Method for marking a gambling chip by pad printing

Information

  • Patent Grant
  • 6467413
  • Patent Number
    6,467,413
  • Date Filed
    Tuesday, August 15, 2000
    24 years ago
  • Date Issued
    Tuesday, October 22, 2002
    22 years ago
Abstract
Method for pad-printing a substantially cylindrical chip having opposing faces and a side, the method comprising forming a first decoration, including a section for at least a portion of the side of the chip, radially deforming the section to form a second decoration, providing an ink plate with the second decoration, moving a pad coaxially into contact with the ink plate such that the second decoration transfers to the pad and moving the pad coaxially into contact with the chip such that the second decoration transfers to the side to print the section on the side, wherein a contraction coefficient of the radially deforming is determined, for a given straight-sided chip and a given pad, by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern comprising closely-spaced concentric circles.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to the marking of gambling chips having the general shape of a disc, or of objects of similar shape, by pad printing. Gambling chip, also called casino chip, should be understood to mean any element which can be used in gambling halls and represents a nominal value which may or may not be predetermined. Generally, these chips are manufactured from a rigid and scratch-resistant plastic.




2. Discussion of Background Information




Gambling chips are, almost systematically, given a decoration by marking on their faces and/or sides, this decoration, depending on the eventual uses of the chips, possibly ranging from the simplest to the most complex. For the rest of the specification, the term decoration should be understood in its widest sense and it comprises, in particular, any drawing, symbol, mark and character (for example, letters, numbers, bar codes or various codings) capable of graphical representation and/or having a visual or optical effect (for example, by the use of U.V. -sensitive ink). More specifically, the decoration of the chips is capable of fulfilling at least one of the several functions presented briefly below:




i) a chip and/or chip value and/or casino and/or gambling table and/or gambler identification function;




ii) a decoration function, the decoration having an aesthetic aspect and/or acting as an advertising medium; and




iii) a chip-authentication and security function, for combatting the risk of falsification and/or the risk of fraudulent reproduction.




PRIOR ART




Patent FR 2,730,392 in the name of the Applicant describes the use of pad printing for marking the surface of the faces and/or side of chips (as opposed to volume marking using multi-shot injection molding of variously colored plastics). In particular, this patent describes the marking of each face of the chip by pad printing using an inked pad which is moved coaxially with the chip with, for chips having a soft-profiled side without a straight side, marking of part of the side corresponding to the chamfered or rounded edge of the face of the chip. However, this technique, although satisfactory for the faces of the chip, is not always accepted by casinos for the side as it results in substantial modification of the profile of the side and/or in incomplete marking of the latter.




Moreover, again according to Patent FR 2,730,392, side marking for straight-sided chips is carried out by lateral marking using a rotating pad (or a rotating pad/roller for marking several stacked chips simultaneously). However, this technique, whose means of implementation are quite complex and expensive, is not always satisfactory, especially when the side decoration has to be reproduced with very great positional accuracy over the entire circular perimeter of the straight side (writing, bar code and various codings, periodic circular drawing). In particular, since the principle of the rotating roller implies a point of origin on the side of the chip for the marking operation proper, this results in the formation of a “join” (either a blank or an overlap) in the decoration after marking the side over one complete revolution of the chip, the “join” being all the more difficult to avoid as the manufacturing tolerances of the chip cause slight, but quite real, variations in the diameter of the chips.




SUMMARY OF THE INVENTION




The invention recognizes that there is a need for a new method of marking straight-sided gambling chips which eliminates, or appreciably reduces, the limitations and other drawbacks presented above.




For this purpose, the invention provides a method of marking the side of a straight-sided disc-shaped gambling chip or an object of similar shape by pad printing, characterized by the use of an inked pad which is moved coaxially with the chip in conjunction with a flat ink plate having a ring-shaped zone suitable for being placed coaxially with the pad and bearing a decoration image defined by a radially deformed representation of the decoration of the straight side of the chip.




Thus, the use of the decoration image which is radially deformed with respect to the side decoration makes it possible to distribute the effect of distortion on the final decoration due to the variations in diameter of the chip over the entire circumferential perimeter of the side of the chip and to make this effect negligible.




According to a first variant of the invention, the decoration image is obtained by the combination of an operation of radially folding up the decoration for the side of the chip around a facial edge included in the plane of the ink plate and of an operation of contracting the decoration towards the facial edge, the sequential or chronological order in which the two operations are performed being of no consequence,




In particular, according to a first way of implementing the method of the invention, the decoration image is obtained from an intermediate decoration produced by radially folding up the side decoration into a reference plane corresponding to the plane of the ink plate and including one of the faces of the chip (the reference face), by way of a radial transformation of contraction of the intermediate decoration in the reference plane towards the center of the ring bearing the decoration image.




Advantageously, the position of the internal circular border of the ring and the contraction coefficient of the radial transformation are determined, for a given straight-sided chip model and a given pad, by marking the chip model using a positioning ink plate set on the axis of the chip and bearing a pattern consisting of closely-spaced concentric circles.




Most advantageously, the characteristics of the radial contraction transformation are chosen in order to obtain a reduction in the radial height of the intermediate decoration (equal in height to the side decoration) of between 25 and 40%, i.e. a radial contraction coefficient of between 0.75 and 0.6.




In practice, the magnitude of the radial contraction and of the associated reduction in height of the side decoration depend on the deformation of the pad on the surface of the chip, in other words they depend on the type of chip to be marked, on the profile and nature of the pad (material, hardness, surface finish) and, to a lesser extent, on the inks employed.




Moreover, in order to solve the problem of the colours of the decoration marked on the side of the chip lightening due to the inked pad stretching, use is made, according to two variants of the invention, either of an ink plate having a halftone decoration image for a face of the chip and a non-halftone side decoration image or an ink plate having a decoration image for a face of the chip and a deeply-etched side decoration image, the etching of the side decoration image then being deeper than the etching of the decoration image for the face of the chip.




Moreover, by making the internal circular border of the ring come into correspondence with the edge of the reference face of the chip, the heightwise positioning of the decoration is facilitated for marking a solid-straight-sided chip. Likewise, it is advantageous, in the radial contraction transformation, to use as relative origin on each radius OR the corresponding point A on the edge of the reference face of the chip.




It should be pointed out that the invention also applies to soft-edged chips having a central straight side extending substantially over a large portion of the thickness of the chip and connected to the two faces of the latter by two transition zones (small fillets or broadened chamfers).




According to another variant of the invention, these central-straight-sided chips are marked by making the internal circular border of the ring to correspond approximately to the circle of axial projection of the straight side on the reference face of the chip.




According to yet another variant of the method according to the invention, an axially symmetric deformable pad is used which has a diameter at least equal to the diameter of the chip increased by about five times the height of the side of the chip.




Apart from the chips and other straight-sided objects of similar shape, the straight side of which is pad-printed using the method of the invention defined above, the invention also relates to a pad-printing device suitable for implementing this method, which includes a support for the chip, the support being equipped with a mechanism for centering the chip coaxially with the pad before the operation of marking the side by pad printing, the centering mechanism being retractable in order to allow the side of the chip to be marked during movement of the pad.




Advantageously, the retractable centering mechanisms, of the type comprising slides or a centering ring, are mounted so as to slide axially over the perimeter of the support.




Most advantageously, the device accordingly to the invention includes a mechanism for holding the chip in place on its support, especially when raising the pad. In particular, the mechanism for holding the chip in place includes at least one adhesive patch, in contact with that face of the chip which bears on the support, and/or of suction under vacuum.




Other characteristics and advantages of the present invention will appear on reading the description which follows, with reference to the drawings appended hereto.











BRIEF DESCRIPTION OF THE DRAWING





FIG. 1

shows a perspective view of a solid-straight-sided gambling chip with a side decoration;





FIG. 2

shows a plan view of the ink plate used for producing the side decoration for the chip of

FIG. 1

using the method of the invention;





FIG. 3

is a diagram showing the principle of operation of a pad-printing apparatus allowing implementation of the method of the invention;





FIGS. 4



a


and


4




b


show an operation of marking the side of a straight-sided gambling chip by pad printing using the device illustrated in

FIG. 3

; and





FIG. 5

shows an enlarged sectional diagrammatic view of a central-straight-sided gambling chip and of the corresponding ink plate used for decorating the straight side of the chip using the method of the invention.











DETAILED DESCRIPTION OF THE INVENTION





FIG. 1

shows, in perspective, a gambling chip


10


made of plastic (for example made of polybutylene terephthalate PBT) having the general shape of a disc with parallel faces


12


and


13


and a solid straight side


14


. The surface of the straight side


14


is in the form of a right cylinder of axis ZZ′ perpendicular to the faces of the chip (of height approximately equal to the thickness of the chip), this cylinder being bounded with respect to the faces by right-angled edges


16


and


17


. By way of non-limiting example, the chip


10


has a diameter of 40 mm for a side thickness or height of about 3.3 mm, it being pointed out that, in some cases, the edges


16


and


17


may have a very slight chamfer (of about 0.1 mm), this having the effect in particular, of extending the life of the pad.




Thus, the upper face


12


and its edge


16


both lie in the XX′,YY′ plane perpendicular to the ZZ′ axis, this plane being chosen by convention as the reference plane Pref corresponding to the plane of the ink plate


11


(the origin O being chosen as the intersection of the three axes). The side


14


has a side decoration, in this case, and by way of non-limiting example, a crenellated line


15


consisting of sixteen symmetrical crenels distributed around the circumferential perimeter of the chip


10


, the crenellated line


15


being moreover centered heightwise on the side


14


.





FIG. 2

shows the drawing of the flat ink plate


11


corresponding to the upper face


12


and to the side


14


of the chip


10


and constructed directly in the reference plane Pref. Thus, the face


12


(reference face) which bears a face decoration (for example a colored square


18


) intended to be pad-printed together with the side decoration


15


is shown, to size, as the edge


16


(the reference edge) represented by a first dashed circle. Around the master image for the face


12


may be seen a ring-shaped zone


20


bounded by the edge


16


and the end


17


′ of the lower edge


17


of the chip


10


(this zone being represented by a second dashed circle


17


′ of larger diameter). The decoration image


22


for the side line


15


appears in the form of a crenellated circular curve between the two circles


16


and


17


′. The decoration image


22


is obtained by radially deforming the side decoration line


15


, preferably in the following manner.




The face


12


is firstly divided by a certain number of radii OR into equal sectors, tie angle of which, at the center, between two successive radii OR(i) and OR(i+1), is chosen according to the definition desired for the decoration image (in this case, a sector having an angle of 11.25 degrees at the center is sufficient to cover each crenel of the decoration


15


). The points A


0


, A


1


, A


2


, A


3


, A


4


, A


5


, A


6


, A


7


and A


8


in FIGS.


1


and/or


2


indicate the respective points of intersection of the edge


16


of the upper face


12


with the corresponding radius OR(i), as can be seen, for instance, in

FIG. 1

at A


7


on radius OR


7


. Similarly, the points A(i) on the upper edge


16


of the cylinder-shaped chip


10


have corresponding ones B(i) at the intersection of the cylinder generatfices with the lower edge


17


of the lower face (not shown) of the chip


10


, as can be seen, for instance, at A


0


, B


0


or A


7


, B


7


. In each radial plane PR defined by the ZZ′ axis and a radius OR (for example the plane PR


7


with the radius OR


7


), the generatrix defined by the intersection of the radial plane PR (in this case, the plane PR


7


) with the cylindrical side


14


of the chip (in this case, the generatrix A


7


B


7


) is radially folded up onto the reference plane Pref by rotating it through 90 degrees about the corresponding point of intersection A of the edge


16


with the radius OR (in this case, the point A


7


). In this way, the image point B′


7


of the point B


7


and all the folded-up intermediate points (in this case, the segment C′


7


D′


7


) of the points of the original decoration


15


which lie along the generatrix A


7


B


7


(in this case, the segment C


7


D


7


) are constructed on the radius OR


7


. In this way, the image circle


17


′ of the edge


17


and the intermediate decoration


15


′, which is in the form of a crenellated circle (partially illustrated by the dotted line in FIG.


2


), are constructed, point by point, in the reference plane Pref, i.e. on each radius OR, and radius after radius.




This radial folding-up operation is followed by a radial transformation in which the intermediate decoration


15


′ (illustrated by the moving point P′) is contracted towards the internal circular border of the ring


20


(the edge


16


), the point-by-point radial movement in the reference plane along each radius OR usually resulting in a reduction in the radial width (or height) of the intermediate decoration


15


′ (equal to the height of the decoration


15


) in order to end up, in the reference plane, with the definitive decoration image


22


on the ink plate (illustrated by the moving point P″). Preferably, the contraction coefficient K for the height of the side decoration


15


is between 0.75 and 0.60, which gives a reduction in the height of the decoration of between 25 and 40%. Thus, a shortening coefficient k(P′)≦K<1 is determined, on each radius OR with respect to the point of relative origin A (lying at the intersection of the radius OR and the edge


16


), for each value of the distance AP′, this shortening coefficient making it possible to calculate the distance AP″=k(P′)×AP′ where AP″ is the distance from the final image point P″ (belonging to the decoration


22


) to the origin point A, with k(B′)=K<1. In general, the magnitude of the total radial displacement P′P″ towards the edge


16


of each intermediate point P′ lying on the segment AB′ of a radius OR is greater the further the point P′ is from the point A. It follows that a circle of centre O and radius OP′ is transformed by radial contraction into another circle of centre O of smaller diameter having a radius OP″=OA+(k(P′)×AP′). The reduction coefficient K and the shortening coefficients k(P′) essentially depend on the geometry of the pad and of the chip and on the deformation of the pad on the surface of the chip, but also, however, to a lesser extent, on the nature and surface finish of the surfaces in contact and on the properties of the inks employed. In practice, k(P′) remains close to K and the choice of k(P′)=K=constant is, however, often satisfactory.




It should be noted that these operations of radially deforming the decoration for the side of the chip in order to obtain the flat decoration image (radial folding-up and radial contraction transformation or, conversely, contraction along the side of the original decoration towards the edge of the reference face followed by radial folding) are capable of being carried out on a computerized workstation using computer-aided design software.




Of course, without departing from the scope of the invention, the gambling chip may be replaced by an object of similar shape made of a material capable of receiving a decoration by pad printing.




The operation of marking the side of a straight-sided gambling chip by pad printing secondarily with padprinting of one of the faces of the chip can be performed by various types of devices, machines or apparatuses. By way of non-limiting example,

FIG. 3

illustrates the principle of such an apparatus for implementing the invention, allowing one of the faces and the side of a disc-shaped gambling chip or of an object of similar shape to be marked simultaneously.




Considering

FIG. 3

, the reference


30


represents a horizontal support intended to act as a bearing surface for the solid-straight-sided chip


10


. An ink pad


34


is mounted on a frame


31


so as to be able to move in vertical reciprocating motion. The pad


34


has an axially symmetrical deformable head


36


of axis ZZ′ made of synthetic material (for example a synthetic silicone rubber having a Shore A hardness of about 6), in this case with a conical end


38


. As will be seen later, the deformable head


36


is designed to bed down on the face


12


and the edge


16


of the chip


10


while the straight side


14


is being marked. A plate holder


40


, carrying a flat ink plate


11


which incorporates the image of a side decoration (for example the decoration image


22


illustrated in FIG.


2


), is capable of reciprocating motion between the position vertically beneath the pad


34


(position


40


) and the position vertically beneath an ink reservoir


42


(position


40


′). The pad-printing operation is carried out in the following manner. After inking the plate


11


(position


40


′), the plate holder


40


is moved into the position


40


coaxial with the pad


34


so as to place the ring-shaped zone


20


of the plate


11


coaxially with the pad


34


. A first downward vertical movement of the pad


34


allows the ink to be picked up simply by applying pressure. After the pad


34


has been raised and the plate holder


40


retracted (back to the position


40


′), the pad


34


undergoes a second downward vertical movement in order to deposit the ink firstly by pressing on the face


12


of the chip


10


and then, by further deformation of the head of the pad


36


, on the side


14


. Marking with a monochrome (final or intermediate) decoration is thus achieved. In the case of multicolor printing, the final decoration is formed by a complementarity and/or superposition of monochrome decorations, each of these intermediate decorations being etched on separate plates. In the case of multicolor marking, either several movable plate holders or a series of monochrome pad-printing units associated with a movable chip-holder support are used. In general, the ink plates are etched to a depth of between 18 and 20 micrometers. Moreover, the various types of inks and/or varnishes suitable for pad printing can be used, especially UV-visible inks for discreet marking (for example in the case of chip identification numbers and/or codings).




It should be noted that, in the case of face-and-side marking, in order to solve the problem of the colors of the decoration marked in solid color on the side of the chip lightening (due to the reduction in the amount of ink deposited per unit area because of the stretching of the inked pad), use is made, according to the invention, of one of the two following variants:




either an ink plate having a halftone face decoration image (for example with 130 dots per inch) and a non-halftone side decoration image;




or an ink plate having a decoration image for a face of the chip and a deeply-etched side decoration image, the etching of the side decoration image (about 25 micrometers) then being deeper than the etching of the decoration image for the face of the chip (about 18 micrometers). Such a plate is obtained by using a suitable mask.




As may be seen in

FIGS. 4



a


and


4




b


, the chip is centered on the ZZ′ axis of the pad by retractable vertical centering slides


32


having curved internal walls complementas with the side


14


of the chip


10


and being mounted so as to slide axially on the perimeter of the support


30


. This centering operation, prior to the marking proper or in the initial phase of the marking, is important in order to position the chip


10


accurately with respect to the pad


34


, especially in the present case so that the edge


16


is in precise correspondence with its inked image on the conical end


38


of the pad


34


. After the conical end


38


has moved beyond the plane of the face


12


, the centering slides


32


gradually retract (by way of any known mechanical arrangement) in order to allow the head


38


of the pad


34


to deform along the side


14


, while bedding down on the edge


16


(the latter being sufficiently sharp to prevent undesirable slippage from the face


12


in the region of the edge) until complete inking of the side


14


when the end


38


(which is conical when not in use) of the deformable head


36


of the pad


34


is compressed (with the rim of the head


36


projecting slightly beyond the plane of the edge


17


of the lower face


13


of the chip


10


). Finally, in order to prevent the chip


10


from lifting while the pad


34


is being retracted, a mechanism is provided for holding the chip


10


in place on its support


30


, for example at least one adhesive patch


43


fixed to the support


30


, the patch


43


being in contact with the lower face


13


of the chip


10


bearing on the support


30


, and/or suction under partial vacuum (not shown). As a variant, it should be noted that the use of one or more patches


43


providing sufficient adhesion to ensure, once the chip has been centered by the slides


32


, that the chip is held in place while it is being marked. makes it possible to retract the slides


32


even before the actual marking of the chip


10


. Moreover, the slides


32


may be replaced by a retractable ring (not shown) mounted on the perimeter of the chip support


30


.




Preferably, the pad


34


has a deformable head


36


with a substantially conical end and with a working diameter Dt at least equal to the diameter of the chip increased by five times the height of the side of the chip, for example a minimum diameter Dt of 55 mm for the chip


10


with a diameter of 40 mm and a side height h of 3.3 mm.




Of course, the invention can be used with other types of pads, of various shapes and of various hardnesses, chosen from the manufacturers' standard ranges. Among these may be mentioned pads of cylindrical shape with a convex end, the diameter Dt of which satisfies the above criterion.




It is readily apparent that, using the marking method according to the invention, a small variation in the diameter of the chip, for example a few tenths of one mm, is distributed around the entire perimeter of the chip without affecting the circumferential continuity of the decoration thus marked.




As mentioned above, the invention also applies to soft-edged chips having a central straight side extending substantially over a large portion of the thickness of the chip and connected to the two faces of the latter by two transition zones (small fillets or broadened chamfers). By way of non-limiting example, the chip


60


shown diagrammatically in

FIG. 5

has a diameter of 40 mm for a total side height of 3.3 mm, consisting of approximately 2.5 mm of central straight side and of two transition fillets having a radius of between 0.4 and 0.5 mm (with a theoretical radius in the injection mould of 0.5 mm).




Of course, the invention as described by way of non-limiting example for the solid-straight-sided chip


10


, in particular the marking operations proper and its various variants, the marking device and its variants, the various pads, the general principle of preparing the plates by folding up onto the reference plane and radially contracting the intermediate decoration, and the plate-etching variants, is also applicable to a central-straight-sided chip, especially to the chip


60


illustrated in FIG.


5


. However, beyond a certain dimension of the fillet and/or of the broadened chamfer (which can vary depending on the specifities of the marking, on the chip and on the pad), the softened edge of the chip leads to slippage of the pad in the region of the softened edge which often requires making a correction to the placement of the internal border of the ring bearing the decoration image and, possibly, to the contraction coefficient K. Thus, the internal border of the ring


70


bearing the decoration image is generally moved closer to the center O of the chip


10


.





FIG. 5

shows, in diagrammatic cross-section, the chip


60


of axis ZZ′ with its reference face


62


of center O included in the reference plane Pref (half-axis OX) corresponding to the flat ink plate


61


, the peripheral circular border of the face


62


being shown by the point E. As illustrated in

FIG. 5

, the straight side of the chip


60


includes a straight side


64


(comprising a cylindrical surface of axis ZZ′ perpendicular to the plane Pref, which, projected on to the latter forms a circle of radius OJ and is represented by the segment FG) and of two transition zones, in this case two fillets


66


and


66


′ (comprising surfaces of revolution having the general shape of a spherical ring or of a cone and represented by the circular quadrants EF and GH, the point H on the other face


63


of the chip


60


being the equivalent of the point E on the face


62


).




The construction of the decoration image for the decoration


65


starts by that of the intermediate decoration


65


′ represented by the segment F′G′ obtained by the curved portion EFG being radially folded up, with development beyond the point E, onto the radius OX, where EF′=1.571 EJ and F′G′=FG. Next, the intermediate decoration is radially contracted (in this case, with K=0.6) and the internal circular border of the ring


70


, represented by the point F″, is moved closer to the centre O, in this case it is made to coincide with the point J, in order to obtain the final decoration image


72


on the ring


70


represented by F″G″ (with F″G″=K×F′G′=K×FG).




In order to make it easier to produce and position the decoration image, the position of the internal circular border of the ring


70


and the contraction coefficient K of the radial transformation are determined, for a given model of straight-sided chip (for example, the chip


60


having a side profile EFGH) and for a given pad, by marking the chip model using a positioning ink plate


80


centered on the axis ZZ′ of the clip and bearing a pattern


82


consisting of closely-spaced concentric circles. The pattern


82


, shown diagrammatically in

FIG. 5

by the segment M


1


M


23


, is in the form of a ring of center O, the mean radius OM of which is chosen to be close or equal to the radius, OJ of the chip model and the width of which is chosen to be about twice the height h of the chip. By way of non-limiting example, the pattern


82


used for the chip


60


has 23 closely-spaced concentric circles


84


numbered from M


1


to M


23


and, in this case, spaced apart by 0.3 mm for a pattern width of about 7 mm. Secondarily, the pattern has segments (not shown) of 64 equally distributed radii crossing the concentric circles


84


in order to determine the lateral broadening of the decoration image with the distance from the center O and to detect any possible lateral slippage of the pad. Thus, the positioning plate


80


is used to mark the straight side of the model of the chip


60


. Next, the row of the concentric circles Mi and Me corresponding to the points F″ and G″ (in this case, the row


12


and the row


17


, respectively illustrated by the circles M


12


and M


17


) are identified by counting along the marked chip. Of course, the central straight side of the chip


60


is marked by pad printing by using, in a manner already described, the device illustrated in

FIGS. 3

,


4




a


and


4




b


(the chip


60


replacing the chip


10


).



Claims
  • 1. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a section for at least a portion of said side of said chip; radially deforming said section to form a second decoration; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that said second decoration transfers to said pad; and moving said pad coaxially into contact with said chip such that said second decoration transfers to said side to print said section on said side; wherein a contraction coefficient of said radially deforming is determined, for a given straight-sided chip and a given pad, by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern comprising closely-spaced concentric circles.
  • 2. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a section for at least a portion of said side of said chip; radially deforming said section to form a second decoration; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that said second decoration transfers to said pad; and moving said pad coaxially into contact with said chip such that said second decoration transfers to said side to print said section on said side; wherein said radially deforming further comprises compressing said section and flattening said section into a plane defined by one circular face of the chip to form a ring around said face, said ring being included in a circular ring area having inner and outer circular borderlines by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern including concentric circles.
  • 3. A method for marking a side of a straight-sided chip with a decoration by pad printing, said method comprising:providing an ink plate with an image defined by a radially deformed representation of the decoration of the straight side of the chip in a ring-shaped zone; moving a pad coaxially into contact with said ink plate such that said image transfers to said pad; moving said pad coaxially into contact with said chip such that said image transfers to said side of said chip with said side being marked with said decoration; forming said image, said forming further comprising radially folding up said decoration for said side of said chip around a facial edge of said chip in a plane; contracting said decoration for said side of the said chip toward said facial edge; wherein a contraction coefficient of said radially deforming is determined, for a given straight-sided chip and a given pad, by marking a chip model using a positioning ink plate centered on an axis of the chip, the positioning ink plate bearing a pattern comprising closely-spaced concentric circles.
  • 4. A method for pad-printing a substantially cylindrical chip having opposing faces and a side, said method comprising:forming a first decoration, including a first section for one of said opposing faces and a second section for at least a portion of said side of said chip; radially deforming said second section to form a second decoration, said second decoration including said first section and a radially deformed second section; providing an ink plate with said second decoration; moving a pad coaxially into contact with said ink plate such that second decoration transfers to said pad; moving said pad coaxially into contact with said chip such that said second decoration transfers to said chip with said radially deformed second section being transferred to said side to print said second section; said radially deforming further comprising flattening said second section into a plane declined by said first section to form a ring around said first section, and shrinking said second section radially inwardly toward a center of said first section; and said shrunken second section being included in a circular ring area having inner and outer circular borderlines determined, for a given straight-sided chip and a given pad, by marking chip models using a positioning ink plate centered on an axis of the chip and bearing a pattern including concentric circles.
Priority Claims (1)
Number Date Country Kind
97 03872 Mar 1997 FR
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application 09/147,253, filed Nov. 12, 1998, now U.S. Pat. No. 6,176,185, which is a national stage application, under 35 U.S.C. §37, of international application No. PCT/FR98/00485, filed Mar. 11, 1998, not published under PCT Article 21(2) in English.

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Continuations (1)
Number Date Country
Parent 09/147253 US
Child 09/638031 US