Patent Application
20140004631
1. Technical Field
The present disclosure relates to semiconductor devices and, more particularly, to a method for manufacturing light emitting diode (LED) package.
2. Description of Related Art
A method for manufacturing an LED package includes following steps: providing a substrate and an LED chip; mounting the LED chip on the substrate; providing a lens and glue and adhering the lens to the substrate by the glue to make the lens covering the LED chip. However, the refractive index of the glue is different from that of the lens. Light emitted from the LED chip is prone to be reflected back into an interior of the lens by the glue. Thus, a light extraction efficiency of the LED package is disadvantageously affected.
Accordingly, it is desirable to provide a method for manufacturing an LED package which can overcome the described limitations.
Embodiment of a method for manufacturing an LED package will now be described in detail below and with reference to the drawings.
Referring to
The second step is providing an LED chip 20, mounting the LED chip 20 on the top surface of the substrate 10 and electrically connecting the circuit of the substrate 10. The LED chip 20 is enclosed by the blocking member 30. A height of the LED chip 20 is larger than that of the blocking member 30.
The third step is providing a dispensing machine 50 with glue 40, dispensing the glue 40 in the groove 31 and an inside of the blocking member 30 to encapsulate the LED chip 20 in the glue 40 and fill the groove 31. The glue 40 is a pure silica gel or a mixture mixed by a pure silica gel and phosphor powder.
The fourth step is heating the glue 40 to obtain a packaging layer 70 and a lens 60. The packaging layer 70 encloses the LED chip 20 therein and is located in the blocking member 30. A periphery of a bottom end of the packaging layer 70 contacts an inner surface of the blocking member 30. The lens 60 encloses the packaging layer 70 therein and a bottom end thereof is received in the groove 31. The lens 60 includes a top surface 61 and a bottom surface 63 connecting a bottom end of the top surface 61. In this embodiment, the top surface 61 is convex. The bottom surface 63 is plane and directly formed on the top surface of the substrate 10. A tangent of the top surface 61 extends through a joint of the top surface 61 and the bottom surface 63. A contacting angle θ is defined between the tangent and the bottom surface 63. When the contacting angle θ is more larger, light reflected back into an interior of the lens 60 and the package layer 70 by the top surface 61 is more less. If the contacting angle θ is large enough, a light extraction efficiency of the LED chip 20 is good. In this embodiment, the contacting angle θ is not less than 75 degrees.
In this disclosure, the lens 60 is formed on the substrate 10 directly, so the glue is not need to distributed between the lens 60 and the substrate 10 which reflects light back into the lens 60. Therefore, the light extraction efficiency of the LED chip 20 is improved. Further, the lens 60 has a larger contacting angle, a majority of light emitted from the LED chip 20 can radiates out from the top surface 61. Thus, the light extraction efficiency of the LED chip 20 is improved.
It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012102210185 | Jun 2012 | CN | national |
