Claims
- 1. A method for preparing cleaning solutions for cleaning objects, said method comprising the step of dissolving in deionized water hydrogen gas, or a mixture of hydrogen gas and an inert gas, by controlling a supply pressure of said gas at a value exceeding atmospheric pressure, wherein controlling the supply pressure at a value exceeding atmospheric pressure increases the amount of gas dissolved and reduces the amount of time necessary to dissolve the gas relative to controlling the supply pressure at a pressure exceeding atmospheric pressure.
- 2. The method for preparing cleaning solutions according to claim 1, wherein, while dissolving said gas in deionized water, the supply pressure of said gas is controlled at absolute pressures in a range from a pressure exceeding atmospheric pressure to 5 kgf/cm2.
- 3. The method for preparing cleaning solutions according to claim 1, wherein said deionized water is degassed and then said gas is dissolved in the degassed deionized water.
- 4. The method for preparing cleaning solutions according to claim 1, wherein said gas is dissolved by diffusing said gas in deionized water through a gas permeable membrane.
- 5. The method for preparing cleaning solutions according to claim 1, wherein said gas is supplied from a high-pressure cylinder and the supply pressure of said gas is controlled by a pressure reducing valve.
- 6. A method for preparing cleaning solutions according to claim 1, wherein a water electrolyzer is used as gas supply source for said gas and the supply pressure or said gas is controlled by controlling the pressure of water supplied to said electrolyzer.
- 7. The method of claim 1, wherein the gas is dissolved in a container that maintains the gas in a pressurized state.
- 8. The method of claim 1 wherein the object comprises an electronic part.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9-167780 |
Jun 1997 |
JP |
|
10-166695 |
Jun 1998 |
JP |
|
Parent Case Info
This application is a division of U.S. application Ser. No. 09/103,573, filed Jun. 24, 1998, U.S. Pat. No. 6,086,057.
US Referenced Citations (17)
Foreign Referenced Citations (2)
Number |
Date |
Country |
61-254219 |
Nov 1986 |
JP |
403041729 |
Feb 1991 |
JP |