| Number | Date | Country | Kind |
|---|---|---|---|
| 57-63702 | Apr 1982 | JPX |
| Number | Name | Date | Kind |
|---|---|---|---|
| 3527093 | Sellers | Sep 1970 | |
| 4346602 | Gould et al. | Aug 1982 |
| Number | Date | Country |
|---|---|---|
| 29792 | Mar 1977 | JPX |
| Entry |
|---|
| R. P. Anjard, "Thick Film Conductor Adhesion Testing", Microelectronics and Reliability, v. 10, (1971), pp. 269-275. |
| K. L. Mittal, "Adhesion Measurement of Thin Films," Electrocomponent Science and Technology, v. 3, No. 1, (Jun. 1976), pp. 21-42. |