Patent Application
20100289162
1. Field of the Invention
The present invention relates to a method for manufacturing an optical waveguide with a high optical transmission efficiency.
2. Description of the Related Art
Conventionally, a method for manufacturing an optical waveguide by applying a curable liquid-state resin on cores and curing the liquid-state resin by ultraviolet rays or heat to form an over-cladding layer has been known (see Japanese Unexamined Patent Application Publication No. 2002-31732).
In such a conventional manufacturing method, a liquid-state resin with a low viscosity is used when the over-cladding layer is thin and a liquid-state resin with a high viscosity is used when the over-cladding layer is thick. The phrase “the over-cladding layer is thin” typically means that the over-cladding layer has a thickness of less than 100 μm. And the phrase “the over-cladding layer is thick” typically means that the over-cladding layer has a maximum thickness (a thickness of a portion with the greatest thickness) of not less than 500 μm.
In conventional manufacturing methods, while productivity is good when an over-cladding layer is thin, productivity is bad when the over-cladding layer is thick. This is because a liquid-state resin with a high viscosity is used when the over-cladding layer is thick, so that bubbles are adhered to the periphery of cores, resulting in lower optical transmission efficiency of an optical waveguide.
In conventional manufacturing methods, it is also possible to obtain an over-cladding layer having few bubbles by using a liquid-state resin with a low viscosity. However, in that case, it is difficult to obtain an over-cladding layer with a great thickness.
Conventionally, methods for manufacturing an optical waveguide by applying a curable liquid-state resin on cores and curing the liquid-state resin by ultraviolet rays or heat to form an over-cladding layer have been known.
In such conventional methods, productivity is good when the over-cladding layer is thin. However, a liquid-state resin with a high viscosity is used when the over-cladding layer is thick, so that it is difficult to obtain a good quality-over-cladding layer because bubbles tend to be easily adhered to the periphery of the cores.
In a first preferred embodiment according to the present invention, there is provided a method for manufacturing an optical waveguide which comprises an under-cladding layer, cores formed on the under-cladding layer, and an over-cladding layer composed of a liquid-state curable resin layer having a maximum thickness of not less than 500 μm formed on the under-cladding layer so as to cover the cores. The method for manufacturing an optical waveguide according to the present invention includes the steps of: A) forming a liquid-state resin mass by adding dropwise a curable liquid-state resin that may form the over-cladding layer on the under-cladding layer; B) forming a liquid-state resin layer to cover the cores by pressing a mold on the liquid-state resin mass and applying the liquid-state resin to be expanded on the under-cladding layer; and C) curing the liquid-state resin layer and then releasing the mold. In the manufacturing method according to the present invention, the liquid-state resin added dropwise has a viscosity of 500 to 2,000 mPa·s in step A) and the rate at which the liquid-state resin is applied to be expanded is 10 to 50 mm/s in step B).
In a second preferred embodiment of the method for manufacturing an optical waveguide according to the present invention, the curable liquid-state resin that may form an over-cladding layer is an ultraviolet rays resin.
As a result of careful study of the inventor of the present invention to solve the aforementioned problems, he has found that when the viscosity of the liquid-state resin that falls in drops and the rate at which the liquid-state resin is applied to be expanded are respectively in a specific range, it is possible to easily remove bubbles adhered to the periphery of the cores, which leads to obtain an optical waveguide with a high optical transmission efficiency.
The liquid-state resin that falls in drops preferably has a viscosity of 500 to 2,000 mPa·s to set the maximum thickness of the over-cladding layer at not less than 500 μm. The maximum thickness of the over-cladding layer may not reach 500 μm when the liquid-state resin has a viscosity of lower than 500 mPa·s. It may be difficult to remove bubbles adhered to the periphery of the cores when the liquid-state resin has a viscosity of over 2,000 mPa·s.
To remove bubbles adhered to the periphery of the cores, the rate at which the liquid-state resin is applied to be expanded is preferably 10 to 50 mm/s when the liquid-state resin has a viscosity in the aforementioned range. The rate at which the liquid-state resin is applied to be expanded is faster than the rate at which the liquid-state resin is naturally applied to be expanded. The rate at which the liquid-state resin is applied to be expanded in this range can be obtained by pressing the mold on the liquid-state resin at an appropriate pressure.
It is possible to remove bubbles before the mold is closed by setting the viscosity of the liquid-state resin at 500 to 2,000 mPa·s and the rate at which the liquid-state resin is applied to be expanded at 10 to 50 mm/s. This enables to obtain an optical waveguide with a high optical transmission efficiency.
The manufacturing method of the present invention makes it possible to obtain an over-cladding layer without bubbles adhered to the cores and having a maximum thickness of not less than 500 μm. Therefore, an optical waveguide according to the present invention typically has optical transmission efficiency of cores higher than that of conventional optical waveguides by 60% or higher.
For a full understanding of the present invention, reference should be made to the following detailed description of the preferred embodiments of the invention as illustrated in the accompanying drawings.
The preferred embodiments of the present invention will now be described with reference to
The present invention provides a method for manufacturing an optical waveguide which comprises: (a) an under-cladding layer; (b) cores formed on the under-cladding layer; and (c) an over-cladding layer composed of a resin curable layer with a maximum thickness of not less than 500 μm formed on the under-cladding layer so as to cover the cores.
The method for manufacturing an optical waveguide of the present invention may include steps A to C as described below in order. Any steps may be included between each step.
The phrase “the maximum thickness of the over-cladding layer” herein means the thickness of the over-cladding layer when the over-cladding layer has a uniform thickness. When the thickness of the over-cladding layer differs depending on the place, the thickness means the thickness of the portion having a maximum thickness. Referring to
As shown in
The under-cladding layer 11 to be used in the present invention is formed from any material having a refractive index lower than that of the cores 12. The under-cladding layer 11 may be formed from a material identical to the material of the over-cladding layer 13 described later. The under-cladding layer 11 typically has a thickness of 10 to 100 μm.
Typically, a liquid-state resin which is changed to be hardly dissolved and fused or to be poorly dissolved and fused by energy, such as catalysis, heating, and optical irradiation or the like is used as the curable liquid-state resin 14 for forming the over-cladding layer 13.
The liquid-state resin 14 is preferably an ultraviolet rays resin. The ultraviolet rays resin generally contains a photo-polymerizable prepolymer that is polymerized by a photochemical function, and in addition to this, may also contain a reactive diluent, a photo-polymerization initiator, a solvent, a leveling agent and the like.
The liquid-state resin 14 preferably has a viscosity of 500 to 2,000 mPa·s because the maximum thickness of the over-cladding layer 13 is not less than 500 μm. The liquid-state resin 14 more preferably has a viscosity of 800 to 1,500 mPa·s. It is possible to adjust the viscosity of the liquid-state resin 14 appropriately, for example, by diluting the liquid-state resin 14 with a solvent.
For example, the liquid-state resin 14 can be added dropwise using the dropping nozzle 15. The amount of the liquid-state resin 14 to be added dropwise can be set appropriately in accordance with the area of an optical waveguide 10. The shape of the liquid-state resin mass 16 obtained by adding the liquid-state resin 14 dropwise is naturally formed in accordance with the viscosity and thixotropy of the liquid-state resin. A plural number of the liquid-state resin masses 16 may be provided on the under-cladding layer 11.
As shown in
The rate at which the liquid-state resin mass 16 is applied to be expanded may be in the aforementioned range in a partial process by the time of forming the liquid-state resin layer 18 after the liquid-state resin 14 is added dropwise on the under-cladding layer 11. This is because it is possible to remove the bubbles 19 in the mean time. The rate at which the liquid-state resin mass 16 is applied to be expanded can be controlled by appropriately adjusting the viscosity of the liquid-state resin mass 16 and the pressing rate of the mold 17.
The cores 12 are formed by any material having a refractive index higher than the under-cladding layer 11 and the over-cladding layer 13 and high transparency at the wavelength of light that propagates. As a material to be used for forming the cores 12, an ultraviolet ray-curable resin having a refractive index higher than the under-cladding layer 11 and the over-cladding layer 13 is preferably used.
The maximum refractive index difference among the cores 12, the under-cladding layer 11 and the over-cladding layer 13 is preferably 0.02 to 0.2. The width of the cores 12 is typically 10 to 500 μm. And the height of the cores 12 is typically 10 to 100 μm.
Examples of a material to be used for forming the mold 17 include quartz, nickel synthetic metal, and glassy carbon. The mold 17 may have a through hole to discharge the bubbles 19. Further, the inner surface of the mold 17 may be treated by a releasing agent. The conditions for pressing the mold 17 is appropriately determined according to the kind of the liquid-state resin or the viscosity of the liquid-state resin.
The liquid-state resin layer 18 is formed on the under-cladding layer 11 so as to cover the cores 12 to form the over-cladding layer 13 after being cured.
As shown in
When an ultraviolet ray-curable resin is used as the liquid-state resin 14, the liquid-state resin layer 18 is cured by the irradiation with ultraviolet rays. Ultraviolet rays are preferably irradiated from the surface (outside) of the mold 17. The mold 17 is transparent toward light irradiated. The dose of the ultraviolet rays is preferably 100 to 8,000 mJ/cm2.
The mold 17 is released in the state that the shape of the liquid-state resin layer 18 is maintained. The liquid-state resin layer 18 may be in a complete cured state or a partially cured state when the mold 17 is released. When the liquid-state resin layer 18 is in a partially cured state, the liquid-state resin layer 18 is additionally cured after the release of the mold 17.
As shown in
For example, the optical waveguide 10 is capable of receiving light beams from ends 12a of the cores 12 located on a short side surface 10a and transmitting light to ends 12b of the cores 12 located on a long side surface 10b.
The optical waveguide 10 may be manufactured by any method, such as a dry etching method, a transfer method, an exposing/developing method, a photo-bleaching method and the like.
Although the applications of the optical waveguide 10 produced by the manufacturing method of the present invention are not particularly limited, the optical waveguide is preferably used for, for example, an optical wiring plate, an optical connector, a substrate with optical-electric devices mixedly mounted, an optical touch panel and the like.
(Component A) Epoxy-based ultraviolet ray-curable resin having an alicyclic skeleton (EP4080E, manufactured by Adeka Corporation) 100 parts by weight
(Component B) Photo-acid generator (CPI-200K, manufactured by SAN-APRO Ltd.) 2 parts by weight These components were mixed to prepare a liquid-state resin for cladding-layer-forming.
(Component C) Epoxy-based ultraviolet ray-curable resin containing a fluorene skeleton (OGSOL EG, manufactured by Osaka Gas Chemicals Co., Ltd.) 40 parts by weight
(Component D) Epoxy-based ultraviolet ray-curable resin containing a fluorene skeleton (EX-1040, manufactured by Nagase Chemtex Corporation) 30 parts by weight
(Component E)1,3,3-tris(4-(2-(3-oxycetanyl))butoxyphenyl) butane (synthesized in accordance with Example 2 in JP 2007-070320 A) 30 parts by weight
1 part by weight of the component B and 41 parts by weight of ethyl lactate were mixed so that a liquid-state resin for core forming was prepared.
A liquid-state resin for cladding-layer-forming was applied to the surface of a polyethylene naphthalate film having a thickness of 188 μm, and after being irradiated with 1,000 mJ/cm2 of ultraviolet rays, this was subjected to a heating treatment at 80° C. for 5 minutes so that an under-cladding layer having a thickness of 20 μm was formed. The under-cladding layer had a refractive index of 1.510 at a wavelength of 830 nm.
The liquid-state resin for core forming was applied to the surface of the under-cladding layer, and this was subjected to a heating treatment at 100° C. for 5 minutes so that a core layer was formed. The core layer was covered with a photomask and this was irradiated with 2,500 mJ/cm2 of ultraviolet rays, and further subjected to a heating treatment at 100° C. for 10 minutes. The gap between the core layer and the photomask was 100 μm.
Unirradiated portions with ultraviolet rays of the core layer were dissolved and removed by a y-butyrolactone aqueous solution, and this was subjected to a heating treatment at 120° C. for 5 minutes so that a plurality of cores having a core width of 20 μm and a core height of 50 μm were pattern-formed. The plurality of cores respectively had a refractive index of 1.592 at a wavelength of 830 nm.
The liquid-state resin for cladding-layer-forming having a viscosity of 1,000 mPa·s fell in drops in a manner so as to cover the whole cores so that a liquid-state resin mass was formed. Next, a mold was pressed onto the liquid-state resin mass and the liquid-state resin was expanded in such a manner that the rate at which the liquid-state resin was applied to be expanded might be 30 mm/s to form a liquid-state resin layer having a thickness of 500 μm.
Ultraviolet rays of 6,000 mJ/cm2 were irradiated from the surface of the mold, and then subjected to a heating treatment at 80° C. for 2 minutes so that the liquid-state resin layer might be cured.
Thereafter, the mold was separated therefrom to form an over-cladding layer having a thickness of 500 μm. The refractive index of the over-cladding layer at a wavelength of 830 nm was 1.510.
An optical waveguide was manufactured in the same manner as in Example 1 except for forming a liquid-state resin layer by the application of a liquid-state resin using a doctor blade.
An optical waveguide was manufactured in the same manner as in Example 1 except that the viscosity of the liquid-state resin was changed to 30 mPa·s. The viscosity of the liquid-state resin was adjusted by mixing ethyl lactate as a diluent.
Two pieces of each of optical waveguides manufactured in Example 1 and Comparative Examples 1 and 2 were prepared. As shown in
A light-receiving element 34 was optically coupled to an end 33a of the other optical waveguide 33. The light-receiving element 34 was a CMOS linear censor array manufactured by TAOS Co., Ltd.
The respective optical waveguides 31 and 33 were disposed so as to face each other with a coordinate input region 35 interposed therebetween so that a coordinate input device 30 having 3 inches in diagonal length as shown in
Table 1 shows light intensity indicated by percentage received by the light-receiving element 34 when light having an intensity of 5 mW was outputted from the light-emitting element 32. As can be seen from Table 1, the optical waveguide of Example 1 had a transmission efficiency higher than that of the comparative examples.
By using a viscometer (HAAKKE Rheo Stress 600, manufactured by Thermo HAAKE Co., Ltd.), the viscosity of the liquid-state resin was measured at a temperature of 25° C.
Time that has taken for a liquid-state resin for forming an over-cladding layer on an under-cladding layer with a predetermined length was manually measured with a stop watch to calculate the rate at which the liquid-state resin was applied to be expanded from the casting distance and time.
Although the applications of the optical waveguide produced by the manufacturing method of the present invention are not particularly limited, the optical waveguide is preferably used for, for example, an optical wiring plate, an optical connector, a substrate with optical-electric devices mixedly mounted, an optical touch panel and the like.
This application claims priority from Japanese Patent Application No. 2009-115090, which is incorporated herein by reference.
It is to be understood that the present invention may be practiced in other embodiments in which various improvements, modifications, and variations are added on the basis of knowledge of those skilled in the art without departing from the spirit of the present invention. Further, any of the specific inventive aspects of the present invention may be replaced with other technical equivalents for embodiment of the present invention, as long as the effects and advantages intended by the invention can be insured. Alternatively, the integrally configured inventive aspects of the present invention may comprise a plurality of members and the inventive aspects that comprise a plurality of members may be practiced in a integrally configured manner.
There has thus been shown and described a novel method for manufacturing an optical waveguide which fulfills all the objects and advantages sought therefor. Many changes, modifications, variations and other uses and applications of the subject invention will, however, become apparent to those skilled in the art after considering this specification and the accompanying drawings which disclose the preferred embodiments thereof. All such changes, modifications, variations and other uses and applications which do not depart from the spirit and scope of the invention are deemed to be covered by the invention, which is to be limited only by the claims which follow.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-115090 | May 2009 | JP | national |
