METHOD FOR PRODUCING A DATA CARRIER

Abstract

The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting methods or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Description

[0001] This invention relates to a method for producing a data carrier having at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface relief in the form of a lens structure. Further the invention relates to a data carrier produced by this method and to an apparatus for carrying out the method.

[0002] There have been efforts for some time to provide data carriers such as ID cards, credit cards or papers or value with special security features having a striking, uncopiable visual effect, on the one hand, and ensuring cost-effective production, on the other hand.

[0003] For example, EP 0 219 012 A1 discloses a multilayer data carrier with a transparent cover foil in which a surface relief in the form of a lens structure, preferably a cylinder lens screen, is incorporated. Through this lens screen information is incorporated by means of a laser in subjacent volume areas of the data carrier, being visually well recognizable as blackened areas. By reason of the focal effect of the lenses, only narrowly limited areas of the data carrier are blackened so that the information can only be observed at the viewing angle corresponding to the angle of incidence of the laser on the lens structure. In this way one can inscribe several pieces of information recognizable only at certain viewing angles by using different inscription angles. This effect will be called a “tilt image” in the following.

[0004] This tilt image has a variety of security-related advantages. For example it is reproducible neither with photographic means nor with copying technology, since the tilt image information is never all present at one camera angle simultaneously. The false data carrier consequently only shows one part of the information and this at all viewing angles. The tilt image effect has vanished. Moreover the laser inscription offers additional protection from forgery. Laser inscription produces visible changes in the interior of the data carrier material that cannot be removed or altered either chemically or mechanically without completely destroying the data carrier.

[0005] This security feature also offers some advantages with respect to economical production of data carriers. Inscription of the lens screen area takes place only after completion of the data carrier, so that any rejects that occur are not inscribed and complicated runs for subsequently producing a new data carrier with the same data record are therefore avoided. This holds in particular if the tilt image information is user-related.

[0006] The lens structure was hitheto produced by embossing with an embossing die either during production of the data carrier or after its completion. However the heating of the data carrier material and the pressure exerted thereupon can easily cause irreparable distortions and disturbing embossings through to the back of the data carrier, which is frequently used as a printing surface.

[0007] Therefore the lens structures are preferably incorporated during lamination of the data carriers by providing one of the laminating plates with the negative lens screen structure. Since lamination is usually done in sheet format, the laminating plate must have the suitable negative relief structure in the area of each individual copy. This has the disadvantage that the entire laminating plate must be replaced as soon as an error occurs in the area of one copy.

[0008] It is known from EP 0 323 108 that a security card has a transparent cover layer with parallel lenses on the surface thereof and is applied to a substrate. Picture motifs applied to the substrate are visible through the lens structure selectively in accordance with the viewing angle with respect to the card. At least one of the picture motifs contains information permitting the validity and legitimacy of use of the card to be checked. The lens system is for example cast in or embossed on the flat cover layer with all the resulting disadvantages as described above

[0009] The invention is therefore based on the problem of proposing a method for providing data carriers with surface structures, in particular lens structures, without distortions and economically even in short runs without the stated disadvantages of the prior art.

[0010] Solutions to this problem are stated in the independent claims. Developments can be found in the respective sub-claims.

[0011] According to a preferred embodiment the relief structure is incorporated with the aid of accordingly formed cutting tools, such as planing or grinding tool, in the data carrier consisting of a transparent plastic in the area of the lens structure to be incorporated. As apparent from polished samples, this removal method can produce a very smooth lens surface with good optical quality. This method is suitable for all conventional data carrier materials, in particular thermostable materials such as PC with which usual embossing methods cannot be applied. By reason of the material removal, the data carrier produced by this method has a lens structure slightly sunk in from the data carrier surface, i.e. the thickness of the data carrier is not altered by the lens structure as with known data carriers. This fact is of great advantage in particular for stacking the inventive data carriers. By sinking or quasi embedding the lens structure in the data carrier one more over protects the lens surface optimally against wear due to environmental influences.

[0012] According to a further embodiment one can also use individual matrixes working on a given stepwise heating and pressure cycle in order to avoid distortions or the data carrier material. For this method one preferably uses and apparatus having several embossing units working in parallel. When an individual data carrier runs into the apparatus an embossing die is mounted on the data carrier, being jointly moved with the card along a given, for example circular, transport path. During transport through the embossing apparatus the jointly moved embossing die is heated in accordance with the given working cycle and cooled after the data carrier material has slowly softened and been put in the desired form. Jointly moving the heating and cooling device has the advantage that the entire transport time can be utilized as process time. Alternatively the heating/cooling device can also be stationary, however, which has the advantage that the temperature can be adjusted in central and stationary fashion for the entire apparatus. The data carriers are thereby clocked through the stationary heating/cooling units together with the mounted embossing dies.

[0013] The option of being able to control the temperature and pressure cycle within wide limits without having to accept any great disadvantages with respect to productivity, also makes it possible to produce by this method data carriers wherein the lens structure leads to no increase in the data carrier thickness. Due to the slow change of state the data carrier material can be deformed very uniformly and without distortions and the surplus data carrier material distributed uniformly over the entire data carrier.

[0014] In order to minimize the risk of distortions further, one an provide the data carrier surface before the embossing process with a layer of lacquer which is thermoplastically deformable during embossing and only completely cured afterwards. The cured lacquer layer acts as a kind of fixing layer for the subjacent thermally softened zone of the data carrier material, which can cool off completely without distortion after the actual embossing process and cure in the form given by the lacquer layer. However it is also possible to emboss only into the lacquer layer. In this case the danger of distortions is averted completely since the data carrier material itself is not stressed during embossing.

[0015] If the data carrier is to be equipped with a locally limited tilt image element, distortions and signs or wear can also be avoided by producing the tilt image element and a separate single element and then incorporating it into an accordingly dimensioned gap in the data carrier.

[0016] The lens element can be produced for example by a continuous embossing method wherein a transparent foil is provided with the desired structure by web-fed embossing. It is likewise conceivable to equip the foil with the suitable surface contour already during extrusion. The foil is then punched into the single elements in fastened in the data carrier gap by gluing or welding for example. A further possibility is offered by injection molding, with which single elements of the desired form can be produced directly.

[0017] Embodiments are also possible in which the data carrier or parts thereof are produced by injection molding. For example one can injection mold a data carrier having the lens structure locally limited on one of its surfaces, the apex areas of the lens structure preferably ending flush with the data carrier surface. On the opposite side of the data carrier one provides below the lens structure a gap in which a separately produced plastic element is inserted; This element is specially adapted to the requirements of laser inscription since either the element material is mixed with additives which absorb laser radiation, or the element is coated with an accordingly prepared lacquer layer on the side facing the ,data carrier.

[0018] A further variant is to injection mold a plastic foil at least on one side with a translucent layer having the lens structure in a partial area. If the foil is provided by injection molding with a cover layer on both sides, the second over layer can also have a lens structure in a certain area. In a special embodiment the lens structures can be disposed congruently or at least concentrically with each other. If necessary the plastic foil can be provided, before the cover foils are applied, with a coating sensitized for absorbing laser radiation in the area of the lens screen to be applied.

[0019] The latter methods can do completely without complicated and elaborate embossing apparatuses within the production line of the data carriers. This permits more economical and efficient production. Producing continuously embossed foils or injection molding single elements is cost-effective since one can do long run in a continuous process that need only be adapted to the boundary conditions for this one process. There are a longer problems such as embossing through to the back of the data carrier or distortions.

[0020] The inventive methods further have the advantage that they can he performed on the card when its layer structure is refinished, so that problems with rejects are easy handle. If a processing step has been improperly executed the data carrier in question can be immediately eliminated and replaced with a following one.

[0021] Further advantages and advantageous embodiments will be explained with reference to the figures. It is pointed out that the figures only sketch the essential method steps and are not to be understood either as complete, as true-to-scale representations of the individual apparatuses.

[0022] FIG. 1 shows a data carrier with a tilt image,

[0023] FIG. 2 shows a grinding apparatus for incorporating the lens structure into the data carrier in cross section,

[0024] FIG. 3 shows a side view of the grinding apparatus with air cooling,

[0025] FIG. 4 shows a sketch of a wet grinding apparatus

[0026] FIG. 5 shows a milling apparatus for incorporating the lens structure into the data carrier,

[0027] FIG. 6 shows a data carrier with a thin lacquer layer, the lacquer layer and data carrier being embossed,

[0028] FIG. 7 shows a data carrier with a thin lacquer layer into which the lens structure is being embossed,

[0029] FIG. 8 shows an embossing apparatus with a multiplicity of individual embossing units,

[0030] FIG. 9 shows a section through an individual embossing, unit with a jointly moved heating/cooling apparatus,

[0031] FIG. 10 shows a data carrier with a gap into which a single element is incorporated,

[0032] FIG. 11 shows a single element with a lens structure,

[0033] FIG. 12 shows an embossed foil for producing single elements,

[0034] FIG. 13 shows the application of a lens structure element by the inmold technique,

[0035] FIG. 14 shows a variant of a single element with a lens structure,

[0036] FIG. 15 shows a data carrier with the laminated-in single element according to FIG. 14 and the heated die used for incorporation,

[0037] FIG. 16 shows a data carrier with a gap and a corresponding single element,

[0038] FIG. 17 shows a single element with a register mark,

[0039] FIG 18 shows a further variant of a data carrier with a gap and an inserted separate element,

[0040] FIG. 19 shows a further embodiment of the inventive data carrier,

[0041] FIG. 20 shows a variant of the data carrier shown in FIG. 19.

[0042] FIG. 1 shows data carrier 1 according to the invention. It can be a one or multilayer ID card whose body is produced by one of the known methods, such as extrusion, lamination or injection molding, and which is provided with usual data 3, such as the name of the user, as account number and general data relating to the issuing institute. The user-related data are preferably burned into the inner volume area of the ID card with a laser, while the general information, such as that relating to the issuing institute, is printed on one of the card layers by a printing process. In addition the data carrier can also have other, solely machine-readable data storage mechanisms, such as an integrated circuit or magnetic strip. As shown in FIG. 1, inventive data carrier 1 additionally has in a partial area an optical authenticity feature in the form of tilt image 2. As explained above, tilt image element 2 consists of a lens structure, which can involve cylinder and/or spherical lenses that can be either directly adjacent one another or disposed in accordance with a given pattern and are incorporated into a plastic layer transparent at least in partial areas. The focal lengths of the individual lenses can additionally be varied, for example in accordance with a given pattern. Tilt image element 2 can of course also extend over entire data carrier 1.

[0043] According to a first embodiment, the lens structure is incorporated into one of the data carrier surfaces with the aid of cutting tools, such as grinding or planing tools.

[0044] FIG. 2 shows grinding cylinder 5 whose surface has the negative relief of lens structure 4 and with which data carrier 1 is brought in contact in the area of tilt image element 2. The data carrier is thereby placed between two position elements 7, 8, whereby one 7 of the elements has an opening in the area of lens structure 4 to be incorporated. The actual design of the positioning mechanism depends on the local circumstances and will be selected from known apparatuses in accordance with these requirements.

[0045] During the grinding process the processed data carrier area can additionally be cooled. FIGS. 3 and 4 shows relevant variants. Grinding cylinder 5 is moved over the data carrier in accordance with the motion cycle shown in FIG. 3a. Meanwhile, as shown in FIG. 3b, the area being processed is subjected to cool or cold air via air-pipe system 6 consisting for example of a nozzle or a simple pipe.

[0046] Alternatively one can also use a wet cooling system whose basic principle is shown in FIG. 4. Here, too, data carrier 1 is fixed in chucking device 7, 8. Grinding cylinder 5 is moved over the data carrier area as in the working cycles shown in FIG. 3a, and dips during grinding into grinding liquid 9, in the simplest case water, which provides for the necessary cooling. In order to permit dissipation of the arising heat, grinding liquid 9 is moved in a closed circuit via pipe system 10 with the aid of pump 11 and simultaneously cooled to the desired temperature again in cooling system 12. Filter element 13 additionally prevents grinding residue or the like from passing back into grinding bath 9.

[0047] If lens structure 4 is produced by planing using a profile chisel, however, it can also be necessary to heat the cutting tool in order to ensure good material removal.

[0048] Another way of incorporating a lens structure into the data carrier using cutting methods is shown in FIG. 5. Cutting part 81 of milling tool 80 has the negative form of a quadrant here. During the milling process tool 80 rotates about axis 82 and is simultaneously moved linearly in the direction of arrow 83 in order to produce cylinder lenses 4. Cutting part 81 of milling tool 80 can alternatively be designed to be rotatonally symmetric with respect to axis 82 to that milling part 81 has an umbrella-like form. Depending on the desired lens form, milling tool 80 can of course also have any other form. The geometrical design of the lens element is also freely delectable. In FIG. 5 the lens element extends over the entire data carrier, but it can also only be locally limited and executed with any contours via the control of the milling tool.

[0049] This method further offers the advantage that both single-card processing and processing in sheet form are possible. Moreover there is no temperature load.

[0050] In accordance with a further embodiment, data carrier 1 can be provided with thin lacquer layer 14 by any printing process, in particular screen printing, rotogravure or ink dabber printing. Lens structure 4 is then transferred with embossing die 15 both into lacquer layer 14 and into surface area 17 of data carrier 1 (FIG. 6). Lacquer layer 14 can thereby be printed either all over or only on a partial area of the data carrier. Depending on lacquer system 14 used, lacquer 14 can be precured before embossing, being put in a thermoplastic state. Complete curing of the lacquer finally takes place during or after embossing. One can use for example lacquer systems of chemically nonreactive components, the first component drying physically or curing by thermal reaction and the second curing by radiation. The curing of the first component gives rise to the thermoplastic state necessary for embossing, which is only ended by the radiation-curing of the second component. However one can also use one-component, in particular a radiation-curing, lacquer systems. If curing takes place during the embossing process the embossing die must be transparent to the curing radiation, for example UV or IR radiation. Radiation source 16 can be disposed directly within embossing die 15, as shown in FIG. 6.

[0051] However one can also use delayed-curing lacquers. With these, the crosslinking process is initiated in the lacquer by radiation of suitable energy shortly before the embossing process. Complete crosslinking takes place with a time delay so that in the meantime one can emboss into the still soft materials. If heat radiation is used, however, it suffices to heat the die to the necessary temperature. This method has the advantage that the data carrier material is not greatly stressed since less material need be displaced, which considerably reduces the danger of distortions. Further the embossing profile is fixed in lacquer layer 14 by radiation-curing virtually like a lacquer and consequently serves as a kind of fixing skin for the subjacent softened data carrier material, which can thus cool down without distortions after the embossing process.

[0052] A further way of reducing the danger of distortions is offered by the method shown in FIG. 7. Here one embosses only into lacquer layer 14 applied to the data carrier all over or partially. In this case the data carrier material itself is not impaired by the embossing process so that neither distortions nor embossings through to the back of the data carrier can arise.

[0053] The individual data carriers are embossed according to the invention in a special embossing apparatus permitting parallel processing of individual data carriers. It is completely irrelevant whether or not the data carrier has been previously provided with a fixing lacquer layer, as described above. The special process run within the apparatus also permits embossing into the data carrier itself without distortion.

[0054] FIG. 8 shows embossing apparatus 20 comprising a multiplicity of individual embossing units 21. The successively entering data carriers—schematically indicated in FIG. 8 by arrow 22—are received by individual embossing units 21, brought in contact with the embossing die located there, and moved back together with embossing unit 21 on a circular path to the starting point, where they leave embossing apparatus 20 again (arrow 23). The transport path can of course also have any other form. Also, the data carriers need not necessarily be transported back to the starting point.

[0055] During circulation of embossing units 21 the data carriers are heated slowly, provided simultaneously with the lens structure and finally cooled again very slowly. The very slow action of temperature and pressure virtually avoids any distortions. According to a first variant, the temperature change takes place separately in each embossing unit 21, i.e. the heating/cooling device is jointly moved with embossing unit 21 and heats and cools the embossing die present there according to a given temperature curve. Alternatively the heating/cooling device can also be stationary, whereby for example during transport embossing die and data carrier are heated slowly on path 24 and cooled down just as slowly along transport path 25. In this case, embossing unit 21 including the data carrier with the mounted embossing die is clocked through the heating/cooling device.

[0056] FIG. 9 shows a section along line 1-1 through embossing unit 21 of apparatus 20. When data carrier 1 runs into embossing unit 21 embossing die 15 is mounted on data carrier 1 and fixed there by spring 26, as shown for example in FIG. 8. Conceivable alternatives are compressed air and electric or hydraulic chucking devices. The fixation is released only when the card leaves embossing unit 21. The action of temperature takes place via die 27, is fastened in stationary fashion and passes on the heat to embossing die 15, which must of course be heat-conducting. With the next machine phase, embossing unit 21 is transported to next heating/cooling die 27. The basically very long process time is compensated by the fact that the data carriers can be processed singly and thus offset from one other. Only at the beginning to the production cycle is there a short processing gap that corresponds to the circulation time of one embossing unit 21. In the further course of production a data carrier leaves apparatus 20 with each machine phase, as if it had been embossed during one machine phase. On the other hand, the actual process time including a multiplicity of machine phases permits distortion-free production of data carriers, in particular data carrier in which the apex areas of the lens structure are flush with the data carrier surface or slightly sunk in from the surface.

[0057] A further inventive embodiment is shown in FIG. 10. Here data carrier 1 is provide with gap 28, for example by milling or suitably injection molding data carrier 1. Separately produced single element 30 is inserted into this gap and connected with data carrier 1 by gluing or welding. If single element 30 is welded to data carrier 1 by ultrasonic irradiation, directors 31 must be provided on single element 30, for example in the form of knobs or strips, that focus the impinging radiation, locally heat the material and thus permit controlled welding (FIG. 11). Directors 31 are made of the same plastic material as element 30 and can therefore be produced very advantageously together with the element by injection molding.

[0058] Another way of producing single element is to emboss endless foils which are then cut into suitable single elements. FIG. 12 shows the layer structure of such an endless foil 37. Self-supporting plastic foil 32 is embossed with lens structure 4 or already extruded with the lens structure The underside of embossed foil 32 is provided with adhesive layer 33, that can possibly be covered with silicone layer 34. The embossed side of foil 32 receives separation layer 35 and cover layer 36 disposed thereabove to protect the lens structure from damage during storage or the punching process. Cover layer 36 can be knife-coated in a liquid state and then cured. It is of course likewise conceivable to provide embossing 4 only in certain partial areas of foil 32.

[0059] Endless foil 37 has the advantage that it can be cost-effectively produced independently of the data carrier production and cut up into single elements of any format. For transfer to the data carrier, foil 32 is either prepunched or punched directly during transfer. Cover 36 is then removed together with the nonsticking foil remnants.

[0060] The single elements or course do not necessarily have to be inserted into a gap but can alternatively be glued or welded on the data carrier surface.

[0061] A further variant for providing a card with a single element is shown in FIG. 13. In this case gap 29 is incorporated into card 1 as in the method shown in FIG. 10. Then the lens element is injected into gap 28 by the inmold technique, i.e. instead of prefabricating all implantable single element one injects the desired element form directly into gap 23 in card 1 or onto the card surface. Card 1 provided with gap 28 is thereby introduced into an injection molding apparatus. For reasons of clarity FIG. 13 shows only mold 40, which must of course have negative lens structure 42. Via nozzle 41 transparent element material 43 is then injected into gap 28. As casting materials one can use thermoplastics or light-curing, in particular UV-curing, plastics for example.

[0062] According to a further variant the mold can also be designed such that the lens structure does not end flush with the plane of the data carrier surface but protrudes beyond it for example.

[0063] Single element 45 shown in FIG. 14 has a somewhat more complicated structure than that shown in FIG. 11. It consist of three plastic layers with different properties. Upper layers 46 and 47 are transparent and differ in particular with respect to their absorption properties for laser radiation. Plastic layer 46 is largely transparent to the laser radiation use for inscribing the element while plastic layer 47 is very sensitive to laser radiation, i.e. the action of laser radiation causes a visually recognizable color change in plastic layer 47. The different sensitivity to laser radiation can be caused for example by suitably doping the plastic layers with carbon black particles, a higher doping being synonymous with a faster change of the plastic. In order to facilitate the laser inscription or element 45 one disposes opaque layer 48 below layer 47. In the shown example it is only present in the central area of element 45, but it can also be provided all over layer 47. However if edge areas 49 remain free they facilitate the attachment of element 45 to data carrier 1. It is also conceivable to do completely without layer 45 so that the element has only a two-layer structure.

[0064] Element 45 can be produced in different ways. It is for example possible to produce single element 43 directly by injection molding. Alternatively it is possible to punch element 45 out of an endless two- or three-layer foil structure. In this case, two- or three-layer foil structure 46, 47, 48 is first produced in endless form by known methods, such as coextrusion or lamination, and provided with lens embossing 4. Embossing can be done either all over or at certain intervals. Then the surplus areas of foil 48 are milled out so that areas 49 arise. It is also possible, however, to mill into all three layers 46, 47, 48 so that areas 49 are present in layer 46. Finally single element 45 is punched out of the endless band, whereby this process can take place during sticking to data carrier 1. Element 45 can of course have any geometries, but it preferably has a round or rectangular form.

[0065] If the element has a round form, it can be provided with an additional marking in order to permit exact positioning of the element in the card. FIGS. 17a and 17b show two variants of such a register mark. According to FIG. 17a this can be flattened area 61 of element 60. It is likewise conceivable to use bulge 62, as shown in FIG. 17b. The card gap of course has an accordingly adapted form.

[0066] Element 45 is finally inserted into accordingly formed gap 53 in data carrier 1 and connected inseparably therewith. FIG. 15 schematically shows element 45 already laminated into data carrier 1 and heated die 50 in their mutual spatial arrangement.

[0067] During the laminating process heated die 50 lies on the data carrier/element compound only in the boundary area between data carrier 1 and element 45. In the central area of element 45, however, die 50 has gap 51 which protects lens structure 4 from destruction during the laminating process. Since the data carrier material and the material of element 45 soften through the action of heat and pressure and flow into cavities existing between data carrier 1 and element 45, a smooth surface structure arises in the contact area of die 50, preventing element 45 from being detached from data carrier 1 and inserted into another data carrier. Simultaneously an inseparable compound arises between data carrier 1 and element 45 in the area of the gap between die 50 (an annular area here), since in the area of the heated die the data carrier material and the element material soften down to the level of areas 49. Lens structure 4 is largely destroyed in the contact area of die 50 by the laminating process. The compound area extending about element 45 has a mere width of about 1 to 2 mm, however, so that only a small part of the lens structure is destroyed. Further, distortions during lamination of the data carrier can be prevented by the smaller contact surface of the die. Die 50 can be smooth, matt or superficially structured in another way in the compound area in order to hide the contour of the transition between element 45 and card body. Further the can have an antistick coating in order to prevent sticking between die and card material. It is alternatively possible to use a silicone-floated foil as an intermediate layer. To avoid material accumulations in the edge area of die 50 that can arise though displacement of the material upon pressurization, the die has the form of a facet in this area 52.

[0068] The compound between data career 1 and element 45 can be improved additionally by providing opaque layer 48 with an adhesive layer. The adhesives layer can also be provided before production of the single element as an all-over fourth layer during production of the foil structures. An adhesive can be necessary especially when the element takes up a very great surface. Use of an adhesive also makes it possible to use different polymeric materials for data carrier and element, such as an especially elastic or readily deformable material for the single element and polycarbonate or PETG for the data carrier.

[0069] An alternative embodiment is to do completely without lamination and use a two-component adhesive. One component is thereby put in the gap and the second component on the element.

[0070] According to a further embodiment, element 45 and gap 53 can have trapezoidal side contours (FIG. 16). Gap 53 and element 45 are coordinated with each other in form such that the element snaps into gap 53 when inserted into the card, resulting in an additional anchoring of the element in the card. For the sake of clarity, overlap area a between data carrier surface 54 and element underside 55 is shown greatly exaggerated. In reality, overlap area a is in the range of a few 100 microns. After insertion in the card the element is laminated or stuck to the card body, as already described with reference to FIG. 15.

[0071] According to the embodiment shown in FIG. 18, data carrier 1 can also have lens structure 4. In this case data carrier 1 is produced as an injection molded part having lens structure 4 on one 65 of its surfaces. Surface 66 opposite lens structure 4 is provided with gap 67 in which element 68 is inserted. The injection molded part of data carrier 1 consists of transparent or translucent materials whereas inserted element 68 can be transparent or opaque and be punched out of a foil or likewise produced by injection molding. Element 68 can be coordinated specifically to the needs of laser inscription on the inner side facing the card body. The inside surface can be printed for example with a sensitive layer absorbing laser radiation, in which laser beam action produces black marks contrasting with the surroundings. Above this lacquer layer containing additives absorbing laser radiation one can dispose a layer transparent or less sensitive to laser radiation which ensures a good compound with the data carrier. Alternatively the plastic material of the element can be mixed at least partially with additives which absorb laser radiation. For example only the surface area of the element facing the card body could be sensitized to laser inscription.

[0072] FIG. 19 shows another solution to the inventive problem. Here data carrier 1 consists of opaque foil inlay 70 which is provided on both sides with transparent cover layers 71, 72 by injection molding. One 71 of these layers receives lens structure 4 locally or all over in the course of injection molding. Below lens area 4 one an provide on the foil inlay layer 73 sensitive to laser inscription, for example in the form of a transparent, accordingly prepared lacquer layer.

[0073] According to a variant, data carrier 1 can also be provided with lens structure 4 and subjacent laser-sensitive layer 73 on both sides (FIG. 20). The lens structure areas need not necessarily be disposed congruently to each other but can be disposed at different places and with any different outline structures.

[0074] In the data carriers shown in FIGS. 19 to 20, as in most of the other embodiments of the invention, the lens structure is flush with the surface of the card, thereby avoiding any problems arising from different card thickness when the cards are stacked.

[0075] After the data carrier has been provided with a lens structure by one of the inventive methods, it is supplied to a laser inscription unit. There the tilt image information is inscribed into the transparent material through the lens structure. Inscription expediently takes place in the course of the necessary personalization of the data carrier, so that if desired an individual data record for each user consisting of data to be lasered directly into the data carrier and tilt image information, that might likewise be user-related, can be put together and delivered to the laser control. In the case of an inscription error the faulty data carrier can be immediately eliminated and replaced with a following, as yet uninscribed data carrier with a lens structure.

[0076] The material provided with the lens structure must of course be transparent at least in the area of the lenses so that the information incorporated through the lenses is legible. Transparent materials are preferably used. It is also possible, however, to use colored translucent plastics.

Claims

1. A method for producing a data carrier having at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface structure in the form of a lens structure, characterized in that the surface structure is incorporated into the plastic layer by cutting methods.

2. The method of claim 1, characterized in that the surface structure is incorporated by grinding, planning or milling.

3. The method of either of claims 1 and 2, characterized in that the data carrier area to be processed is additionally cooled.

4. The method of claim 3, characterized in that cooling is done with air or a grinding liquid.

5. The method of claim 1, characterized in that the surface structure is incorporated with a profile chisel.

6. The method of claim 5, characterized in that the profile chisel is heated.

7. A method for producing a data carrier having at least in partial areas atransparent plastics layer which is provided at least in a partial area with a surface structure in the form of a lens structure, characterized in that the plastic layer is applied to the data carrier in the form of a layer of lacquer, and the surface structure is embossed into this lacquer layer.

8. The method of claim 7, characterized in that the surface area of the data carrier disposed blow the lacquer layer is likewise embosser.

9. The method of either of claims 7 and 8, characterized in that the lacquer layer is applied by printing process.

10. The method of claim 9, characterized in that the lacquer layer is applied by screen printing.

11. The method of at least one of claims 7 to 10, characterized in that thermoplastic and/or radiation-curable lacquers or lacquer systems from chemically nonreactive components are used.

12. A method for producing a data carrier having at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface structure in the form of a lens structure, characterized in that this surface structure is embossed into the plastic layer with stepwise exposure to temperature and possibly pressure.

13. The method of claim 12, characterized in that the method has the following steps each data carrier is supplied to an embossing unit in which it is brought in contact with an embossing die, data carried and embossing die are moved together along a transport path, data carrier and embossing die are first heated and then cooled in accordance with a given temperature curve during transport, and after cooling the embossing die is taken off the data carrier and the data carrier removed from the embossing.

14. The method of claim 13, characterized in that a plurality of embossing units are provided which each receive a data carrier offset in time from one other.

15. The method of claim 13 or 14, characterized in that each embossing unit has its own heating or cooling apparatus that is heated or cooled in accordance with the given temperature curve.

16. The method of claim, 13 or 14, characterized in that a stationary heating/cooling apparatus is provided through which the data carrier is moved together with the embossing die in accordance with a given machine phase.

17. The method of at least one of claims 13 to 16, characterized in that the embossing die is fastened to the data carrier by fixing means.

18. The method of claim 17, characterized in that the embosing die is fixed by a tensed spring, compressed air or electric or hydraulic chucking devices.

19. A method of producing a data carrier including at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface structure in the form of a lens stricture, the plastic layer with the surface structure being produced as a separate element which is connected after its production with the data carrier, characterized in that the data carrier is provided with a lap into which the element is incorporated.

20. The method of claim 19, characterized in that the data carrier is provided with a step-shaped gap.

21. The method of claim 19, characterized in that the gap and the element are of trapezoidal design and the element snaps into the gap upon insertion.

22. The method of claim 20 or 21, characterized in that the data carrier and the single element are laminated in the transition area between the two with the aid of a heated die.

23. The method of at least one of claims 20 to 22, characterized in that the heated die has a gap in the inner area so that the surface structure is not destroyed in this area, and the edge area of the heated die is executed in the form of a facet.

24. The method of claim 19, characterized in that the gap is produced by milling the finished data carrier or suitably injection molding the data carrier.

25. The method of a least one of claims 19 to 24, characterized in that the element is glued or welded to the data carrier.

26. The method of claim 25, characterized in that the element is welded to the data carrier by means of ultrasound.

27. The method of at least one of claims 19 to 26, characterized in that the element is produced by injection molding or the foil laminating technique, optionally from different plastics.

28. A method of producing a data carrier including at least in partial areas a transparent plastics layer which is provided at least in a partial area with a surface structure in the form of a lens structure, characterized in that the data carrier is provided with a gap, and the plastic layer with the surface structure is produced directly in the gap by the inmold technique.

29. A method for producing a data carrier including at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface structure in the form of a lens structure, characterized in that the plastic layer is produced by injection molding, whereby the plastic layer acquires the form of a card body which is provided with a gap on a first surface and with the surface structure on the opposite surface in the area of the gap, and a plastic element is incorporated into the gap.

30. The method for producing a data carrier of claim 29, characterized in that the plastic element is punched out of an opaque foil or produced by injection molding.

31. The method of claim 29 or 30, characterized in that the element has on the side facing the data carrier a coating containing additives absorbing laser radiation.

32. The method of claim 29 or 30, characterized in that the plastic element is provided at least in a partial area with additives absorbing laser radiation.

33. A method for producing a data carrier including at least in partial areas a transparent plastic layer which is provided at least in a partial area with a surface structure in the form of a lens structure, a plastic foil being provided at least on one surface with the, plastic layer having the surface structure by injection molding, characterized in that the data carrier s then supplied to a laser inscription unit which inscribes tilt image information into the transparent plastic layer through the lens structure.

34. The method of claim 33, characterized in that the plastic foil is provided on both sides by injection molding with a plastic layer having a surface structure in a partial area.

35. The method of claim 34, characterized in that the surface structures are disposed congruently to each other on both sides of the foils.

36. The method of at least one of claims 33 to 35, characterized in that the plastic foil is provided in the area of the surface structure disposed thereabove with a coating containing additives absorbing laser radiation.

37. A method for producing a security element for data carriers such as ID parts, bank notes or the like consisting or transparent plastic provided at least in partial areas with a surface structure in the form of a lens structure, characterized that the security element is produced as a single element by injection molding, the surface structure being produced during injection molding.

38. The method of claim 37, characterized in that the element is built up from a plurality of plastic layers with different properties.

39. A method of producing a foil provided at least in partial areas with a surface structure in the form of a lens structure and capable of being used for producing security elements for data carriers such as ID cards, bank notes or the like, characterized in that the surface structure is incorporated during or after foil production, and the surface structure is then provided with a separation layer above which a cover layer is disposed in a further step for protecting the surface structure from damage for example during storage and any punching processes.

40. The method of either of claims 37 and 39, characterized in that the surface opposite the surface structure is provided with directors for ultrasound made of plastic.

41. The method of either of claims 37 and 39, characterized in that the surface opposite the surface structure is provided with an adhesive layer.

42. The method or claim 39, characterized in that the cover layer is knife-coated, as a liquid lacquer layer and then cured.

43. A method of producing a foil compound provided at least in partial areas with a surface structure in the form of a lens structure and capable of being used for producing security elements for data carriers such as ID cards, bank notes or the likes, characterized by the followings steps producing a foil compound from at least two plastic layers that have different absorption behavior toward incident laser radiation, providing a surface of the foil compound with the surface structure, removing the layer opposite the surface structure in certain areas.

44. The method of claim 43, characterized in that the foil compound is produced by coextrusion or foil lamination of a layer transparent at least to laser radiation, a layer absorbing laser radiation and possibly an opaque layer, the embossing being done into the layer transparent to laser radiation.

45. A data carrier (1) including at least in a partial area a transparent plastic layer (1, 14) having at least in partial areas a surface structure in the form of a lens structure (4) and having information in the form of marks or patterns which are incorporated at least partly through the surface structure (4) with the aid of a laser, characterized in that the surface structure (4) ends flush with plane of the surface of the data carrier (1).

46. The data carrier (1) of claim 45, characterized in that the plastic layer (1, 14) extends over entire data carrier (1).

47. The data carrier (1) of claim 45, characterized in that the plastic layer (1, 14) provided with the surface structure (4) is executed an a single element (28, 45) which is connected with the data carrier.

48. The data carrier of claim 47, characterized in that the data carrier (1) has a gap (28, 53) in which the single element (30, 45) as inserted.

49. The data carrier of claim 48, characterized in that the gap (53) has a step-shaped design and the element (45) has a corresponding step-shaped design.

50. The data carrier of claim 49, characterized in that the data carrier (1) and the single element (45) run smoothly into each another at least in the surface area.

51. The data carrier of at least one of claims 45 to 50, characterized in that the surface structure (4) consists of cylinder and/or spherical lenses disposed in the form of any pattern.

52. The data carrier of claim 45, characterized in that the plastic layer is a deformable lacquer layer (14), and the data carrier (1) additionally has a plastic foil directly adjoining the plastic layer, and the surface structure is present both in the plastic layer and in tho adjoining foil.

53. A security element (30, 45) for data carriers (1) such as ID cards, bank notes or the like consisting of transparent plastic provided at least in partial areas with a surface structure (4) in the form of a lens structure, characterized in that the element (30, 45) is produced as a separate single element by injection molding.

54. The security element (30, 45) of claim 53, characterized in that the element (45) consists of plastic layers (46, 47, 48) with different absorption behavior for laser radiation that are optionally disposed in steps.

55. An endless band with a surface structure (4) in the form of a lens structure for producing security elements (30) for data carriers such as ID cards, bank notes or the like, characterized by the following layer structure: a self-supporting, transparent plastic foil (32) provided with the surface structure (4), a separation layer (35) disposed above the surface structure (4), a cover layer (36) disposed above the separation layer (35) for protecting the surfaces structure (4) from damage for example during storage and any punching processes.

56. The endless band of claim 55, characterized in that the surface of the plastic layer (32) opposite the surface structure (4) is provided with an adhesive layer (33) and possibly a silicone layer (34) covering the adhesive layer (33).

57. The endless band of claim 54, characterized in that the surface opposite the surface structure (4) is provided with directors (31) for ultrasonic welding made of plastic in the form of knobs or strips.

58. The endless band of at least one of claims 55 to 57, characterized in that the cover layer (36) consists of a curable lacquer layer.

59. An endless band with a surface structure (4) in the form of a lens structure for producing security elements (45) for data carriers (1) such as ID cards, bank notes or the like, characterized by the following layer structure: a layer (46) transparent at least to laser radiation into which the surface structure (4) is embossed at least in partial areas, a layer (47) absorbing laser radiation disposed on the side opposite the surface structure (4).

60. The endless band of claim 59, characterized in that an opaque layer is disposed above the absorbing layer (47).

61. The endless band of claim 60, characterized in that the opaque layer is only present in certain partial areas.

62. The endless band of claim 60 or 61, characterized in that the opaque layer is covered with an adhesive layer.

63. An apparatus for producing a data carrier (1) including at least in a partial area a transparent plastic layer provided at least in partial areas with a surface structure (4) in the form of a lens structure, characterized in that the apparatus (20) has a multiplicity of embossing units (21) which include at least one embossing tool (15) and are mounted movably so that the embossing units (21), after being brought in contact with the data carriers (1) completed at least respect to their layer structure, are jointly moved with the data carriers (1) for a given time period in order to produce the surface structures (4).

64. The apparatus of claim 63, characterized in that each of the embossing units (21) has its own heating/cooling apparatus (27).

65. The apparatus of claim 63, characterized in that the apparatus (20) has stationary heating/cooling apparatuses (24, 25) which run through the embossing unit (21) together with the data carrier (1).

66. The apparatus of claim 64 or 65, characterized in that the apparatus (20) has a control which activates the heating/cooling apparatus (24, 25, 21) in accordance with a given temperature curve.

67. The apparatus of at least one of claims 65 to 66, characterized in that the embossing units (21) are disposed in a circle and can circulate on this circular path.

68. An apparatus for producing a data carrier (1) including at least in a partial area a transparent plastic layer provided at least in partial areas with a surface structure (4) in the form of a lens structure, the apparatus having at least one unit with a cutting tool (5), characterized in that the tool is brought in contact with the data carrier (1) completed at least with respect to its layer structure in order to produce the surface relief (4), the cutting tool (5) having the negative relief of the lens structure (4) to be produced.

69. The apparatus of claim 68, characterized in that the cutting tool (5) is a plane, a grinding device or a milling tool.

70. The apparatus or claim 69, characterized in that the apparatus has an air cooling device (6) which cools the data carrier area being processed.

71. The apparatus of claim 69, characterized in that the cutting tool (5) is a wet grinding device.

72. Use of an apparatus having at least one unit with a cutting tool (5) for producing a data carrier (1) including at least in a partial area a transparent plastic layer provided at least in partial areas with a surface structure (4) in the form of a lens structure, the tool being brought in contact with the data carrier (1) completed at least with respect to its layer structure in order to produce the surface relief (4).

73. An apparatus for producing a data carrier (1) including at least in a partial area a transparent plastic layer provided at least in partial areas with a surface structure (4) in the form of a lens structure, the apparatus having at least one unit with a cutting tool (5), characterized in that the tool is brought in contact with the data carrier (1) completed at least with respect to its layer structure in order to produce the surface relief (4), the cutting tool (5) being a profile chisel and means being provided for heating the profile chisel or the data carrier.

74. The apparatus of claim 73, characterized in that the cutting tool has a negative form of a quadrant.

75. The apparatus of claim 73 or 74, characterized in that it has an air cooling device for cooling the data carrier area being processed.

76. The apparatus of any of claims 73 to 75, characterized in that the cutting tool (5) is a wet grinding device.