Claims
- 1. An aluminum nitride sinter shaped material, prepared by a process which comprises the steps of (a) reacting an organic aluminum compound with an aminotriazine in a solvent to obtain an aluminum nitride precursor, (b) separating the aluminum nitride precursor from the solvent, (c) heating/calcining the aluminum nitride precursor first in a reducing gas atmosphere at a temperature of 600.degree.-1,300.degree. C. and then successively in an inert gas atmosphere at a temperature of 1,400.degree.-1,650.degree. C., to produce aluminum nitride powder having a carbon content of not more than 0.2% by weight, (d) molding the aluminum nitride powder into a desired shape, and (e) then sintering the thus-shaped material.
- 2. An aluminum nitride sinter shaped material according to claim 1 wherein the aluminum nitride precursor is obtained as a precipitate.
- 3. An article of manufacture comprising an alumina circuitboard substrate having, as a coating on a surface thereof, an aluminum nitride sinter shaped material of claim 1.
- 4. An aluminum nitride sinter shaped material according to claim 1, wherein the aluminum nitride is prepared from an alkylaluminum compound represented by the general formula
- R.sub.n .multidot.Al.multidot.X.sub.3-n
- wherein R is a lower alkyl group having 1 to 10 carbon atoms, n is 1, 1.5, 2 or 3, and X is a hydrogen atom or a halogen atom; wherein the molar ratio of the number of the amino groups in the aminotriazine compound to the organic aluminum compound is from 1 to 10; wherein the aminotriazine is dispersed in the solvent to from a slurry and this slurry is fed to a reaction zone for reaction with the organic aluminum compound; wherein the aluminum nitride precursor is obtained as a precipitate, which is separated from the solvent prior to the heating/calcinating step; and wherein the heating/calcination operation of the separated aluminum nitride precursor is carried out at a temperature of 600.degree. C. or more, first in a reducing gas atmosphere and thereafter in an inert gas atmosphere.
- 5. An article of manufacture comprising an aluminum sinter shaped material according to claim 4, wherein prior to or as part of the sintering step, the aluminum nitride percursor is molded into a shaped material as a coating on an alumina circuitboard substrate.
- 6. An article of manufacture according to claim 5, wherein the sintering operation is carried out in a non-oxidizing atmosphere. powder into a desired shape, and (e) then sintering the thus shaped material.
- 7. An aluminum nitride sinter shaped material according to claim 1, wherein the carbon content of the aluminum nitride powder is 0.1% by weight or less.
- 8. An aluminum nitride sinter shaped material according to claim 1, wherein the carbon content of the aluminum nitride powder is about 0.01% by weight.
- 9. An article of manufacture comprising an aluminum nitride sinter shaped material according to claim 3, wherein the carbon content of the aluminum nitride powder is 0.1% by weight or less.
- 10. An article of manufacture comprising an aluminum nitride sinter shaped material according to claim 3, wherein the carbon content of the aluminum nitride powder is about 0.1% by weight.
Priority Claims (3)
Number |
Date |
Country |
Kind |
62-187703 |
Jul 1987 |
JPX |
|
65-78188 |
Apr 1988 |
JPX |
|
63-78189 |
Apr 1988 |
JPX |
|
Parent Case Info
This is a division of U.S. application Ser. No. 07/226,021, filed July 29, 1988, now U.S. Pat. No. 4,869,925.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
226021 |
Jul 1988 |
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