Claims
- 1. A method comprising:applying a beam of radiant energy to a first side of a portion of a workpiece, said radiant energy forming a protrusion at the location where said radiant energy is applied to said workpiece; etching said workpiece to form a groove where said radiant energy was applied to said workpiece; and separating said workpiece into separate regions along said groove.
- 2. Method of claim 1 wherein said beam is a laser beam and said workpiece contains silica.
- 3. Method of claim 1 wherein said workpiece is glass.
- 4. Method of claim 1 wherein said workpiece is glass-ceramic.
- 5. Method of claim 1 wherein said act of etching comprises applying an aqueous acidic solution comprising fluoride ions to said workpiece.
- 6. Method of claim 1 wherein said workpiece is formed into a substrate, said method further comprising the acts of applying a magnetic layer to said substrate.
- 7. Method of claim 6 further comprising the acts of applying an underlayer between said substrate and said magnetic layer, and forming a protective layer on said magnetic layer.
- 8. Method of claim 1 wherein at least a portion of said groove has a sloped wall.
- 9. Method of claim 8 further comprising forming a chamfer at an edge of at least one of said regions, wherein said sloped wall forms at least a portion of said chamfer.
- 10. Method of claim 1 further comprising polishing said workpiece prior to said step of applying.
- 11. Method of claim 10 wherein the periphery of said workpiece is separated from a central portion of said workpiece, and wherein polishing artifacts present at the periphery of said workpiece are not present in the central portion of said workpiece.
- 12. Method of claim 1 further comprising the act of applying a protective layer to said workpiece prior to said act of applying.
- 13. Method of claim 12 wherein said protective layer protects said workpiece from exposure to an etchant during said act of etching.
- 14. Method of claim 1 wherein the etch rate of said protrusion is greater than the etch rate of the remainder of said workpiece.
Parent Case Info
This application is a continuation in part of U.S. patent application Ser. No. 09/391,139, filed by Hsieh et al. on Sep. 7, 1999, incorporated herein by reference.
This application incorporates by reference U.S. patent application Ser. No. 09/390,887, entitled “Texturing of a Landing Zone on Glass-Based Substrates by a Chemical Etching Process”, filed by Andrew Homola Sep. 7, 1999.
This application also incorporates herein by reference U.S. patent application Ser. No. 09/391,140, entitled “Method for Manufacturing a Magnetic Disk Including a Glass Substrate and the Resulting Substrate” filed by Homola et al. on Sep. 7, 1999.
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/391139 |
Sep 1999 |
US |
Child |
09/407630 |
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US |