Claims
- 1-11. (Canceled).
- 12. A process for producing Si, comprising the steps of:
a) adding at least one particular solution to a solid SiO in a total molar amount of from {fraction (1/20)} to 1000 times with respect to moles of the solid SiO to form a mixture, the particular solution comprising one of:
one of oxide, hydroxide, carbonate and fluoride of an alkali metal element, one of an oxide, hydroxide, carbonate or fluoride of an alkaline earth metal element, and two or more of such compounds, b) heating the mixture at approximately between the melting point of Si and 2000° C. to induce a chemical reaction which produces Si so as to obtain a reaction by-product; and c) separating and recovering Si from the reaction by-product.
- 13. The process according to claim 12, wherein the alkali metal element is at least one of sodium and potassium, and wherein the alkaline earth metal element is at least one of magnesium, calcium and barium.
- 14. The process according to claim 12, wherein, in step (b), the mixture is heated at the temperature of the melting point of Si and 1700° C.
- 15. The process according to claim 12, wherein, in step b, the atmosphere provided to be heated is an inert atmosphere.
- 16. The process according to claim 12, wherein, in step b, the atmosphere provided to be heated is an oxidizing atmosphere.
- 17. The process according to claim 12, wherein, in step b, the atmosphere provided to be heated is a reducing atmosphere.
- 18. The process according to claim 12, wherein at least 20 wt % of the solid SiO consists of one or more forms of particular particles with a mean particle size of at most 1 μm, particular flakes of lengths of at least 1 cm, and particular masses with lengths of at least 1 cm.
- 19. The process according to claim 12, further comprising the step of:
d) after step (c), washing to remove deposits on Si with a hydrofluoric acid.
- 20. The process according to claim 12, further comprising the step of:
e) after step (c), washing Si with hot water at 30-300° C. to remove the deposits.
- 21. The process according to claim 12, further comprising the step of:
f) after step (c), vacuum-treating Si at a further temperature between the melting point and the boiling point of Si to increase purity.
- 22. A process for producing Si, comprising the steps of:
a) adding a substance to a solid SiO in a total molar amount of from {fraction (1/20)} to 1000 times with respect to moles of the solid SiO to form a mixture, the substance containing one of:
one of oxide, hydroxide, carbonate and fluoride of an alkali metal element, one of an oxide, hydroxide, carbonate or fluoride of an alkaline earth metal element, and two or more of such compounds, b) heating the mixture at approximately between the melting point of Si and 2000° C. to induce a chemical reaction which produces Si so as to obtain a reaction by-product; and c) separating and recovering Si from the reaction by-product.
- 23. The process according to claim 22, wherein the alkali metal element is at least one of sodium and potassium, and wherein the alkaline earth metal element is at least one of magnesium, calcium and barium.
- 24. The process according to claim 22, wherein, in step (b), the mixture is heated at the temperature of the melting point of Si and 1700° C.
- 25. The process according to claim 22, wherein, in step b, the atmosphere provided to be heated is an inert atmosphere.
- 26. The process according to claim 22, wherein, in step b, the atmosphere provided to be heated is an oxidizing atmosphere.
- 27. The process according to claim 22, wherein, in step b, the atmosphere provided to be heated is a reducing atmosphere.
- 28. The process according to claim 22, wherein at least 20 wt % of the solid SiO consists of one or more forms of particular particles with a mean particle size of at most 1 μm, particular flakes of lengths of at least 1 cm, and particular masses with lengths of at least 1 cm.
- 29. The process according to claim 22, further comprising the step of:
d) after step (c), washing to remove deposits on Si with a hydrofluoric acid.
- 30. The process according to claim 22, further comprising the step of:
e) after step (c), washing Si with hot water at 30-300° C. to remove the deposits.
- 31. The process according to claim 22, further comprising the step of:
f) after step (c), vacuum-treating Si at a further temperature between the melting point and the boiling point of Si to increase purity.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2002-213853 |
Jul 2002 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application is a national stage application of PCT Application No. PCT/JP03/09275 which was filed on Jul. 22, 2003, and published on Jan. 29, 2004 as International Publication No. WO 2004/009493 (the “International Application”). This application claims priority from the International Application pursuant to 35 U.S.C. § 365. The present application also claims priority under 35 U.S.C. § 119 from Japanese Patent Application No. 2002-213853 filed on Jul. 23, 2002, the entire disclosure of which is incorporated herein by reference.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP03/09275 |
7/22/2003 |
WO |
|