Patent Application
20070154649
The invention relates to the field of data storage media, especially optical storage media. The inventive method can be used for producing a space layer in between two disks with high uniformity. This technique can be used in optical disc production, where a highly uniform space layer is required. For example: BD-DL (blu-ray disk double layer), DVD-14/18, DVD+R9 (digital versatile media) and other multilayer media.
Using UV curable lacquer for bonding two substrates is a well known production step in optical disk production. The bonding layer thickness in this application is typically in the range of 20 micron to 50 micron. It is a mandatory production step for all DVD formats and is used as well for multi-layer media (like Blu-Ray Double Layer Disc) for providing a second information layer onto a first information layer carrying substrate (the so called 2P process).
In the first step of the 2P process a substrate (in the following called first substrate) with an information layer is produced e.g. by injection moulding and coated with layer material which is appropriate for the format (e.g. a reflective or semireflective layer). Then a second substrate (in the following called stamper substrate) is produced with a second information layer. This stamper substrate is bonded together with the first substrate using typically an UV-curable adhesive. In the next step the 2 substrates are being separated, whereby the UV resin with the image of the information layer of the stamper substrate must remain completely on the first substrate. Depending on the application it is also possible to transfer a metallic layer in a similar way from the stamper to the first substrate as described in U.S. Pat. No. 6,117,284.
There are two problems to be solved.
Firstly, with increasing data density the homogeneity requirement on the bonding layer is increasing. To give an example, the requirement for the space layer of a Blu-Ray-DL Disk will be in the range of +/−1 micron for an average layer thickness of 25 micron over the whole disk. Standard bonding processes used in the DVD production are designed to achieve a thickness uniformity of +/−5 micron.
One way of bonding two substrates is to coat each of the substrates individually with UV curable lacquer in a spin coating process and to join the substrates under vacuum (see e.g. WO2004/057939 & US2003/0179693). There are several techniques to control the thickness and thickness uniformity of the individual layers on the individual substrates very accurately. One way is to use a controlled heating of the lacquer during spinning and an appropriate spin profile (US2003/0145941 & WO2004/050261).
However, the control of the thickness uniformity of the lacquer applied on the substrates is not sufficient to guarantee a homogenous bonding layer. During the joining process and after joining there will be an unavoidable lacquer flow which causes uncontrollable changes in the thickness uniformity. This flow is driven by capillarity forces and also by mechanical forces originating from the not perfectly flat shape of the substrates.
Secondly, there is the unsolved problem of excess bonding lacquer at the outer edge of the substrates. Due to the nature of the bonding process there will be a certain amount of resin at the outer edge of the two substrates. After separation of the stamper substrate this adhesive material remains connected to the bonding layer and/or the first substrate. Due to its brittleness, the hardened adhesive forms a sharp rim around the substrate and dust or particles can easily be created. Sticking on the surface of the media those particles are lowering the production yield significantly.
Furthermore this sharp rim is causing process problems for the subsequent production steps, e.g. an additional lacquering or bonding step.
In order to create a bonding layer with a high uniformity in between a first substrate and a stamper substrate with a minimum of excess bonding lacquer at the outer rim, the following process has been developed. The following steps describe the method:
1.) Lacquering of the First Substrate and the Stamper Substrate.
Both, the first substrate and the stamper substrate have to be coated with UV-curable resin in a spin coating step. The typical viscosity used to achieve finally a bonding layer thickness of 20-50 micron is 200 to 700 mPas. It is possible to apply different lacquer types onto the two substrates. In general, the lacquer on the stamper substrate has to have good replication properties, whereas the lacquer on the first substrate is usually selected according the needed adhesion and mechanical properties. The lacquer thickness on the first substrate might be thicker then the lacquer thickness on the stamper substrate or the other way round.
The individual layer uniformity may be adjusted according to the requirements by special means during the spin coating process, e.g. heat treatment.
2.) Irradiation at Least One Substrate with Low Power UV Light.
After spin coating at least one of the substrates is irradiated with low intensity UV light. Here, low power UV intensity means a UV irradiance of less the 100 mW/cm2; in contrast to high power UV irradiance of >500 mW/cm2 which is typically used for final curing of UV curable lacquers used in optical data storage industry. The aim is to reduce the lacquer flow during the following bonding step by increasing the viscosity of the lacquer, at least of a fraction of the lacquer. The light intensity has to be low enough, to ensure a wet surface on both disks. Joining two wet surfaces reduces the probability of air bubble formation during the bonding process. The hardening of the lacquer on one side of one of the substrates, as described in U.S. Pat. No. 6,136,133 has to be avoided because of the risk of air bubble inclusions during the joining process.
Preferably the pre-curing step will be done directly prior to bonding. Rotation or masking of the substrate(s) is not necessary. In one embodiment the UV light was supplied via a light guide to the substrate. The light guide was mounted 170 mm above the centre of the substrate to be cured. At the centre of the disc a UV intensity of around 45 mW/cm2 was measured. Due to the geometry, the UV intensity is decreasing to the outside of the disk. The typical curing time is 0.8 seconds.
3.) Joining the Disk in Vacuum
Joining in vacuum was done using the joining process described in WO2004/057939. Disks are joined in a controlled way, without pressing the substrates together.
4.) Irradiation of the Joined Disk
Directly after venting and opening the vacuum chamber the disc has to be irradiated a second time with low power UV-light to avoid a flow of the remaining liquid lacquer. The time delay between venting and second pre-curing should be less then 1 second, preferably less then 0.5 s. The same UV source can be used which was used in the first pre-curing step. This time of course, the UV light has to pass either the first substrate or the stamper substrate.
It is important to note that directly after the vacuum bonding, the curing efficiency of the lacquer in between the substrates is significantly increased in comparison to standard conditions. This is because the oxygen molecules, which are normally decelerating the curing effect, have been removed in the vacuum process. Therefore, the second low power pre-curing of the bonded substrates leads to a considerably hardened lacquer in between the two disks.
However, due to the existence of oxygen in the vicinity of the outer rim of the bonded substrates, the lacquer at the surface of the outer rim of the disc remains liquid under the second pre-curing step.
5.) Removal of the Excess Lacquer Using a Spinning Step
The liquid lacquer at the outer rim can be removed in a subsequent spinning step with a rotation speed higher then 500 rpm. This step is a cleaning step of the outer rim to avoid the mentioned sharp rim of lacquer typically seen after separation of the two substrates.
6.) Separation
A final curing step has to be done with high power UV light, typically 600 mW/cm2 is used. This is necessary to harden the remaining tacky resin at the outer edge. However, it is possible to separate the stamper substrate from the first substrate before final curing or after final curing.
With the inventive pre-curing before and after the bonding process the production of highly uniform bonding layer is possible. With the inventive post spinning the outer edge of the disc can be cleaned without changing the homogeneity of the bonding layer.
The amount of waste lacquer is minimized, because only a very low fraction of lacquer is removed from the disc after pre-curing. Precuring is done without any mask therefore there are no alignment problems, usually connected with the usage of a mask. The 2 precuring steps can be done with one and the same curing device.
The invention proposes a step of pre-curing before and after bonding of a first substrate and a second (stamper) substrate followed by spin-cleaning and separation. It comprises
A method for bonding of disk shaped substrates, with the steps
Further features & embodiments comprise steps individually or jointly applicable, like:
The present invention will be understood and appreciated more fully from the following detailed description taken in conjunction with the drawings in which:
A 1.1 mm thick BD substrate, coated with a thin silver layer, has been coated with 18 micron of UV curable lacquer (viscosity 450 mPas) in a spin coating process. During the spin coating a heat treatment of the lacquer was used to achieve a homogenous lacquer layer.
In a second step, a 0.6 mm thick stamper substrate has been lacquered in the same way with a 7 micron thick layer. The stamper disk material was made out of cyclo-olefin polymer material to ensure good separation properties.
Prior to bonding the 18 micron thick lacquer layer on the BD substrate was irradiated with UV light. The UV light was supplied using a light guide 130 mm above the centre of the first substrate. At the centre of the disc a UV intensity of around 45 mW/cm2 was measured. Due to the geometry, the UV intensity is decreasing to the outside of the disk.
The same light source was used to irradiate the bonded substrates again, immediately after the bonding chamber has been opened (less the 200 ms time delay between opening and UV irradiation). The Disk was then transported to a spin coater and the excess lacquer was removed at a spin speed of 500 rpm for 0.2 seconds. After final curing and separation of the stamper substrate, a thickness uniformity was measured as shown in
Another experiment was done to show the effect of a time delay between bonding and post-bonding curing. This time a 50 micron bonding layer was adjusted and there was no pre-curing before bonding. Several disks have been prepared with different time delays between vacuum bonding and low UV intensity irradiation. Finally the thickness uniformity was analyzed. As shown in
| Number | Date | Country | |
|---|---|---|---|
| 60753146 | Dec 2005 | US |
