Claims
- 1. A method for locking a round wire in a groove in a substrate in which the wire is disposed entirely below the surface of the substrate comprising the steps of employing a deformable substrate, providing a member having a generally concave cut out portion between two projecting ears, the cut out portion having a diameter greater than the diameter of the wire, bringing the member into contact with the substrate so that the cut out portion stradles the wire and moving the member toward the substrate until the cut out portion essentially contacts the top of the wire deforming the substrate so that the substrate material flows onto the wire thereby locking the wire in the groove.
- 2. A method for locking an electrically conductive wire in a groove in a substrate comprising the steps of providing a substrate of deformable material, forming a groove in a surface of the substrate, placing the wire in the groove, deforming portions of the substrate at spaced locations along the longitudinal axis of the groove and adjacent thereto so that substrate material will flow onto and substantially cover axially spaced portions of the wire thereby locking the wire in the groove while leaving other axially spaced portions of the wire exposed to allow electrical connection with such exposed portions.
- 3. A method for locking an electrically conductive wire in a groove according to claim 2 in which the wire is round having a diameter d and the groove is formed with a width no less than d and a depth greater than d.
Parent Case Info
This is a division of application Ser. No. 747,654, filed Dec. 6, 1976, now U.S. Pat. No. 4,123,627, issued Oct. 31, 1978.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
747654 |
Dec 1976 |
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