Claims
- 1. A method for producing a chip module, which comprises:punching a metal chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance; subsequently reducing the given distance between the chip carrier fixing section and the chip carrier contact sections to a given dimension by a swaging operation carried out at least in a region close to the slots; placing an electronic chip on the chip carrier fixing section; leading terminal wires of the chip to the chip carrier contact sections; and encapsulating the chip along with the terminal wires on the chip carrier with a sealing mass prevented from flowing through the slots by the given dimension.
- 2. The method according to claim 1, which comprises reducing a material thickness of the chip carrier with the swaging operation to 30 to 70% of an original material thickness.
- 3. The method according to claim 1, which comprises reducing a material thickness of the chip carrier with the swaging operation to 50% of an original material thickness.
- 4. The method according to claim 1, which comprises the slots are constricted by the swaging operation to a width of 4-7 μm.
- 5. The method according to claim 1, which comprises the slots are constricted by the swaging operation to a width of 5 μm.
- 6. A method for producing a chip module, which comprises:punching a metal chip carrier having first and second opposite sides to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots; subsequently forming a depression into a region adjacent the slots on the first side of the chip carrier by a swaging operation defining a receiving space; placing an electronic chip on the chip carrier fixing section on the second side of the chip carrier; leading terminal wires of the chip to the chip carrier contact sections; and encapsulating the chip along with the terminal wires on the chip carrier with a sealing mass passing through the slots into the receiving space.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 32 915 |
Jul 1997 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation of copending International Application No. PCT/DE98/02046, filed Jul. 21, 1998, which designated the United States.
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Number |
Name |
Date |
Kind |
5028741 |
Sanders et al. |
Jul 1991 |
A |
5122860 |
Kikuchi et al. |
Jun 1992 |
A |
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43 36 501 |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE98/02046 |
Jul 1998 |
US |
Child |
09/494776 |
|
US |