This Application claims priority of Taiwan Patent Application No. 102142575, filed on Nov. 22, 2013, the entirety of which is incorporated by reference herein.
1. Field of the Invention
The present invention relates to a method for producing a light-emitting diode, and in particular to a method for producing a light-emitting diode capable of controlling an area of a die bonding adhesive layer.
2. Description of the Related Art
The area of a die bonding adhesive layer can deeply affect the performance of a light-emitting diode. If the area of the die bonding adhesive layer is too small, heat generated by light chips may not be sufficiently transmitted to the carrier. If the area of the die bonding adhesive layer is too big, the die bonding adhesive layer may cover the light chips, and the light generated by the light chips may be absorbed by the die bonding adhesive layer. Conventionally, the die bonding adhesive layer is formed on the carrier via glue dropping, and the quantity of glue and the area of the die bonding adhesive layer cannot be controlled.
In one embodiment, a method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed.
In another embodiment, a method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a patterned photoresist layer is formed on the die bonding surface, wherein the patterned photoresist layer comprises an opening, and the die bonding surface is uncovered in the opening. Next, a die bonding adhesive layer is formed in the opening. Then, a lighting chip is disposed on the die bonding adhesive layer. Finally, the patterned photoresist layer is removed.
Utilizing the method for producing a light-emitting diode of the first embodiment of the invention, the area of the portion of the die bonding adhesive layer under each lighting chip is controlled to be smaller than or equal to the area of the lighting chip. Therefore, the bounding area is precisely controlled without becoming too big or too small. The heat generated by the lighting chip can be sufficiently transmitted to the carrier, and the light generated by the lighting chip would not be absorbed by the die bonding adhesive layer.
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
In one embodiment, the step of removing the exposed portion of the die bonding adhesive layer (S14) further comprises the following steps. First, a photolithography process is performed with the lighting chips as a mask, wherein the uncovered portion of the die bonding adhesive layer is exposed. Then, an anisotropic etching is performed to remove the exposed uncovered portion of the die bonding adhesive layer.
Utilizing the method for producing a light-emitting diode of the first embodiment of the invention, the area of the portion of the die bonding adhesive layer under each lighting chip is controlled to be smaller than or equal to the area of the lighting chip. Therefore, the bounding area is precisely controlled without becoming too big or too small. The heat generated by the lighting chip can be sufficiently transmitted to the carrier, and the light generated by the lighting chip would not be absorbed by the die bonding adhesive layer.
Utilizing the method for producing a light-emitting diode of the second embodiment of the invention, the area of the portion of the die bonding adhesive layer under each lighting chip is controlled to be smaller than or equal to the area of the lighting chip. Therefore, the bounding area is precisely controlled without becoming too big or too small. The heat generated by the lighting chip can be sufficiently transmitted to the carrier, and the light generated by the lighting chip would not be absorbed by the die bonding adhesive layer.
After the steps mentioned above, a wire bonding step and a package step can be performed on the light chip.
Use of ordinal terms such as “first”, “second”, “third”, etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
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102142575 | Nov 2013 | TW | national |