The present invention relates to a method for making shoes, and more particularly, to an improved method for making shoes by using ultra-sonic conductive mold to securely attach the connection to the top portion of the shoes.
A conventional way to make shoes is shown in
The present invention intends to provide a method for making shoes by using ultra-sonic to vibrate the mold to generate heat to securely connect and shrink the connection member and the outsole to the top portion of the shoe to eliminate the drawbacks happened in the conventional way.
The present invention relates to a method for making shoes and comprises a first mold made of stiff material and a second mold. The second mold includes a concavity and the shoe is received in the cavity. The shoe comprises a top portion, a connection member and an outsole. The connection member and the outsole are connected to the top portion and the second mold transmits ultra-sonic thermo energy to the connection member and the outsole.
The primary object of the present invention is to provide a method for making shoes and the method reduces defective products when connecting the connection member and the outsole to the top portion of the shoes.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
Referring to
A shoe 20 comprises a top portion 201, a connection member 202 and an outsole 203. The top portion 201 includes a bottom 2011 and a vamp 2012. The connection member 202 and the outsole 203 are mounted to the bottom 2011 of the top portion 201. The connection member 202 and the outsole 203 are made of thermo-plastic material.
A second mold 30 has a concavity and the shoe 20 is received in the cavity. The second mold 30 is electrically connected with an ultra-sonic generating device (not shown) and is able to transmit ultra-sonic thermo energy to the connection member 202 and the outsole 203. The second mold 30 includes an ultra-sonic wave transmittal portion 301 and an ultra-sonic wave non-transmittable portion 302.
The ultra-sonic generating device vibrates the second mold 30 at a frequency range between 15, 000 to 20, 000 times per second which make the second mold 30 to transmit ultra-sonic thermo energy to the connection member 202 and the outsole 203. The thermal energy properly shrinks and melts the connection member 202 and the outsole 203, and the connection member 202 and the outsole 203 arc securely mounted to the bottom 2011 of the top portion 201. Therefore, when stitching, there will be no lumps formed on the connection member 202 and the outsole 203.
By the method of the present invention, the connection member 202 and the outsole 203 are perfectly matched with the top portion 201 and the method makes the stitching processes be easily and efficiently. There will be no lumps or gaps formed between the connection member 202 and the top portion 201.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.