patent application Ser. No. 09/066,799 filed Apr. 24, 1998, now U.S. Pat. No. 6,176,430, which is a continuation-in-part of U.S. patent application Ser. No. 08/758,640 filed Nov. 27, 1996, now U.S. Pat. No. 5,856,661, which is a continuation-in-part of U.S. patent application Ser. No. 08/582,601 filed Jan. 3, 1996, now U.S. Pat. No. 5,608,203, which is a continuation of U.S. patent application Ser. No. 08/250,801 filed May 27, 1994, abandoned, which is a continuation-in-part of U.S. patent application Ser. No. 08/197,218, filed Feb. 16, 1994, now U.S. Pat. No. 5,434,405 which is a continuation-in-part of U.S. patent application Ser. No. 07/834,490, filed Feb. 12, 1992, now U.S. Pat. No. 5,412,199. The disclosures of these earlier applications are also incorporated by reference.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
10167259 |
Jun 2002 |
US |
Child |
10300168 |
Nov 2002 |
US |