1. Field of the Invention
The present invention relates to the field of liquid crystal displaying, and in particular to a method for manufacturing a liquid crystal display device.
2. The Related Arts
Liquid crystal display (LCD) has a variety of advantages, such as thin device body, low power consumption, and being free of radiation, and is thus widely used. Most of the LCDs that are currently available in the market are backlighting LCDs, which comprise a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is that liquid crystal polymer molecules interposed between two parallel glass substrates and a plurality of vertical and horizontal fine electrical wires is arranged between the two glass substrates, whereby the liquid crystal molecules are controlled to change direction by application of electricity in order to refract light emitting from the backlight module for generating images.
As shown in
The process of introducing the liquid crystal 300 between the upper substrate 100 and the lower substrate 200 is generally a process referred to as one drop filling (ODF), which generally comprises several steps of coating the sealant 400, filling the liquid crystal 300, vacuum assembling, and high temperature curing. In the step of coating the sealant 400, it is often that fibers 500 are added to the sealant 400 to provide an effect of supporting box thickness. However, adding fibers 500 increases the manufacturing time and labor required, making it detrimental to controlling cost.
An object of the present invention is to provide a method for manufacturing a liquid crystal display device, which comprises forming supports for supporting box thickness at the same time when spacers are formed on a substrate and the process is simple and cost is low.
To achieve the object, the present invention provides a method for manufacturing a liquid crystal display device, which comprises the following steps:
Step 1: providing a substrate;
Step 2: forming a black matrix on a surface of the substrate;
Step 3: sequentially forming R, G, B on the surface of the substrate;
Step 4: forming spacers on the surface of the substrate and at the same time forming supports, the supports being arranged to correspond to a site where an enclosing frame is to be set; and
Step 5: coating sealant on the site of the surface of the substrates where the enclosing frame is to be set to form the enclosing frame thereby forming the CF substrate.
The spacers and the supports are formed on the substrate simultaneously through masking operation.
The substrate is a glass substrate and the site where the enclosing frame is to be set is located at an outer side of the back matrix adjacent to edges of the substrate.
The supports are of a regular or irregular shape.
The supports are of a pillar structure.
The supports are located inside or outside the enclosing frame.
The supports are distributed in the enclosing frame in such a way to take an occupation rate of 0.5%-3%.
A portion of the supports is located in the enclosing frame and a remaining portion is located inside or outside the enclosing frame.
The supports are arranged in a continuous manner so as to be continuously set on the substrate.
The method for manufacturing a liquid crystal display device further comprises:
Step 6: dropping liquid crystal inside the enclosing frame;
Step 7: providing a TFT substrate;
Step 8: bonding the TFT substrate and the CF substrate together in such a way that the TFT substrate and the CF substrate are supported by the supports arranged therebetween in order to enclose the liquid crystal between the TFT substrate and the CF substrate; and
Step 9: subjecting the bonded TFT substrate and the CF substrate to curing at high temperature in order to cure the enclosing frame.
The efficacy of the present invention is that the present invention provides a method for manufacturing a liquid crystal display device, which forms a spacer and a support simultaneously on a substrate through masking operation so that box thickness between a TFT substrate and a CF substrate can be supported by the support whereby the process of the conventional technique where fibers are added in an enclosing frame for supporting the box thickness can be eliminated to simplify the process, while reducing labor deployment and lowering own manufacture cost.
For better understanding of the features and technical contents of the present invention, reference will be made to the following detailed description of the present invention and the attached drawings. However, the drawings are provided for the purposes of reference and illustration and are not intended to impose undue limitations to the present invention.
The technical solution, as well as beneficial advantages, will be apparent from the following detailed description of an embodiment of the present invention, with reference to the attached drawings. In the drawings:
To further expound the technical solution adopted in the present invention and the advantages thereof, a detailed description is given to a preferred embodiment of the present invention and the attached drawings.
Referring to
Step 1: providing a substrate 2. In the instant embodiment, the substrate 2 is a glass substrate.
Step 2: forming a black matrix (not shown) on a surface 22 of the substrate 2. The black matrix is integrally formed on the substrate 2 through operations including masking operation, printing, or spray coating operation.
Step 3: sequentially forming R, G, B on the surface 22 of the substrate 2.
The R, G, B are formed on the substrates 2 through operations including masking operation, printing, or spray coating operation.
Step 4: forming spacers (not shown) on the surface 22 of the substrate 2 and at the same time forming supports 24. The spacers and the supports 24 are formed on the substrate 2 through masking operation.
The supports 24 are arranged to correspond to the site where an enclosing frame is to be set. The site where the enclosing frame is to be set is located at an outer side of the back matrix adjacent to edges of the substrates. The supports 24 are arranged on the substrate 2 in a spaced manner. Preferably, the supports 24 are arranged on the substrate 2 in a uniformly spaced manner. The supports 24 can be arranged in a continuous manner so as to be continuously set on the substrate 2.
The supports 24 can be of a regular or irregular shape. Preferably, the supports 24 are of a pillar structure, of which the specific shape can be determined according to the requirement of an actual manufacturing process to achieve the same technical effect of the present invention.
Step 5: coating sealant on the site of the surface 22 of the substrates 2 where the enclosing frame is to be set to form the enclosing frame 26 thereby forming the CF substrate 20.
The supports 24 are arranged to correspond to the site where the enclosing frame is to be set and can be located inside or outside the enclosing frame 26 or completely located on the enclosing frame 26. As shown in
Step 6: dropping liquid crystal 30 inside the enclosing frame 26.
Step 7: providing a TFT substrate 40.
The TFT substrate 40 is manufactured through the operations of thin film, yellow light, etching, and film stripping and the specific operations used can be any of the known operations.
Step 8: bonding the TFT substrate 40 and the CF substrate 20 together in such a way that the TFT substrate 40 and the CF substrate 20 are supported by the supports 24 arranged therebetween in order to enclose the liquid crystal 30 between the TFT substrate 40 and the CF substrate 20 thereby achieving supporting of box thickness between the TFT substrate 40 and the CF substrate 20 by the supports 24. This simplifies the manufacture process and reduces the manufacture cost.
Step 9: subjecting the bonded TFT substrate 40 and the CF substrate 20 to curing at high temperature in order to cure the enclosing frame 26.
Referring to
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In summary, the present invention provides a method for manufacturing liquid crystal display device, which forms a spacer and a support simultaneously on a substrate through masking operation so that box thickness between a TFT substrate and a CF substrate can be supported by the support whereby the process of the conventional technique where fibers are added in an enclosing frame for supporting the box thickness can be eliminated to simplify the process, while reducing labor deployment and lowering own manufacture cost.
Based on the description given above, those having ordinary skills of the art may easily contemplate various changes and modifications of the technical solution and technical ideas of the present invention and all these changes and modifications are considered within the protection scope of right for the present invention.
Number | Date | Country | Kind |
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201210160543.0 | May 2012 | CN | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CN2012/076308 | 5/30/2012 | WO | 00 | 7/25/2012 |