Method For Manufacturing Isothermal Plate

Abstract

A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, the recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; and applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with the inner wall of its corresponding cambered space in the direction of pressing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of the isothermal plate of the present invention;

FIG. 2 is a schematic view showing the action of pressing the isothermal plate of the present invention;

FIG. 3 is a cross-sectional view showing the isothermal plate of the present invention after pressing;

FIG. 4 is a partially enlarged view showing the details of FIG. 3; and

FIG. 5 is a cross-sectional view showing the isothermal plate of another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In order to make the Examiner better understand the characteristics and the technical contents of the present invention, a detailed description relating to this will be made with reference to the accompanying drawings. However, it should be understood that the drawings are illustrative but not used to limit the scope of the present invention.

With reference to FIG. 1, it is an exploded view showing the isothermal plate of the present invention. The present invention provides a method for manufacturing an isothermal plate, which comprises the steps as follows.

First, a plurality of heat pipes 10, a first plate body 11 and a second plate body 12 necessary for constituting the isothermal plate 1 are prepared. Both the first plate body 11 and the second plate body 12 are made of materials having good heat conductivity such as aluminum, copper or the like and each formed into a flat plate. Further, on the second plate body 12, a plurality of linear and elongated shielding covers 120 is formed by means of pressing. These shielding covers are recessed into the bottom surface of the second plate body 12 and protrude from the top surface of the second plate body. Each shielding plate 120 extends from one side of the second plate body 12 to another side thereof. Each shielding cover 120 is arranged at an interval and parallel to each other, so that a connecting side-strip 121 is formed between any two adjacent shielding covers 120. Further, the recessed portion of each shielding cover 120 is a cambered space 122 for horizontally accommodating the heat pipe 10 therein. The number of each cambered space 122 is identical to that of the heat pipes 10.

According to the above, each heat pipe 10 is disposed into each cambered space 122 with the first plate body 11 adhered to the bottom surface of the second plate 12, so that the two plate bodies 11, 12 overlap with each other. In the embodiment of the present invention, broken holes 123 are made on each connecting side-strip 121 of the second plate body 12. The first plate is provided with locking pieces bent upwardly at the positions corresponding to the broken holes 123. With this arrangement, when the first plate body 11 and the second plate body 12 overlap with each other, each locking piece 110 penetrates through the corresponding broken hole 123 to provide a preliminary connection between the first plate body 11 and the second plate body 12, thereby to smooth the sequential process.

With reference to FIG. 2, after the heat pipes 10 overlap with the first and second plate bodies 11, 12, the isothermal plate 1 can be disposed on a pressing platen 2. A press-forming mold 3 is provided above the press-forming platen 2, so that the press-forming platen 3 can perform the pressing operation to the first and second plate bodies 11, 12 and each heat pipe 10 along a vertical direction. The pressing surface of the press-forming mold 3 is recessed to provide with a plurality of flat grooves 30. Each flat groove 30 corresponds to each shielding cover 120 of the second plate body 12. A pressing surface 31 protrudes downwardly from the portion between any two adjacent flat grooves 30 to correspond to each locking piece 110 on the first plate body 11. In pressing, since each flat groove 30 first applies an external force to the second plate body 12, each shielding cover 120 and heat pipe 10 generate a plastic deformation and thus is flattened by the flat groove 30, as shown in FIG. 4. Therefore, each heat pipe 10 can be brought into a tight and planar contact with the inner wall of the corresponding shielding cover 120 in the direction of pressing (i.e., at the flattened portions after pressing), thereby to combine the first and second plate bodies 11, 12 with each heat pipe 10. As a result, the isothermal plate 3 of the present invention can be obtained, as shown in FIG. 3.

Further, as shown in FIG. 4, the inner wall of each shielding cover 120 is provided with at least one fine holes 124 extending along the lengthwise direction of the shielding cover 120. After the heat pipes 10 and the shielding covers 120 are flattened by means of the pressing operation, a slight gap is formed between the heat pipe 10 and both sides of the cambered space 122. At this time, a heat-conducting medium such as heat-conducting paste or soldering material is injected into the fine hole 124, so that the heat-conducting medium can flow into the gap between the heat pipe 10 and the cambered space 122. By passing through a soldering furnace, each heat pipe 10 and the first and second plate bodies 11, 12 can be further bonded and connected with each other. In addition, each locking piece 110 is also bent by the pressing action of the pressing surface 31, so that the first plate body 11 and the second plate body 12 are locked and connected with each other to make the assembly of whole structure more stable. Further, as shown in FIG. 5, the connecting of the first plate body 11 and the second plate body 12 can be made by spot welding or hole drawing on the connecting side-strip 121 of the second plate body 12 and the corresponding position of the first plate body 11, thereby to enhance the bonding effect between the first and second plate bodies 11, 12.

Moreover, before the above pressing operation, a soldering material such as soldering paste can be applied on each heat pipe 10 or the first and second plate bodies 11, 12. In applying the soldering paste, the soldering material has to be heated after the pressing operation, so that the soldering material can be melted to fill the gap, thereby to increase the heat-conducting effect.

Therefore, with the above steps, the method for manufacturing an isothermal plate in accordance with the present invention can be obtained.

According to the above, the present invention indeed achieves the desired effects and solves the drawbacks of prior art. Further, the present invention involves the novelty and inventive steps, and thus conforms to the requirements for an invention patent.

Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still be occurred to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A method for manufacturing an isothermal plate, comprising the steps of: preparing a plurality of heat pipes, a first plate body and a second plate body;pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, a recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein;disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; andapplying an external force to the second plate body to bring each heat pipe into a tight and planar contact with an inner wall of a corresponding cambered space in the direction of pressing.

2. The method for manufacturing an isothermal plate according to claim 1, wherein the first and second plate bodies are made of materials including aluminum or copper.

3. The method for manufacturing an isothermal plate according to claim 1, further comprising the step of providing a necessary connection for the first and the second plate bodies to allow the two plate bodies to overlap with each other.

4. The method for manufacturing an isothermal plate according to claim 1, further comprising the step of providing fine holes on the inner wall of each shielding cover, and injecting a heat-conducting medium into the fine holes to flow into a gap between the heat pipes and the shielding covers after the heat pipes and the shielding covers are flattened by pressing.

5. The method for manufacturing an isothermal plate according to claim 1, further comprising the step of applying a heat-conducting paste on each heat pipe or the first and the second plate bodies.

6. The method for manufacturing an isothermal plate according to claim 1, further comprising the step of applying a soldering material on each heat pipe or the first and the second plate bodies so that the soldering material is heated to be melted to fill a gap between the heat pipes and the shielding covers.

7. The method for manufacturing an isothermal plate according to claim 6, wherein the soldering material is a soldering paste.