Claims
- 1. A method for making a metal carbide supported polycrystalline diamond (PCD) compact having improved abrasion resistance properties, said method comprises the steps of:
a) providing a cell assembly comprising:
a body of diamond crystals comprising a mixture of about 60 wt % to about 90 wt. % of a coarse fraction having an average particle size ranging from about 15 to 70 μm and a fine fraction having an average particle size of less than about one half of the average particle size of the coarse fraction; and a support body disposed adjacent said body of diamond crystals, said support body comprising a mixture of a carbide of Group WB, VB, or VIB metal and at least a sintering binder-catalyst in an amount of about or less than 20 vol % of the total weight of the support body; and b) subjecting said cell assembly reaction to high pressure high temperature (HP/HT) conditions for a sufficient amount of time and at a sufficiently high temperature and high pressure to sinter said body of diamond crystals into a PCD layer and to bond said PCD layer to said carbide body.
- 2. The method of claim 1, wherein the weight ratio of the coarse fraction to the fine fraction of said body of diamond crystals ranges from about 90:10 to 60:40.
- 3. The method of claim 1, wherein the fine fraction of diamond crystals. ranges in size from about 1 to 25μ.
- 4. The method of claim 1, wherein the cemented metal carbide support comprises a carbide of Group IVB, VB, or VIB metal, and the binder is one or more of cobalt, nickel, iron, or alloys thereof.
- 5. The method of claim 5, wherein the cemented metal carbide support is WC and the binder is Co.
- 6. The method of claim 1, wherein the support body comprises at least a sintering binder-catalyst in an amount of about or less than 17 vol % of the total weight of the support body.
- 7. The method of claim 1, wherein HP/HT processing conditions comprising sintering of said body of diamond crystals for about 3 to 120 minutes at a temperature of at least 1000° C. and a pressure of at least 20 Kbar.
- 8. A sintered supported polycrystalline diamond (PCD) compact having improved abrasion resistance properties, said compact comprising:
(a) a body of diamond crystals comprising a mixture of about 60 wt % to about 90 wt. % of a coarse fraction having an average particle size ranging from about 15 to 70 μm and a fine fraction having an average particle size of less than about one half of the average particle size of the coarse fraction; and (b) a support body in contact with the body of diamond crystals, the support body comprises a mixture of a carbide of Group IVB, VB, or VIB metal and at least a sintering binder-catalyst in an amount of about or less than 20 vol % of the total weight of the support body.
- 9. The PCD compact of claim 8, wherein the weight ratio of the coarse fraction to the fine fraction of diamond crystals ranges from about 90:10 to 60:40.
- 10. The PCD compact of claim 8, wherein the fine fraction of diamond crystals ranges in size from about 1 to 25 μm.
- 11. The PCD compact of claim 8, wherein the cemented metal carbide support comprises a carbide of Group IVB, VB, or VIB metal, and the binder is one or more of cobalt, nickel, iron, or alloys thereof.
- 12. The PCD compact of claim 11, wherein the cemented metal carbide support is WC and the binder is Co.
- 13. The PCD compact of claim 8, wherein said support body comprises at least a sintering binder-catalyst in an amount of about or less than 17 vol % of the total weight of the support body.
- 14. The. PCD compact of claim 8, wherein said compact is formed via a high pressure/high temperature (HP/HT) processing method, wherein the HP/HT processing method comprises sintering said body of diamond crystals and said support body for a sufficient period of time at a temperature of at least 1000° C. and a pressure of at least 20 Kbar.
- 15. The PCD compact of claim 8, wherein said compact is formed via a high pressure/high temperature (HP/HT) processing method, and wherein said body of diamond crystals and said support body are pre-formed in an HP/HT processing environment for a sufficient period of time at a temperature of at least 1000° C. and a pressure of at least 20 Kbar, prior to being fused together via brazing or in an HP/HT processing environement.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority on U.S. Provisional Application Serial No. 60/414,987, filed on Oct. 1, 2002.
Provisional Applications (1)
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Number |
Date |
Country |
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60414987 |
Oct 2002 |
US |