Article entitled "Fabricating Closed Channel by Electroforming", by H. R. Johnson and J. W. Dini; Plating and Surface Finishing; pp. 456-461; May 1975. |
Wilson, Edward A. "Integral Liquid-Cooling System Simplifies Design of Densely Packaged Computer", Electronics, Jan. 26, 1984. |
Keyes, Robert W. "Heat Transfer in Forced Convection Through Fins", IEEE Transactions on Electron Devices, vol. ED-31, No. 9, Sep. 1984, pp. 1218-1221. |
Hollworth, B. R., Gero, L. R. "Entrainment Effects on Impingement Heat Transfer: Part II-Local Heat Transfer Measurements", Journal of Heat Transfer, Nov. 1985, vol. 107, pp. 910-915. |
Watari, Toshihiko et al. "Packaging Technology for the NEC SW Supercomputer," 35th Electronics Components Conference, Proceedings 1985, pp. 192-198. |
Shafer, Donald A. "Basic Electroforming", Hallmark Cards Inc., date unknown; includes a photograph of a recess enclosure as the result of high current density bridging during electroplating. |
Tuckerman, D. B. and Pease, R. F. W. "High-Performance Heat Sinking for VLSI", IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981. |
Rodia, Carl M. "Electroforming", date unknown. |
Article entitled "Optimal Structure for Microgrooved Cooling Fin for High-Power LSI Devices"; dated Oct. 21, 1986; author is S. Sasaki; 3 pages. |
Article entitled "Demonstration of High-Performance Silicon Microchannel Heat Exchangers for Laser Diode Array Cooling"; American Institute of Physics; Appl. Phys. Lett. 53 (12), Sep. 19, 1988, pp. 1030-1032. |
Article entitled "Thermal Management of Surface Mount Power Devices", Reprinted from Aug., 1987 Issue of Powerconversion Intelligent Motion for Power Electronics & Intelligent Motion Systems Engineers, by Herb Fick Bergquist. |
Brochure entitled "Introducing the ACX* Compact Heat Exchanger-", (an ultra-compact, adaptable, high-performance cooling unit from Astro), 4 sheets. no date available. |
Brochure entitled "The Astro ACX Compact Heat Exchanger"; Astro; Summer 1986 by John E. Deily. |
Brochure entitled "Diode Laser Guide"; Melles Griot; 1987. |
Brochure entitled "Flexible Shaft Couplings"; Servometer; pp. 1-8. no date available. |
Brochure entitled "Miniature Metal Bellows and Electroforms"; Servometer. no date available. |
Brochure entitled "Micro Drilled Inserts"; Bird Precision; 4 pgs. no date available. |
A Technical Data Sheet entitled "Zone Annealed Strip"; Technical Materials, Inc., Jun. 1984 Bulletin; 4 pgs. |
Article entitled "Microfabrication of Membranes with Extreme Porosity and Uniform Pore Size", 1988 Elsevier Science Publishers B. V., Journal of Membrane Science, 36 (1988), pp. 67-77. |
Simons, R. E. and Chu, R. C. "Direct Immersion Cooling Techniques for High Density Electronic Packages and Systems", IBM Corporation, pp. 314-321. no date available. |
Nakatogawa, Tetsundo, et al., "Heat Transfer of Round Turbulent Jet Impinging Normallly on Flat Plate", University of Tokyo, Tokyo, Japan. no date available. |
Goldberg, Norman "Narrow Channel Forced Air Heat Sink", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-7, No. 1, Mar. 1984, pp. 154-159. |
Lyman, Jerry "Special Report Supercomputers Demand Innovation in Packaging and Cooling", Electronics, Sep. 22, 1982, pp. 136-143. |
Pittier, M. S., Powers, D. M., Schnabel, D. L. "System Development and Technology Aspects of the IBM 3081 Processor Complex", IBM Journal of Research Development, vol. 26, No. 1, Jan. 1982, pp. 2-11. |
Encyclopedia of Chemical Technology, Third Edition, vol. 8, John Wiley & Sons, 1979, pp. 738-750 and 826-868. |