Claims
- 1. A coated article produced by a method comprising
- applying a fillerless composition comprising hydrogen silsesquioxane resin onto a substrate to form a film at least 1.25 .mu.m thick and
- heating the film at a temperature of 150.degree. C. to 500.degree. C. in an inert or oxygen containing environment for a time sufficient to produce an insoluble coating free of cracks having a thickness of at least 1.25 .mu.m.
- 2. The coated article as claimed in claim 1 wherein the insoluble coating has a thickness of 1.5 to 10 .mu.m.
- 3. The coated article as claimed in claim 1 wherein the insoluble coating has a thickness of 1.5 to 2.2 .mu.m.
- 4. The coated article as claimed in claim 1 wherein the substrate is an electronic substrate.
- 5. The coated article as claimed in claim 1 wherein the substrate is an electronic substrate over metalization.
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 08/870,563 filed on Jun. 6, 1997, now U.S. Pat. No. 5,866,197.
US Referenced Citations (26)
Foreign Referenced Citations (6)
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742184 |
Nov 1996 |
EPX |
59-178749 |
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JPX |
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WOX |
Non-Patent Literature Citations (2)
Entry |
Lyakin et al, Elektron. Org. Mater., pp. 115-118, 1985. |
Aderikha et al, Vestsi AKAD. NAVUK BSSR, Ser. FIZ.--TEKH. NAVUK, 2, pp. 43-47, 1989. |
Divisions (1)
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Number |
Date |
Country |
Parent |
870563 |
Jun 1997 |
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