Claims
- 1. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a section for at least a portion of said side of said chip; radially deforming said section to form a second decoration; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that said second decoration transfers to said pad; and moving said pad coaxially into contact with said chip such that said second decoration transfers to said side to print said section on said side; wherein a contraction coefficient of said radially deforming is determined, for a given straight-sided chip and a given pad, by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern comprising closely-spaced concentric circles.
- 2. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a section for at least a portion of said side of said chip; radially deforming said section to form a second decoration; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that said second decoration transfers to said pad; and moving said pad coaxially into contact with said chip such that said second decoration transfers to said side to print said section on said side; wherein said radially deforming further comprises compressing said section and flattening said section into a plane defined by one circular face of the chip to form a ring around said face, said ring being included in a circular ring area having inner and outer circular borderlines by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern including concentric circles.
- 3. A method for marking a side of a straight-sided chip with a decoration by pad printing, said method comprising:providing an ink plate with an image defined by a radially deformed representation of the decoration of the straight side of the chip in a ring-shaped zone; moving a pad coaxially into contact with said ink plate such that said image transfers to said pad; moving said pad coaxially into contact with said chip such that said image transfers to said side of said chip with said side being marked with said decoration; forming said image, said forming further comprising radially folding up said decoration for said side of said chip around a facial edge of said chip in a plane; contracting said decoration for said side of the said chip toward said facial edge; wherein a contraction coefficient of said radially deforming is determined, for a given straight-sided chip and a given pad, by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern comprising closely-spaced concentric circles.
- 4. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a first section for one of said opposing faces and a second section for at least a portion of said side of said chip; radially deforming said second section to form a second decoration, said second decoration including said first section and a radially deformed second section; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that second decoration transfers to said pad; moving said pad coaxially into contact with said chip such that said second decoration transfers to said chip with said radially deformed second section being transferred to said side to print said second section; said radially deforming further comprising flattening said second section into a plane declined by said first section to form a ring around said first section, and shrinking said second section radially inwardly toward a center of said first section; and said shrunken second section being included in a circular ring area having inner and outer circular borderlines determined, for a given straight-sided chip and a given pad, by marking chip models using a positioning ink plate centered on an axis of the chip and bearing a pattern including concentric circles.
Priority Claims (1)
Number |
Date |
Country |
Kind |
97 03872 |
Mar 1997 |
FR |
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CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of application 09/147,253, filed Nov. 12, 1998, now U.S. Pat. No. 6,176,185, which is a national stage application, under 35 U.S.C. §37, of international application No. PCT/FR98/00485, filed Mar. 11, 1998, not published under PCT Article 21(2) in English.
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Continuations (1)
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Number |
Date |
Country |
Parent |
09/147253 |
|
US |
Child |
09/638031 |
|
US |