1. Technical Field
The present disclosure relates to methods for manufacturing glass, and more particularly to a method for manufacturing an obscured glass.
2. Description of Related Art
Methods for manufacturing obscured glass is mainly selected from one of blasting or chemical etching. In blasting process, an amount of injecting particles impact on an outer surface of a piece of glass to form an obscured layer. However, there is much cracks formed in a root segment of the obscured layer during the blasting process, thus the obscured glass obtains a low intensity and is easily damaged. In addition, in a chemical etching process, environment pollution can occur due to the hydrofluoric acid employed in the chemical etching process.
Therefore, there is room for improvement in the art.
The components in the drawings are not necessarily drawn to scale, the emphasis instead placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
In step S101: a glass substrate 100 is provided. The glass substrate 100 includes a pre-obscured surface 10.
In step S102: the pre-obscured surface 10 of the glass substrate 100 is cleaned. In the embodiment, an ultrasonic cleaning is applied to the glass substrate 100 to remove dust and ions from the pre-obscured surface 10.
In step S103: a first harden process is applied to the glass substrate 100, thereby forming a strength layer 20 toward the pre-substrate surface 10. The detail steps are illustrated as follow: first, an outer surface of the glass substrate 100 is shielded except the pre-obscured surface 10; secondly, the glass substrate 100 is immersed into molten potassium nitrate (KNO3) for about 2 hours˜6 hours, wherein the temperature of the molten potassium nitrate is about 400 degrees ˜450 degrees Celsius, thereby the strength layer 20 extending toward the pre-obscured surface 10 is formed. A thickness of the strength layer 20 is about 8 μm˜30 μm, an intensity of the strength layer 20 is about 125 Mpa ˜350 Mpa; finally, the glass substrate 100 is taken out, a planarity of the pre-obscured surface 10 is about 10 μm ˜20 μm. Preferably, the immersion time of the glass substrate 100 immersed in the potassium nitrate is selected in a range of about 2 hours ˜4 hours, thereby the thickness of the strength layer is about 10 μm ˜30 μm and the intensity is about 300 Mpa. In the illustrated embodiment, the immersion time is about 3 hours and the thickness of the strength layer 20 is about 15 μm.
Referring to
In step S105: a rough burnish process is applied to the pre-obscured surface 10 of the glass substrate 100. Referring to
Referring to
In step S107: A finishing burnish process is applied to the pre-obscured surface 10 of the glass substrate 10. The steps of the finishing burnish process are same as that of the rough burnish process. The finishing burnish process is capable of removing dust and ions which adhesive on the glass substrate 100 during the afore-mentioned process. The time of the finishing burnish process is slightly shorter than that of the rough burnish process.
In step S108: the pre-obscured surface 10 of the glass substrate 10 is cleaned. First, the glass substrate 10 with water is washed; secondly, the glass substrate 10 is immersed in water for about 10 minutes ˜15 minutes; finally, the glass substrate 10 is cleaned in an ultrasonic cleaning process with abluent.
A first harden process is employed in the method for manufacturing obscured glass, such that the strength layer 20 is formed thereby toward the pre-obscured surface 10 to prevent cracks on the glass substrate 100 during the following blasting process, so the intensity of the obscured glass is improved. The hydrofluoric acid is omitted here, so the method for manufacturing obscured glass is more safety. Moreover, a harden layer 40 thicker than the strength layer 20 is formed there, thus an obscured glass of high and even intensity is obtained.
It should be noted that if the glass substrate 100 is clean enough, the cleaning process before the first harden process may be omitted. If the glass substrate 100 after the finishing burnish process is clean enough, the cleaning process thereafter may be omitted. When a relative large roughness the pre-obscured surface 10 satisfies the demand of the obscured glass, the rough burnish process, the second harden process, the finishing burnish process and the cleaning process thereafter may be omitted.
It should be noted that when the glass substrate 100 includes two pre-obscured surfaces 10 opposite to each other, the method is the same, during the first and the second harden processes, the shielding of the glass substrate 100 may be omitted and the glass substrate 100 is immersed in the molten potassium nitrate directly.
It should be noted that in the rough burnish process and the finishing burnish process, the burnish solution may be dilution of the cerium oxide, alumina, silicon oxide, chromic oxide, zirconium dioxide, carborundum and superfine corundum. The ultrasonic may be omitted in the two cleaning processes, and a driver is employed to drive water to flow to clean the glass substrate 100.
Finally, while various embodiments have been described and illustrated, the disclosure is not to be construed as being restricted thereto. Various modifications can be made to the embodiments by those skilled in the art without departing from the true spirit and scope of the disclosure as defined by the appended claims.
Number | Date | Country | Kind |
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201110341321.4 | Nov 2011 | CN | national |