This application claims the benefit of Taiwan application Serial No. 96122581, filed Jun. 22, 2007, the subject matter of which is incorporated herein by reference.
1. Field of the Invention
The invention relates in general to a method for measuring thickness and a measuring device using the same, and more particularly to a method for measuring thickness of a transparent layer and a measuring device using the same.
2. Description of the Related Art
The method for measuring the thickness of the material layer in an optical disc is usually executed by a white light spectrometer. Referring to
Currently, another method for measuring thickness by way of a laser interferometer is available. A laser beam is emitted to the optical disc and passing through the material layer, the interference fringe of the laser beam reflected by the material layer is received by a sensor. Then, the fringe period is calculated via a fast Fourier transform (FFT) calculation, and the thickness is obtained accordingly. However, when the above method is used for measuring the thicknesses of multi-material layers, for example, for measuring the thicknesses of the material layers of a single-side-double-layered DVD optical disc, a more complicated interference fringe will be resulted. Furthermore, the peak value obtained from the FFT will be extended and shifted because of the dispersion of each material. As a result, the thicknesses calculated from above method need correct.
The invention is directed to a method for measuring thickness and a measuring device using the same. The thicknesses of different transparent layers are obtained according to a focus error signal (FES) of a refracted beam. The thicknesses of the material layers are obtained instantly and correctly in this invention. Since no additional element is required, the measuring method and the measuring device using the same are compatible with the optical disc driving system.
According to one aspect of the present invention, a method for measuring thickness of a transparent layer is provided. The transparent layer has a first face, a second face and a normal direction. First, a light beam with a focal point is emitted to the transparent layer. Next, a focus error signal (FES) is generated according to a refracted beam of the light beam. Then, the focal point is moved along the normal direction and passes through the first face and the second face. The FES converts into a first focus error curve and a second focus error curve respectively when the focal point passes through the first face and the second face. Afterwards, the thickness of the transparent layer is obtained according to the first focus error curve and the second focus error curve.
According to another aspect of the present invention, a method for measuring thicknesses of multiple transparent layers of an optical storage medium is provided. The optical storage medium has a first face, a second face, a third face and a normal direction. First, a light beam with a focal point is emitted to the medium. Next, an FES is generated according to a refracted beam of the light beam. Then, the focal point is moved along the normal direction and passes through the first face, the second face and the third face. The FES converts into a first focus error curve, a second focus error curve and a third focus error curve respectively when the focal point passes through the first face, the second face and the third face. Afterwards, the thicknesses of the transparent layers are obtained according to the first focus error curve, the second focus error curve and the third focus error curve.
According to a further aspect of the present invention, a measuring device for measuring thickness of a transparent layer is provided. The transparent layer has a first face, a second face and a normal direction. The measuring device includes a light emitting element, a sensing element and a processing element. The light emitting element is used for emitting a light beam to the transparent layer. The sensing element is used for sensing a refracted beam of the light beam, and an FES is generated according to the refracted beam. The processing element is connected to the sensing element. The FES converts into a first focus error curve and a second focus error curve respectively when a focal point of the light beam moves along the normal direction and passes through the first face and the second face. The processing element obtains the thickness of the transparent layer according to the first focus error curve and the second focus error curve.
The invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
Two embodiments are disclosed below for elaborating the details of the invention, but these embodiemtns are not for limiting the scope of protection of the invention. Besides, unnecessary elements are omitted in the drawings of the following embodiments to clearly highlight the technical features of the invention.
The method for measuring thickness disclosed in the present embodiment of the invention is exemplified by the thickness mearurement of a transparent layer. First, a light beam with a focal point is emitted to the transparent layer. Next, a focus error signal (FES) is generated according to a refracted beam of the light beam. Then, the focal point is moved along a normal direction of the transparent layer and passes through a first face and a second face of the transparent layer. The FES converts into a first focus error curve and a second focus error curve respectively when the focal point passes through the first face and the second face. In the method for measuring thickness of the present embodiment of the invention, the thickness of the transparent layer is obtained according to the first and the second focus error curve.
The method for measuring thickness of the present embodiment of the invention is executed by a thickness measuring device. Referring to
The measuring device 50 further includes a focusing element 27, a beam splitter 31 and an astigmatic lens 29. The focusing element 27 and the beam splitter 31 are disposed between the light emitting element 21 and the transparent layer 10. The light beam Lin emitted by the light emitting element 21 preferably passes through the beam splitter 31 and the focusing element 27 sequentially, and then the light beam Lin is focused by the focusing element 27 to form a focal point P. In the present embodiment of the invention, the focal point P is moved by way of moving the focusing element 27 along the normal direction F1. The light beam Lin is partly reflected when emitted to the transparent layer 10. The reflected light beam is refracted to the astigmatic lens 29 by the beam splitter 31, and then the light is refracted by the astigmatic lens 29 to form the refracted beam Lrf. Then, the refracted beam Lrf is projected on the sensing element 23. Normally, the astigmatic lens 29 is a cylindrical lens. When the focal point P is located at different positions on the transparent layer 10, the refracted beam Lrf passing through the astigmatic lens 29 is focused as different focusing states accordingly. The sensing element 23 preferably is a four-quadrant optoelectronic detector which outputs the FES S1 according to the distribution of the light spots projected on the detector by the refracted beam Lrf. Any one who is skilled in the technology of the invention will undersand the theory and function of the four-quadrant optoelectronic detector as well as the generation of the FES S1, and the details thereof are not repeated here.
In the present embodiment of the invention, the transparent layer 10 is exemplified by a cover layer of an optical storage medium. The focusing element 27 is preferably moved with respect to the transparent layer 10 along the normal direction F1 at a fixed period. Meanwhile, the optical storage medium is rotated for detecting the thickness at different positions thereof. Afterwards, the relationship between the intensity of the FES S1 and the change in the shift of the focusing element 27 is recorded and charted into curves to show the change in the FES. Referrig to
In the first embodiment of the invention disclosed above, the light emitting element 21 preferably is a laser diode. That is, the light beam Lin is a laser beam, and diameter of the focal point P for measuring thickness is largely reduced from a convention dimension of 500 micrometer (μm) to approximately 1 μm or even less than 1 μm. Thus, the resolution of thickness measurement is effectively improved, and the error of thickness measurement is largely reduced. Furthermore, because the thickness of the transparent layer 10 is obtained by the processing element 25 from the FES S1 directly, the conventional FFT is omitted. Therefore, the calculating time for obtaining the thickness could be largely shortened and the efficiency of the measuring device 50 could be further improved. Moreover, the method for measuring thickness and measuring device 50 using the same disclosed in the present embodiment of the invention could determine the thickness of the material layer of an optical disc according to the FES S1 without adding any elements. The method for measuring thickness and measuring device 50 using the same disclosed in the present embodiment of the invention are compatible with conventional optical disc detecting system or optical disc driving system, and further saving the cost for developing new measuring devices.
The method for measuring thickness and measuring device using the same according to the preferred embodiment of the invention can also be used to measure thickness of each transparent layer of an optical storage medium having more than two transparent layers. In the present embodiment of the invention, the optical storage medium is exemplified by having two transparent layers, and the disposition of the elements of the measuring device is similar to that of the measuring device 50 in the above-decribed first embodiment (as indicated in
The measuring method of the present embodiment of the invention includes the following steps. First, a light beam is emitted to an optical storage medium. Next, an FES is generated according to a refracted beam of the light beam. The detailed description of these steps is similar to that of the first embodiment, and is not repeated here. Afterward, the focal point is moved along a normal direction of the optical storage medium. Referring to
In the method for measuring thickness and measuring device using the same disclosed in the second embodiment of the invention, the FES S1 correspondignly converts into many focus error curves when the focal point passes through many faces, and the processing element 25 obtains the thickness of each transparent layers according to the focus error curves, such that the thickness of the optical storage medium having multiple layers can be measured promptly and accurately.
According to the method for measuring thickness and measuring device using the same disclosed in the above embodiments of the invention, a laser beam is emitted to the transparent layer of the optical storage medium for measuring thickness. The method for measuring thickness and measuring device using the same disclosed in the invention are not only increasing the resolution of measurement, but also improving the precision of measurement. Besides, as the FES is used for obtaining the thickness of the transparent layer, the conventional FFT can be omitted. Therefore, the measuring method is simplified and the efficiency of measurement is improved. Next, as the focal point is moved to pass through different faces, the thickness of each transparent layer is measured during each moving period of the focal point, and hence the detecting capability of the measuring device could be improved and the type of applicable optical storage medium are various. Furthermore, the method for measuring thickness and measuring device using the same are compatible with conventional optical disc detecting system or optical disc driving system, hence further saving the cost for developing new measuring devices.
While the invention has been described by way of example and in terms of preferred embodiments, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Number | Date | Country | Kind |
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96122581 | Jun 2007 | TW | national |