Removable protective closure systems for pharmaceutical products are generally known. U.S. Pat. No. 5,284,263 discloses a removable protective closure system for use with vials containing unit doses of medicaments, which is hereby incorporated by reference in its entirety. The closure system includes a rubber stopper, a cap seal and an overcap. Such closure systems are designed to be easily removed by a flipping motion of the thumb while the vial is held in one hand. The closure system also provide for pharmaceutical product identification which can be used at the point of application to ensure that the proper identification and other information is communicated to the nurse or other healthcare personnel.
Typically, production of molded plastic overcaps 100′ (
In order to manufacture multiple molded plastic overcaps 100′, multiple tooling component stacks 10′ are assembled as described above. The resin injectors 34′ of each stack are inserted within the runner strip plate tunnels 40′. Each resin injector 34′ releases heated plastic resin 28′ which flows through the runner plate tunnel 38′ and the cavity plate tunnel 36′, passing through the gate 24′ and filling the mold area cavity 22′. The resin injectors 34′ are then removed and the plastic resin 28′ is left to cool. Cooling is accelerated using water lines 30′ that run through the cavity plate 20′ and the core 12′. Cool water is circulated through the water lines 30′ to absorb heat from the cavity plate 20′ and the core 12′ which have absorbed heat from the heated resin 28′. Upon sufficient cooling, the runner strip plate 32′ and the runner plate 42′ are removed from engagement with the cavity plate 20′. Due to the tapered walls of the runner plate tunnel 38′, this movement exerts stress on the excess solidified resin that has collected within the runner plate tunnel 38′ and the cavity plate tunnel 36′. The excess resin breaks off at the point of its smallest cross-sectional area at the gate 24′, thereby severing the excess resin from the molded plastic overcap 100′. The excess resin is then collected to be recycled and subsequently reused. The cavity plate 20′ is then removed from engagement with the strip plate 16′ exposing a top side 102′ of the molded plastic overcap 100′. The strip plate 16′ is then removed from engagement with the core plate 14′, whereupon the strip plate bushing 18′ pushes upon a bottom side 106′ of an outside edge 104′ of the molded plastic overcap 100′ in order to remove the molded plastic overcap 100′ from the top of the core 12′. Pressurized air from an air line 32′ is also directed at the molded plastic overcap 100′ to facilitate its release from the top of the core 12′. The molded plastic overcap 100′, now released from the mold area cavity 22′, falls into a collection receptacle (not shown).
There are several drawbacks inherent to the cold runner top-gated molding process of the prior art. First, because of the location of the gate 24′, when the excess resin is removed, a small protrusion 103′ of excess resin remains at the breakage point extending outwardly from the top side 102′ of the molded plastic overcap 100′. The protrusion 103′ presents problems when placing a label on or otherwise marking the top of the molded plastic overcap 100′. Second, the design of the cold runner top-gated mold technology requires the presence of the excess resin (known as a runner) during the production of each molded plastic overcap 100′. This necessitates the removal and recycling of the excess resin for its subsequent reuse. This process inevitably results in the loss of plastic resin. Third, because the process requires cooling time and subsequent removal of the excess resin runner before a finished molded plastic overcap 100′ is produced, the cycle time for the cold runner top-gated mold technology is relatively lengthy.
The present invention comprises a process for making molded plastic overcaps using a hot runner back-gated mold which seeks to remedy the drawbacks of the cold runner top-gated mold technology. First, because the gate is now located at the back of the mold area, the small protrusion of excess resin gate vestige is now located on the back side of the molded plastic overcap, instead of the top side, thereby enabling the overcap to be manufactured with a flat top free from blemishes, making it easier to affix labels, custom logos, and other identification devices such as electronic or magnetic devices to or otherwise mark the top side of the overcap. Second, because the plastic resin remains in liquid form during the entire molding process, no runners are formed, and, consequently, there is no excess resin to be recycled, resulting in material savings. Third, because the process requires no cooling time and no evacuation of excess resin runners, the hot runner back-gated mold can be run at higher speeds, cutting the cycle time to less than half that of the cold runner top-gated mold.
Briefly stated, in one aspect, the present invention comprises a mold tool stack for making plastic overcaps from heated resin. The mold tool stack comprises a core, a cavity plate, and a resin passageway. The cavity plate is located above the core. One of the core and the cavity plate is axially movable relative to the other of the core and the cavity plate to allow the core and the cavity plate to engage with each other when the mold tool stack is in a closed position and to allow the core and the cavity plate to separate from each other when the mold is in an open position. When the mold tool stack is in the closed position, a cavity is formed between a top surface of the core and a portion of a bottom surface of the cavity plate. The portion of the bottom surface of the cavity plate corresponds to a top side of the plastic overcap. The top surface of the core corresponds to a bottom side of the plastic overcap. The portion of the bottom surface of the cavity plate is substantially flat and blemish-free. A resin passageway is located within the core with a gate in the top surface of the core. The gate has a valve proximate the top surface of the core to regulate heated resin flowing out of the resin passageway and into the cavity. The valve is proximate the top surface of the core. This allows for minimal wasted resin between the valve and the plastic overcap and further allows for a gate mark to be present on the bottom side of the plastic overcap to allow for the top side of the plastic overcap to be substantially flat and blemish-free.
In another aspect, the present invention comprises a method for making a plastic overcap using a mold tool stack. The mold tool stack has a core and a cavity plate forming a cavity therebetween. The core forms a bottom of the cavity and the cavity plate forms a top of the cavity, such that the top of the cavity corresponds to a top side of the plastic overcap and the bottom of the cavity corresponds to a bottom side of the plastic overcap. The core has a resin passageway therein with a gate in a top surface of the core. The gate has a valve proximate the top surface of the core to regulate an amount of resin flowing out of the resin passageway and into the cavity. One of the core and the cavity plate is axially movable relative to the other of the core and the cavity plate. The steps of the mold method are as follows. First, the mold tool stack is closed such that the core is in contact with the cavity plate to form the cavity therebetween. Second, the valve is opened to allow resin to enter the cavity. Third, the valve is closed to stop the flow of resin into the cavity once a desired amount of resin has entered the cavity. Fourth, the resin within the cavity is allowed to cool to form the plastic overcap. Fifth, the mold tool stack is opened to allow removal of the plastic overcap from within the mold tool stack, such that the plastic overcap produced has a small protrusion of excess resin on the bottom side due to the proximity of the valve to the top surface of the core. This allows the top side of the plastic overcap to be blemish-free to facilitate placement of labels and other markings thereon.
The foregoing summary, as well as the following detailed description of preferred embodiment of the invention, will be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there is shown in the drawings an embodiment which are presently preferred. It should be understood, however, that the invention is not limited to the precise arrangements and instrumentalities shown.
In the drawings:
a is a sectional elevational view of the tooling component stack of
b is a sectional elevational view of the tooling component stack of
c is a sectional elevational view of the tooling component stack of
d is a sectional elevational view of the tooling component stack of
e is a sectional elevational view of the tooling component stack of
Certain terminology is in the following description for convenience only and is not limiting. The words “right”, “left”, “upper”, and “lower” designate directions in the drawings to which reference is made. The terminology includes the words above specifically mentioned, derivatives thereof, and words of similar import.
Referring to the drawings in detail, wherein like numerals indicate like elements throughout, there is shown in
The strip plate 16 is in facing engagement with the core plate 14. The strip plate 16 is movable in a vertical direction and has an opening therethrough to accommodate the core 12 when in facing engagement with the core plate 14. The strip plate bushing 18 is maintained within the opening in the strip plate 16 in order to ensure a sealing engagement with the core 12.
The cavity plate 20 is in facing engagement with the strip plate 16. The cavity plate 20 has an indentation in a bottom surface in order to accommodate the amount of the core 12 that extends beyond a top surface of the strip plate 16. The cavity plate 20 is movable in the vertical direction.
The tool stack 10 is in a closed position (
When in the closed position, a small mold area cavity 22 is formed by the tool stack 10 between a portion of the bottom surface of the cavity plate 20 and a top surface of the core 12, within which a molded plastic overcap 100 is formed for each cycle of the tool stack 10. The portion of the bottom surface of the cavity plate 20 corresponds to a top side 102 of the plastic overcap 100 (
Within the core 12 is a resin passageway 26 leading from a resin source (not shown) to the mold area cavity 22. The resin passageway 26 is preferably located through the center of the core 12. A plastic resin 28 enters the mold area cavity 22 from the resin passageway 26 through a gate 24 at the top surface of the core 12, preferably in the center of the top surface of the core 12. A valve 52 is within the gate 24 to regulate the amount of resin 28 flowing out of the resin passageway 26 and into the mold area cavity 22. The valve 52 is proximate the top surface of the core 12 to allow for minimal wasted resin 28 between the valve 52 and the plastic overcap 100. The placement of the valve 52 proximate the top surface of the core 12 further allows for a gate mark to be present on the bottom side 106 of the plastic overcap 100 to allow the top side 102 of the plastic overcap 100 to be substantially flat and blemish-free. Heating coils 50 are preferably located around the resin passageway 26 up to the gate 24 in order to keep the resin 28 within the resin passageway 26 heated at all times throughout a mold cycle.
Air jets 32 are preferably located within the strip plate bushing 18, although it is within the spirit and scope of the present invention for the air jets 32 to be located within the core 12. Air is forcibly ejected from the air jets 32 and directed against the bottom side 106 of the plastic overcap 100 to facilitate removal of the plastic overcap 100 from within the tool stack 10 at the end of the mold cycle (
At least one tube 30 is located within the cavity plate 20 through which cool water or other fluid flows in order to keep the cavity plate 20 cool and subsequently facilitate the cooling of the resin 28 within the mold area cavity 22 during the mold cycle. Although only one tube 30 is portrayed, it is within the spirit and scope of the present invention that there be a network of tubes 30 located within the cavity plate 20 in order to more evenly and more quickly cool the resin 28 within the mold area cavity 22 at the end of the mold cycle.
In operation, referring to
Referring now to
The hot runner back-gated mold tool stack 10 of the present invention overcomes several problems inherent in the prior art. First, the location of the gate 24 allows the mold area 22 to be filled with resin 28 from the back, causing the gate mark 103 of excess resin 28 to form on the bottom side 106 of the plastic overcap 100. This allows the top side 102 to be free from blemishes so that labels and other markings can be more easily affixed thereto. Second, because the resin 28 remains heated and in liquid form within the resin passageway 26 and because the valve 52 cuts off the supply of resin 28 immediately proximate the mold area cavity 22, there are no excess resin runners to be recycled and reused, resulting in material savings. Third, because there is little required cooling time and no evacuation of excess resin runners required, the tool stack 10 can be run at higher speeds than was possible in the prior art, resulting in cycle times of the present invention that are less than half those of the prior art.
It will be appreciated by those skilled in the art that changes could be made to the embodiment described above without departing from the broad inventive concept thereof. It is understood, therefore, that this invention is not limited to the particular embodiment disclosed, but it is intended to cover modifications within the spirit and scope of the present invention.
This patent application is a Divisional of Co-pending U.S. patent application Ser. No. 10/619,243, filed Jul. 14, 2003, which claims priority to U.S. Patent Application No. 60/395,585, filed Jul. 12, 2002, entitled “Method For Making Plastic Overcaps Using Hot Runner Back-Gated Mold Technology”, the disclosures of which are incorporated herein by reference.
Number | Date | Country | |
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60395585 | Jul 2002 | US |
Number | Date | Country | |
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Parent | 10619243 | Jul 2003 | US |
Child | 11069151 | Mar 2005 | US |