This application claims priority to Chinese Patent Application No. 104127935 filed on Aug. 26, 2015, the contents of which are incorporated by reference herein.
The subject matter herein generally relates to a method for manufacturing a coil loading board.
A wireless charging module is always configured in more and more electrical devices for wireless charging. The wireless charging module includes a loading board and a coil configured on the loading board. Generally, a plurality of through holes and grooves are formed through the loading board for receiving the coiling therein.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure. The description is not to be considered as limiting the scope of the embodiments described herein.
The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
At block 101, referring to
At block 102, referring to
The groove 14 can be rectangular and is located at a center of the first plate 10. The first plate 10 has an axis L which is coincident with an axis of the groove 14 and the first through hole 12. Specifically, the groove 14 is penetrates through a center of the first slot 11 to divide the first slot 11 into a first zone A and a second zone B. The first slot 11 is symmetrical about the groove 14.
In the illustrated embodiment, the groove 14, the first slot 11, the first through hole 12 and the first connection holes 13 can be defined by die cutting machine. A depth of the first slot 11, the first through hole 12, the first connection holes 13 and the groove 14 are equal to a thickness of the first plate 10. The first slot 11 includes a series of rounding gaps spaced from each other. The rounding gaps each surround an adjacent gap one after another. Specifically, the first slot 11 includes a first gap 111, a second gap 112, a third gap 113, a fourth gap 114, a fifth gap 115, a sixth gap 116, a seventh gap 117, a eighth gap 118 and a ninth gap 119 arranged from inside to outside. Further, the first gap 111, the second gap 112 and the third gap 113 together form a first group 120. A perimeter size of the first gap 111 is larger than a size of the second gap 112, and the perimeter size of the second gap 112 is larger than a perimeter size of the third gap 113. Perimeter sizes of the rounding gaps are arranged in that manner. The fourth gap 114, the fifth gap 115 and the sixth gap 116 together form a second group 130. The seventh gap 117, the eighth gap 118, and the ninth gap 119 together form a third group 140. A distance between the first group 120 and the second group 130 is equal to a distance between the second group 130 and the third group 140. In each group, a distance between the two adjacent gaps is the same, and is less than the distance between two adjacent groups. Each gap communicates with the groove 14 and is symmetrical about the groove 14.
The first through hole 12 is configured at an outer end of the first slot 11. The first connection holes 13 is configured between the first slot 11 and the first through hole 12. An end of the ninth gap 119 close to the first through hole 12 extends through the first connection hole 13 to communicate with the first through hole 12. The first connection hole 13 is configured for coupling to a circuit.
At block 103, referring to
At block 104, referring to
The second slot 21, the second through hole 22 and the second connection hole 23 can be defined by die cutting machine. A depth of the second slot 21, the second through hole 22 and the second connection holes 23 is equal to a thickness of the second plate 20. The second slot 21 is a continuous rounding gap. While the second plate 20 is fixed with the first plate 10, the second slot 21 overlaps with the gaps of the first slot 11 in serious from inside to outside continuously, and connects two adjacent gaps of the first slot 11 at the groove 14 of the first plate 10. The second through hole 22 is configured at an outer end of the second slot 21 and is located corresponding to the first through hole 12. There are four second connection holes 23. Two of the second connection holes 23 also named as outer connection holes 231 are corresponding to the first connection holes 13 and are located between the second slot 21 and the second through hole 22. The other two of connection holes 23, also named as inner connection holes 232, spaced from each other are surrounded by the second slot 21 and connect with a inner end of the second slot 21. The second slot 21 begins from one of the inner connection holes 232 and an ourter end of the second slot 21 extends through one of the outer connection hole 231 to communicate with the second through hole 22.
At block 105, referring to
While the first plate 10 is fixed with the second plate 20 together, the second through hole 22 overlaps with the first through hole 12, the second connection hole 23 overlaps with the first connection hole 13. The second slot 21 overlaps with the gaps of the first slot 11 from inside to outside. Specifically, at the first zone A, the second slot 21 overlaps the second gap 112, the fourth lap 114, the sixth lap 116, the eighth lap 118 of the first slot 11; at the second zone B, the second slot 21 overlaps the first gap 111, the third gap 113, the fifth gap 115, the seventh gap 117 and the ninth gap 119 of the first slot 11.
At block 106, removing the single-side adhesive from the first plate 10.
At block 107, referring to
The third plate 30 defines a third through hole 31 and four third connection holes 32 through both sides thereof. The third through hole 31 is rectangular. A size of the third through hole 31 is larger than that of the first through hole 12 of the first plate 10. The four third connection hole 32 are spaced from each other, including two upper connection holes 321 and two lower connection holes 322. The two upper connection holes 321 are located between the two lower connection holes 322 and the third through hole 31. The upper connection holes 321 are also corresponding to both the first connection holes 13 and the outer connection holes 231. The lower connection holes 322 are corresponding to the inner connection holes 232.
At block 108, referring to
At block 109, referring to
The fourth plate 40 defines a fourth through holes 41, four fourth connection holes 42 and two connecting channels 43 through both sides thereof. The fourth through holes 41 is corresponding with the third through holes 31 of the first plate 30. The fourth connection holes 42 are configured as and corresponding to the third connection holes 32 of the third plate 30, including two upper connection holes 421 and two connection holes 422. The two upper connection holes 421 are located between two lower connection holes 322 and the fourth through hole 41. The upper connection holes 421 are also corresponding to the upper connection holes 321 of the third plate 30. The lower connection holes 422 are corresponding to the lower connection holes 322 of the third plate 30. The connecting channels 43 respectively extends through two diagonal the upper connection holes 421 and the lower connection holes 422 to communicate with thereof.
At block 110, referring to
In the illustrated embodiment, at block 106, selectively including cutting the second plate 20 along the first slot 11 of the first plate 10 by die cutting machine. A processing depth of the cutting machine is larger than the thickness of the first plate 10 and less than the depth of a sum of the thickness of the first plate 10 and the second plate 20. In the cutting process, only the second first gap 111, the third gap 113, the fifth gap 115, the seventh gap 117 and the ninth gap 119 of the first zone A are cut, and only the second gap 112, the fourth gap 114, the sixth gap 116 and the eighth gap 118 of the second zone B are cut.
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a method for manufacturing a coil loading board. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 104127935 | Aug 2015 | TW | national |