Method for Manufacturing Glue-pasting Area of Field Emission Display

Abstract

A method for manufacturing glue-pasting area of field emission display forms a plurality of elongated low walls on glue-pasting area of the anode plate or the cathode plate by printing. The elongated low wall includes a length side parallel with a package side of the display. The elongated low walls are arranged on the glue-pasting area in staggered and parallel fashion, where a first gap is defined between two adjacent elongated low walls and the first gap is a channel for overflow glue after the cathode plate is pressed with the anode plate. After the glass glue is pasted on the elongated low wall and the cathode plate is pressed with the anode plate, the overflow glue is constrained b the gap to control the width of glue.

Description

BRIEF DESCRIPTION OF DRAWING

The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:

FIG. 1 shows the field emission display according to the present invention.

FIG. 2 shows a sectional view of FIG. 1.

FIG. 3 shows the anode plate of the present invention.

FIG. 4 shows a partially enlarged view of portion A of FIG. 3.

FIG. 5 shows a partially enlarged view of rib of FIG. 2.

FIG. 6 shows glue pasting on rib in FIG. 5.

FIG. 7 shows the coupling of anode plate and cathode plate.

DETAILED DESCRIPTION OF THE INVENTION

With reference to FIGS. 1 and 2, according to the method for manufacturing glue-pasting area of field emission display of the present invention, the anode plate 1 and the cathode plate 2 are manufactured separately. After the conductive layer 11 and phosphor layer 12 of the anode plate 1 and the conductive layer 21 and phosphor layer 22 of the cathode plate 2 are manufactured, the anode plate 1 is packaged with the cathode plate 2. For packaging the anode plate 1 and the cathode plate 2, ribs 3 are provided on the glue-pasting area 13 (non-display area) of the anode plate 1 and the cathode plate 2. The ribs 3 are then assembled with glue-pasting area 23 of the cathode plate 2. The ribs 3 are attached between the anode plate 1 and the cathode plate 2 to separate the anode plate 1 and the cathode plate 2.

FIG. 3 shows the anode plate of the present invention and FIG. 4 shows a partially enlarged view of the rib in FIG. 2. The rib 3 uses the same glass material with the glass material of the anode plate 1 and the cathode plate 2. The glass material is printed on the glue-pasting area 13 of the anode plate 1 for patterning of the rib 3. In printing process, a plurality of elongated strips are formed on the glue-pasting area 13 of the anode plate 1. Elongated low walls 31 are formed on the elongated strips as shown in FIG. 5. The thickness of the elongated low walls 31 is the required thickness of display or the desired separation between the anode plate 1 and the cathode plate 2. The length side of the elongated low walls 31 is parallel with the package side of the anode plate 1. The elongated low walls 31 are arranged on the glue-pasting area 13 in parallel and staggered fashion. A first gap 32 is defined between two adjacent elongated low walls 31 and 31′ in the different rows.

After the elongated low walls 31 are finished by printing, the glass glue 4 is directly applied to the glue-pasting area 13 of the anode plate 11 and covers the elongated low walls 31, as shown in FIG. 6. As shown in FIG. 7, after the anode plate 1 is pressed with the cathode plate 2, the flow of the glass glue is constrained between the elongated low walls 31 such that the width of the glass glue can be controller.

To flow the glass glue 4 uniformly in the glue-pasting area 13 and 23, the elongated low walls 31 can be arranged in staggered fashion. Therefore, the first gap 32 of the elongated low walls 31 and 31′ can be uniformly distributed. The elongated low walls 31 can provide support for the anode plate 1 and the cathode plate 2. Therefore, the crack problem due to only support by glass glue can be prevented.

FIG. 4 shows the partially enlarged view of portion A in FIG. 3. The elongated low walls 31 are elongated structure with length side longer than width side. The elongated low walls 31 can have length of 5-10 mm and width within 200 μm. The elongated low walls 31 are arranged in rows and a continuous elongated first gap 32 is defined between two adjacent elongated low walls 31 in different rows. The overflowed glue can flow along the continuous elongated first gap 32. Second gaps 32a are provided between two adjacent elongated low walls 31 in the same row to define a vertical flow 33 for glue. The adjacent second gaps 32a are staggered to each other to constrain the vertical flow of the glue. Therefore, most of the glue can flow alone the continuous elongated first gap 32 and the air bubble can be prevented to occur, which will influence the vacuum state.

Moreover, the glass glue 4 will expand in shape during sintering. It is disadvantageous to encapsulate the glass glue 4 by an integral low wall 31. Therefore, a plurality of elongated low walls 31 is arranged in staggered fashion to form first gap 32 for facilitating slight flowing of glue. To prevent overflowing of glue outside the package region, the viscosity of the paste material for the glass glue should be more than 50000 cps. The elongated low walls 31 are such arranged that a continuous first gap 32 is defined between two adjacent elongated low walls in the different rows. The elongated low walls 31 are such arranged that the second gap 32a defined between two adjacent elongated low walls in the same row. The second gap 32a near the package region should have a width smaller than 500 μm or equal to 500 μm to constrain flow direction of glue. Therefore, only small amount of overflow glue will be present and the pressing and sintering operation will not be influenced. The length of the gap 32a within the package region also should be constrained. The second gap 32a should be staggered with the second gap 32a outside the package region, and the length of the gap 32a should be smaller than one third of the length of the elongated low wall 31. Therefore, vertical flow 33 of glue can also be constrained.

The elongated low walls 31 arranged in staggered fashion on the glue-pasting area 13 and 23 of the anode plate 1 and cathode 2 have following advantages:

1. The width of the glue-pasting area can be limited within 2 mm.

2. The alignment of the glue-pasting area can be uniform and the glue overflow can be prevented.

3. The package strength and gap of the glue-pasting area can be well controlled and the vacuum effect is enhanced.

Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims

1. A method for manufacturing glue-pasting area of a field emission display, where ribs are formed on glue-pasting areas between an anode plate and a cathode plate, the method comprising: forming a plurality of elongated strips on the glue-pasting area of the anode plate by printing and the plurality of elongated strips forming elongated low walls after a plurality of printing; andapplying glass glue on the glue-pasting area and covering on the elongated low walls, the elongated low walls confining the glass glue when the anode plate is pressed with the cathode plate, whereby the glass glue flows uniformly to cover the glue-pasting area.

2. The method as in claim 1 wherein the ribs use the same material as glass plate for the anode plate and the cathode plate.

3. The method as in claim 1 wherein the thickness of the elongated low walls is the thickness of display.

4. The method as in claim 1 wherein the thickness of the elongated low walls is a separation thickness between the anode plate and cathode plate.

5. The method as in claim 1 wherein the elongated low wall has a length side parallel with a package side of the anode plate, the plurality of the elongated low walls being arranged in parallel and staggered fashion, a first gap is defined between two adjacent elongated low walls in different rows.

6. The method as in claim 1 wherein the elongated low wall has a length side longer than a width side thereof, the elongated low wall has a length of at least 5-10 mm and a width within 200 μm.

7. The method as in claim 1, wherein a second gap between the adjacent elongated low walls is smaller than 500 μm or equal to 500 μm to prevent flow of over glue.

8. The method as in claim 1 wherein the viscosity of the paste for the glass paste is at least 50000 cps.

9. The method as in claim 1 wherein the gap length is smaller than one third of the length of the elongated low wall to constrain overflow of the glue.