1. Field of the Invention
This invention relates to a method for making chip resistor components.
2. Description of the Related Art
U.S. Patent Application Publication No. 2003/0156008 discloses a resistor including a substrate, a pair of upper electrode layers formed on an upper surface of the substrate, a resistor layer formed on the upper surface of the substrate and connected to the upper electrode layers, a protective layer covering the resistor layer, a pair of L-shaped first side electrode layers formed on two sides and end portions of a lower surface of the substrate and contacting the respective upper electrode layer, a pair of L-shaped second side electrode layers covering respectively the first side electrode layer, a pair U-shaped first plating layers covering respectively the second side electrode layers and the upper electrode layers, and a pair of U-shaped second plating layers covering respectively the first plating layers. The aforesaid conventional resistor has a relatively complex structure. Hence, there is a need to develop a method for making a resistor component that is simple and cost effective.
The object of the present invention is to provide a method for making chip resistor component that is simple and cost effective.
According to the present invention, a method for making chip resistor components comprises: (a) forming a plurality of intersecting strip-like first and second notches in a dielectric substrate so as to form a plurality of resistor-forming strips separated by the first notches; (b) forming a pair of spaced apart strip-like upper electrodes on an upper surface of each of the resistor-forming strips, and a pair of spaced apart strip-like lower electrodes on a lower surface of each of the resistor-forming strips, the upper and lower electrodes being substantially parallel to the first notches; (c) forming a strip-like resistor film on the lower surface of each of the resistor-forming strips such that the resistor film extends between and is brought into contact with the lower electrodes; (d) forming a strip-like insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming a strip-like insulating shield layer on the insulator layer; (g) cleaving the dielectric substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of strip-like side electrodes on two opposite sides of each of the semi-finished products such that each of the side electrodes extends between and is brought into contact with an adjacent one of the upper electrodes and an adjacent one of the lower electrodes; and (i) cleaving each of the semi-finished products along the second notches so as to form a plurality of resistor blanks.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment of this invention, with reference to the accompanying drawings, in which:
The method for making chip resistor components includes: (a) forming a plurality of intersecting strip-like first and second notches 602, 603 in a dielectric substrate 6 so as to form a plurality of resistor-forming strips 600 separated by the first notches 602 (see
In this embodiment, the method further includes forming a first plating layer 371 on each of the resistor blanks 200 after step (i) such that the first plating layer 371 covers an adjacent one of the upper electrodes 605, an adjacent one of the side electrodes 610, and an adjacent one of the lower electrodes 604 (see
In this embodiment, the method further includes forming a second plating layer 372 on each of the resistor blanks 200 such that the second plating layer 372 covers the first plating layer 371, and a third plating layer 373 on each of the resistor blanks 200 such that the third plating layer 373 covers the second plating layer 372 (see
Preferably, the dielectric substrate 6 is made from a material, such as a glass, a ceramic material, or an epoxy resin.
Preferably, the first and second notches 602, 603 have a depth relative to the dielectric substrate 6 in the order of micrometers.
Preferably, formation of the upper electrodes 605 in step (b) is conducted through printing techniques.
Preferably, formation of the lower electrodes 604 in step (b) is conducted through one of printing techniques, foil laminating techniques, sputtering techniques, and coating techniques.
Preferably, formation of the strip-like resistor film 606 in step (c) is conducted through one of printing techniques, foil laminating techniques, and sputtering techniques.
Preferably, formation of the hole pattern 500 in step (e) is conducted using laser techniques.
Preferably, formation of the strip-like side electrodes 610 in step (h) is conducted using a silver paste or through sputtering techniques.
In this embodiment, formation of the strip-like side electrodes 610 is conducted using a silver paste.
In this embodiment, the first, second, and third plating layers 371, 372, 373 are made of copper, nickel, and tin, respectively.
The method of this invention is capable of simplifying the processing steps and lowering the operating costs during mass production of the resistor components.
With the invention thus explained, it is apparent that various modifications and variations can be made without departing from the spirit of the present invention. It is therefore intended that the invention be limited only as recited in the appended claims.