Claims
- 1. A method for preserving a wood substrate, comprising:
providing an aqueous preservative composition comprising a soluble copper complex selected from the group consisting of soluble copper-monoethanolamine complex, a soluble copper-ammonia complex, or a mixture thereof; adding at least one acid to reduce the pH of the aqueous preservative composition to a value ranging from about 6.5 to about 8; and injecting the pH-adjusted aqueous preservative composition into the wood substrate, wherein the pH-adjusted aqueous preservative composition is injected in an amount sufficient to provide at least 0.1 percent by weight of solubilized copper to the wood substrate.
- 2. The method of claim 1, wherein the pH-adjusted aqueous preservative composition has a pH ranging from about 7.2 to about 8.1, and wherein the pH-adjusted aqueous preservative composition is injected in an amount sufficient to provide at least 0.25 percent by weight of solubilized copper to the wood substrate.
- 3. The method of claim 1, wherein the pH-adjusted aqueous composition has a pH of from about 7.5 to about 8.0.
- 4. The method of claim 1, further comprising the step of drying the wood substrate injected with the pH-adjusted aqueous composition to remove water, monoethanolamine, ammonia, or both, wherein the quantity of monoethanolamine and/or ammonia removed from the wood substrate is greater than the amount of monoethanolamine and/or ammonia that would be removed if the wood substrate was injected by a composition that did not have the pH adjusted.
- 5. The method of claim 2, wherein a copper salt is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate.
- 6. The method of claim 5, wherein a copper hydroxide material is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate.
- 7. The method of claim 2, wherein a basic copper salt is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate.
- 8. The method of claim 2, wherein the acid is selected from the group consisting of sulfuric acid, hydrochloric acid, phosphoric acid, phosphorous acid, nitric acid, boric acid, ascorbic acid, acetic acid, propionic acid, and combinations thereof.
- 9. The method of claim 2, wherein the acid comprises boric acid.
- 10. The method of claim 3, wherein the acid comprises boric acid.
- 11. The method of claim 2, wherein the acid comprises citric acid.
- 12. The method of claim 2, wherein the acid comprises acetic acid.
- 13. The method of claim 2, wherein the acid comprises phosphoric acid.
- 14. The method of claim 3, wherein the pH-adjusted aqueous composition further comprises a biocide.
- 15. A method for preserving a wood substrate, said method comprising:
preparing an aqueous preservative solution comprising a soluble copper complex selected from the group consisting of a copper-alkanolamine complex, a copper-ammonia complex, or both; adding at least one acid to adjust the pH of the aqueous solution comprising the copper complex to a value ranging from about 7.2 to 8.1; and injecting the pH adjusted aqueous preservative solution comprising a copper-alkanolamine complex onto and/or into a wood substrate, wherein there is no measurable precipitation of copper salts from the pH-adjusted aqueous solution prior to injection, and wherein a copper salt is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate, wherein the pH-adjusted aqueous preservative solution is injected in an amount sufficient to provide from about 0.1% to 2% by weight of solubilized copper in the wood substrate.
- 16. The method of claim 15, further comprising the step of drying to remove water and a portion of the alkanolamine, a portion of the ammonia, or both, wherein the quantity of alkanolamine and/or ammonia removed from the wood substrate is greater than the amount of monoethanolamine and/or ammonia that would be removed if the wood substrate was injected by a composition that did not have the pH adjusted.
- 17. The method of claim 15, wherein the aqueous preservative solution comprises a copper-alkanolamine complex.
- 18. The method of claim 15, wherein a copper hydroxide material is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate.
- 19. The method of claim 15, wherein a basic copper salt is precipitated from the pH-adjusted aqueous composition after the composition has been injected into the wood substrate.
- 20. The method of claim 15, wherein the acid is selected from the group consisting of sulfuric acid, hydrochloric acid, phosphoric acid, phosphorous acid, nitric acid, boric acid, ascorbic acid, acetic acid, propionic acid, and combinations thereof.
- 21. The method of claim 15, wherein the acid comprises boric acid, and wherein the pH adjusted aqueous preservative solution comprises an amount of copper-alkanolamine complex and/or copper-ammonia complex in an amount sufficient to provide from about 0.25% by weight of solubilized copper in the wood substrate.
- 22. The method of claim 15, wherein the pH-adjusted aqueous composition further comprises a second biocide.
- 23. A method for preserving a wood substrate, said method comprising:
providing an aqueous solution comprising a soluble copper complex selected from the group consisting of a soluble copper complex selected from the group consisting of a copper-alkanolamine complex, a copper-ammonia complex, or both, adding at least one acid to adjust the pH of the aqueous solution comprising the copper complex to a value that causes the formation of an injectable copper salt precipitate, thus creating an aqueous suspension of a copper salt precipitate; and injecting the pH adjusted copper salt suspension into a wood substrate, wherein the pH-adjusted copper salt suspension is injected in an amount sufficient to provide at least about 0.1% by weight of solubilized copper in the wood substrate.
- 24. The method of claim 23, wherein the pH is adjusted to a value ranging from about 6.5 to about 7.5.
- 25. The method of claim 24, wherein the pH is adjusted to a value ranging from about 6.75 to about 7.25.
- 26. The method of claim 25, wherein the pH is adjusted to a value ranging from about 7 to about 7.3.
- 27. The method of claim 23, wherein the pH-adjusted aqueous composition further comprises a biocide, wherein a portion of the biocide adheres to the precipitate.
- 28. The method of claim 23, further comprising the step of drying to remove water and a portion of the alkanolamine, a portion of the ammonia, or both, wherein the quantity of alkanolamine and/or ammonia removed from the wood substrate is greater than the amount of monoethanolamine and/or ammonia that would be removed if the wood substrate was injected by a composition that did not have the pH adjusted.
- 29. The method of claim 23, wherein the acid is selected from the group consisting of sulfuric acid, hydrochloric acid, phosphoric acid, phosphorous acid, nitric acid, boric acid, ascorbic acid, acetic acid, propionic acid, and combinations thereof.
- 30. The method of claim 23, wherein the copper salt suspension comprises particulates, at least 99% by weight of which have an average diameter determined by Stokes Law in water of less than 0.6 microns.
- 31. The method of claim 30, wherein the copper salt suspension comprises particulates, at least 99% by weight of which have an average diameter determined by Stokes Law in water of less than 0.4 microns.
- 32. The method of claim 31, wherein the copper salt suspension comprises particulates, at least 99% by weight of which have an average diameter determined by Stokes Law in water of less than 0.2 microns.
- 33. A method for preserving a wood substrate, said method comprising:
providing an aqueous composition comprising a soluble copper-monoethanolamine complex; adding an acid to adjust the pH of the aqueous composition comprising the soluble copper monoethanolamine complex to a value ranging from about 7.5 to 8.0; and injecting the pH-adjusted aqueous composition into a wood substrate, wherein the pH-adjusted aqueous composition is injected in an amount sufficient to provide between 0.5% and 2.0% by weight of solubilized copper in the wood substrate.
- 34. The method of claim 33, wherein the acid is sulfuric acid.
- 35. The method of claim 33, wherein the acid is phosphoric acid.
- 36. The method of claim 33, wherein the acid is boric acid.
- 37. A method for preserving a wood substrate, said method comprising:
preparing an aqueous solution comprising a copper-monoethanolamine complex; adding an acid to adjust the pH of the aqueous solution to a value between 6.5 and 7.4, wherein a copper salt precipitate forms, thus creating an aqueous suspension of an injectable copper salt precipitate; and injecting the pH adjusted copper salt suspension into a wood substrate, wherein the pH-adjusted copper salt suspension is injected in an amount sufficient to provide between 0.5% and 2.0% by weight of solubilized copper in the wood substrate.
- 38. The method of claim 37, wherein the copper salt suspension comprises particulates, at least 99% by weight of which have an average diameter determined by Stokes Law in water of less than 0.4 microns.
- 38. The method of claim 37, wherein the copper salt suspension further comprises an organic biocide.
- 39. A wood substrate made according to the method of claim 1.
- 40. A wood substrate made according to the method of claim 23.
- 41. A wood substrate made according to the method of claim 33.
- 42. A wood substrate made according to the method of claim 37.
RELATED APPLICATIONS
[0001] The present application claims priority to pending U.S. provisional application No. 60/478,824 filed on Jun. 17, 2003, the contents of which are incorporated herein by reference thereto, and also to pending U.S. provisional application No. 60/478,823 filed on Jun. 17, 2003, the contents of which are also incorporated herein by reference thereto.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60478824 |
Jun 2003 |
US |
|
60478823 |
Jun 2003 |
US |