Claims
- 1. A method for making a moldable silicone composition convertible upon cure to conductive silicone parts having a volume resistivity (milliohms-cm) value of about 2 or less comprising,
- (1) incrementally adding silver powder to a one part heat curable silicone fluid mixture while it is being agitated at a rate sufficient to maintain a substantially uniform mixture, and
- (2) continuing to incrementally add the silver powder to the resulting silicone fluid- silver powder blend while being agitated until there is obtained a moldable material capable of being injected into a hot mold with pressures up to about 20,000 psi, which injection moldable material comprises by weight, (A) about 60% to about 90% of silver powder having an average diameter of about 0.5 to about 100 micrometers, and (B) about 10% to about 40% of a one part heat curable silicone fluid mixture comprising by weight,
- (i) 100 parts of a vinyl containing polydiorganopolysiloxane fluid,
- (ii) and 1 to 20 parts of a siloxane hydride fluid, and
- (iii) an effective amount of an inhibited platinum catalyst.
- 2. A method in accordance with claim 1, where the moldable blend of silver powder and one part heat curable silicone fluid mixture is made by blending a mixture comprising silver powder, vinyl containing polydiorganopolysiloxane fluid and inhibited platinum catalyst with a cross linker comprising a siloxane hydride fluid.
- 3. A method in accordance with claim 1, where the vinyl containing polydiorganopolysiloxane fluid is a vinyl containing poplydimethylsiloxane fluid.
- 4. A method in accordance with claim 1, where the siloxane hydride fluid is a coupler having terminal dimethylhydrogensiloxy units.
- 5. A method in accordance with claim 1, where the inhibited platinum catalyst is an inhibited reaction product of chloroplatinic acid and tetramethyldivinyldisiloxane.
Parent Case Info
This application is a divisional of co-pending application Ser. No. 08/806,200, filed Feb. 26, 1997.
US Referenced Citations (19)
Divisions (1)
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Number |
Date |
Country |
Parent |
806200 |
Feb 1997 |
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