This application claims priority to PCT/EP2013/053085 filed Feb. 15, 2013, which claims priority to Swiss application 00209/12 filed Feb. 17, 2012, both of which are hereby incorporated in their entireties.
The present invention relates to the field of thermal machines. It refers to a method for producing a near-surface cooling passage in a thermally highly stressed component according to the preamble of claim 1. It also refers to a component which is produced according to the method.
In thermal machines, efficiency which is as high as possible has always been the target in order to use the applied fuels more effectively for power generation. In the case of gas turbines, the aim is an efficiency of 63%, for example, for which higher combustion temperatures in the region of 1850K would be required. In order to achieve this, thermally highly loaded components of the machine have to be cooled by means of complex cooling devices and configurations. On account of the increasing complexity, problems in the production of such components increase and lead to high scrap rates.
In the case of gas turbines, on account of an irregular profile of the combustion chamber exit temperature, critical hot zones in the subsequently arranged components, such as stator blades or rotor blades or wall elements of the hot gas passage, occur, resulting in local overheating so that in such components working temperatures which are approximately 80-130K higher than the hot gas temperature are to be taken into consideration in the future.
For this reason, very efficient local cooling of the thermally highly loaded components is required in the case of gas turbines and comparable thermal machines.
One possible way, in which such efficient local cooling can be developed, is near-surface or near-wall cooling which is shown in two variants in
An improved alternative cooling configuration is reproduced in
A transition from the configuration in
Such a configuration can be achieved in components with effusion cooling in the following way: the basis is a component which according to
In the case of a component according to
A cooling configuration of the type shown in
Such a cooling configuration, however, poses problems with regard to the difficulties related to production engineering, which lead to high costs and high scrap rates.
It is certainly conceivable to realize such cooling configurations by casting methods in the hollow core technique. In this case, after the casting of the component the core forming the network of internal cooling passages is removed. The remaining cavities form the passages. Although this method is practical as regards production engineering, it is expensive owing to the complexity and is afflicted with high scrap rates. Furthermore, a component cannot be reworked with this technology or be subsequently altered.
It is therefore an object of the invention to disclose a method for producing near-surface cooling passages for thermally loaded components of a thermal machine, especially of a gas turbine, which method can be applied to different components and is to be carried out at comparatively low cost and with a low scrap rate, even in retrospect on already existing components, and provides components with significantly improved cooling effect and correspondingly increased service life.
It is also an object of the invention to disclose a corresponding component.
These and other objects are achieved by the total features of claims 1 and 13.
The method according to the invention for producing a near-surface cooling passage in a thermally highly stressed component comprises the following steps:
One embodiment of the method according to the invention is characterized in that in step (b) the channel in the component is hollowed out by means of a material-removing process.
In this case, the channel can especially be hollowed out in the component by spark erosion by means of an EDM electrode.
The EDM electrode in its shape preferably corresponds to the channel which is to be hollowed out.
Another embodiment of the method according to the invention is characterized in that the component has a wall with a hot side and an oppositely disposed cool side, and in that the channel is introduced into the component wall in such a way that it extends through the wall from the cool side towards the hot side and has an inlet on the cool side and an outlet on the hot side.
It is especially favorable in this case if the channel, and consequently also the finished cooling passage, comprise a first passage section which extends from the inlet on the cool side into the interior of the component wall, a second passage section which adjoins the first passage section and extends essentially parallel to the surface which is to be cooled, and a third passage section which adjoins the second passage section and terminates in the outlet on the hot side.
The first cooling passage and the third cooling passage are preferably oriented obliquely to the surface, that is to say at an acute angle.
In this case, the cooling passage can especially have an inside diameter of approximately 1 mm and the second passage section can be at a distance which is less than or equal to 1 mm from the surface which is to be cooled. A further embodiment of the method according to the invention is characterized in that the channel is let into the component to such a depth, or hollowed out from the component to such a depth, that the inserted cooling tube, apart from inlet and outlet, is located well below the surface.
Another embodiment of the method according to the invention is characterized in that the channel, with the cooling tube inserted, is filled with a high-temperature solder as filling material.
Yet another embodiment of the method according to the invention is characterized in that the anti-oxidation, temperature-stable cover layer is applied by deposition welding by means of a laser metal forming process (LMF). In this case, the cover layer is preferably formed by consecutive application of a plurality of overlapping coatings.
Thermal spraying constitutes an alternative preferred coating process.
The thermally highly stressed component according to the invention, having a hot side delimited by a surface and at least one near-surface cooling passage, is characterized in that the cooling passage is produced by a method according to the invention.
One embodiment of the component according to the invention is characterized in that the component has a wall with a hot side and an oppositely disposed cool side, and in that the cooling passage extends through the component wall from the cool side to the hot side and has an inlet on the cool side and an outlet on the hot side.
Another embodiment of the component according to the invention is characterized in that the cooling passage comprises a first passage section which extends from the inlet on the cool side into the interior of the component wall, a second passage section which adjoins the first passage section and extends essentially parallel to the surface which is to be cooled, and a third passage section which adjoins the second passage section and terminates in the outlet on the hot side.
The first passage section and the third passage section are especially oriented obliquely to the surface and preferably include an angle of between 15° and 30°, especially preferably an angle of approximately 18°, with the surface normal.
A further embodiment of the component according to the invention is characterized in that the cooling passage has a cooling tube which lies in a channel let into the surface and is embedded into a temperature-resistant filling material, especially a high-temperature solder.
The cooling tube preferably has an inside diameter of approximately 1 mm and an outside diameter of approximately 1.5 mm, and the second passage section is at a distance which is less than or equal to 1 mm from the surface which is to be cooled.
Another embodiment of the component according to the invention is characterized in that the cooling passage has a length of approximately 20 mm.
Yet another embodiment of the component according to the invention is characterized in that a plurality of cooling passages are arranged in the component in parallel and/or in series and at a distance from each other. In this case, cooling medium can flow through the plurality of cooling passages in the same or opposite directions.
Other cooling arrangements, with differently oriented or dimensioned cooling passages, which are optimally adapted to the cooling requirements of the component, are also conceivable.
The invention shall subsequently be explained in more detail based on exemplary embodiments in conjunction with the drawing. In the drawing
The invention discloses a new alternative to already known production methods for near-surface cooling configurations. Instead of attempting to form corresponding cooling passages in the base material or to form cooling passages by the combination of two or more parts, the subsequently explained solution for producing near-surface or near-wall cooling passages is based on the embedding of complete passages into the surface of the component.
A sequence of production steps for this method comprises the following: in a first step, the base material is prepared in a suitable manner, especially by hollowing out a channel, in order to accommodate a tube which is later let into the surface. The configuration of such a channel can be straight, but other configurations, such as meander configurations, are also conceivable in order to optimize the cooling effect in a specific manner depending upon the application case.
The channels are usually introduced into the component or into the wall from the hot gas side or hot side (see
The tubes are then introduced into the channels in the component or in the component wall which is to be cooled (see
For fixing the tubes in the channel and for achieving an optimum heat transfer, the tubes are embedded into a filling material, especially in the form of a high-temperature solder, in the channel and the surface is smoothed off by means of grinding (see
Finally, an anti-oxidation cover layer is applied by means of laser metal forming (LMF) or by means another coating process (see
The ends of the inserted tubes form an inlet and an outlet for the through-flowing cooling air. It is of great importance, therefore, that these openings are not closed off or constricted during the embedding with high-temperature solder.
In a view comparable to
The cooling passage 17 is formed essentially by a cooling tube 20 which is inserted into a channel 19 introduced into the component wall 14 and embedded there into a filling material 21 consisting of high-temperature solder. A cover layer 22 consisting of oxidation-resistant material is applied on top of the (smoothed) layer of filling material 21 by means of LMF. The cross section of the arrangement is reproduced in
The cooling passage 17 does not have any undercuts. The inside diameter of the cooling tube 20 is, for example, 1.0 mm and the outside diameter is 1.5 mm. The center passage section 17b extends parallel to the surface 18, whereas the passage sections 17a and 17c are oriented obliquely to the surface normal by an angle of approximately 18°. The length of the cooling passage 17 is approximately 20 mm. The depth of the channel 19 in the center passage section 17b is approximately 1.6 mm. The tube 20 extends at least over the center passage section 17b and the passage section 17c on the hot side, as shown in
For introducing the channels (19 in
The application of the cover layer 22 by means of LMF is carried out according to
As an exemplary embodiment of a component according to the invention,
Overall, using the method according to the invention a near-surface or near-wall cooling passage of any shape can be arranged on any customarily convection-cooled hot gas surface in order to improve the cooling effect and to save cooling medium. If necessary, larger surfaces can also be equipped with such cooling passages. The described technology can also be applied if a component has to be reconditioned or if an existing component has to be improved or replaced.
The invention has a number of advantages:
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Office Action (Notice of Reasons for Refusal) dated Nov. 14, 2016, by the Japanese Patent Office in Japanese Patent Application No. 2014-557054, and an English Translation of the Office Action. (12 pages). |
Number | Date | Country | |
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20140331641 A1 | Nov 2014 | US |
Number | Date | Country | |
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Parent | PCT/EP2013/053085 | Feb 2013 | US |
Child | 14445194 | US |