Method for providing an improved AFM reader shield

Information

  • Patent Grant
  • 9431047
  • Patent Number
    9,431,047
  • Date Filed
    Tuesday, June 25, 2013
    10 years ago
  • Date Issued
    Tuesday, August 30, 2016
    7 years ago
Abstract
A method provides a magnetic transducer including a first shield, a read sensor, and a second shield. The read sensor is between the first shield and the second shield. The read sensor has at least one pinned layer aligned with a sensor pinning direction. Providing the second shield includes depositing at least one of a first ferromagnetic layer, a second ferromagnetic and a pinning layer in the presence of a first magnetic field in a first direction non-orthogonal and non-parallel to the sensor pinning direction. A nonmagnetic spacer layer is between the first ferromagnetic layer and the second ferromagnetic layer. The pinning layer is adjacent to the second ferromagnetic layer. The first ferromagnetic layer is between the read sensor and the nonmagnetic spacer layer. The first ferromagnetic layer is coupled antiparallel with the second ferromagnetic layer.
Description
BACKGROUND


FIG. 1 depicts an air-bearing surface (ABS) view of a conventional read transducer 10. The conventional read transducer 10 includes shields 12 and 20, sensor 14 and magnetic bias structures 16. The read sensor 14 is typically a giant magnetoresistive (GMR) sensor or tunneling magnetoresistive (TMR) sensor. The read sensor 14 includes an antiferromagnetic (AFM) layer, a pinned layer, a nonmagnetic spacer layer, and a free layer. Also shown is a capping layer. In addition, seed layer(s) may be used. The free layer has a magnetization sensitive to an external magnetic field. Thus, the free layer functions as a sensor layer for the magnetoresistive sensor 14. The magnetic bias structures 16 may be hard bias structures or soft bias structures 16. These magnetic bias structures are used to magnetically bias the sensor layer of the sensor 14.


Although the conventional transducer 10 functions, there are drawbacks. In particular, the magnetic moment of the shield 20 may be unstable. For example, there may be multiple magnetic domains within the shield 20. Movement of domain walls and other changes to the magnetic moment of the shield 20 may introduce noise or otherwise adversely affect performance of the conventional read transducer 10.


Accordingly, what is needed is a system and method for improving the performance of a magnetic recording read transducer.





BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS


FIG. 1 depicts a conventional read transducer.



FIG. 2 depicts an ABS view of an exemplary embodiment of a magnetic recording read transducer.



FIG. 3 is flow chart depicting an exemplary embodiment of a method for fabricating a magnetic recording read transducer.



FIG. 4 depicts a plan view of an exemplary embodiment of magnetic recording transducers during fabrication.



FIG. 5 depicts a plan view of another exemplary embodiment of magnetic recording transducers during fabrication.



FIG. 6 depicts an ABS view of another exemplary embodiment of a portion of a shield in a magnetic recording read transducer.



FIG. 7 is flow chart depicting an exemplary embodiment of a method for fabricating a shield in a magnetic recording read transducer.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS


FIG. 2 depicts an ABS view of a portion of an exemplary embodiment of a magnetic read transducer 50. For clarity, FIG. 2 is not to scale. The read transducer 50 may be part of a read head or may be part of a merged head that also includes a write transducer. The transducer 50 includes shields 52 and 60, a read sensor 54, and magnetic bias structures 58. The sensor 54 shown is a GMR or TMR sensor. Thus, the sensor 54 includes a sensor pinning layer 51 that may be an AFM layer, a pinned layer 53, a nonmagnetic spacer layer 55, a free layer 57, and a capping layer (not labeled in FIG. 2). The sensor 54 may also include seed layer(s) (not shown). An AFM layer 51 is used to pin the magnetic moment of the pinned layer 53 in a direction. This pinning direction may be set by annealing the sensor 54 in a magnetic field oriented in the desired, sensor pinning, direction. In other embodiments, the pinning layer 51 may be omitted or may use a different pinning mechanism. The pinned layer 53 and free layer 57 are each shown as a single layer, but may include multiple layers including but not limited to a synthetic antiferromagnetic (SAF) structure. The nonmagnetic spacer layer 55 may be a conductive layer, a tunneling barrier layer, or other analogous layer. Although depicted as a GMR or TMR sensor, in other embodiments, other structures and other sensing mechanisms may be used for the sensor.


The magnetic bias structures 58 may be soft bias structures fabricated with soft magnetic material(s). In such an embodiment, the soft magnetic bias structures 58 have a high permeability and a coercivity of less than ten Oe. In some such embodiments, the soft magnetic bias structures 58 have a coercivity of not more than five Oe. For example, the soft magnetic bias structures 58 may include NiFe, such as Permalloy. In other embodiments, the magnetic bias structures 58 may be hard magnetic bias structures. In such embodiments, the hard magnetic bias structures would have their magnetic moment set perpendicular to the sensor pinning direction. Because the soft magnetic bias structures 56 have a magnetic moment, the soft magnetic bias structures 56 magnetically bias the free layer.


The magnetic read transducer 50 also includes an antiparallel coupled second shield 60. The shield 60 includes ferromagnetic layers 62 and 66, nonmagnetic spacer layer 64, and pinning layer 68. The shield 60 may also include a capping layer 70. The ferromagnetic layers 62 and 66 are separated by nonmagnetic spacer layer 64. The nonmagnetic spacer layer 64 may be Ru, which allows the magnetic moments of the layers 62 and 66 to be coupled antiparallel. The nonmagnetic spacer layer 64 may have a thickness of at least four Angstroms and not more than ten Angstroms. If such a Ru layer is used, the ferromagnetic layers 62 and 66 may be antiferromagnetically coupled via an RKKY interaction. In other embodiments, another coupling mechanism may be used. The ferromagnetic layers 62 and 66 may each be a simple layer or a multilayer. For example, the ferromagnetic layer 62 may include a NiFe layer and CoFe layer. The ferromagnetic layer 66 may include a CoFe layer and a NiFe layer. In other embodiments the ferromagnetic layer 66 may include two CoFe layers that sandwich a NiFe layer The NiFe is a soft magnetic material. The moment of the ferromagnetic layer 66 is pinned by the pinning layer 68. The pinning layer 68 is typically an antiferromagnet (AFM), such as IrMn.



FIG. 3 is an exemplary embodiment of a method 100 for providing a read transducer including an antiparallel coupled shield. For simplicity, some steps may be omitted, interleaved, and/or combined. The method 100 is also described in the context of providing a single recording transducer 50 and shield 60 depicted in FIG. 2. However, the method 100 may be used to fabricate multiple transducers at substantially the same time. The method 100 may also be used to fabricate other shields including but not limited to the shield 60. The method 100 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 100 also may start after formation of other portions of the magnetic recording transducer.


Referring to FIGS. 2-3, the first shield 52 is provided, via step 102. Step 102 typically includes depositing a large high permeability layer. The sensor 54 is provided, via step 104. Step 104 typically includes depositing the layers for the sensor 54, then defining the sensor 54 in at least the track width direction using an ion mill. In some embodiments, the free layer 57 and pinned layer 53 of the sensor 54 are also defined in the stripe height direction. The direction in which the magnetic moment of the pinned layer 53 is pinned is also set in step 104. This direction is termed herein the sensor pinning direction. Step 104 may include annealing the sensor 54 in the presence of a magnetic field oriented in the direction in which the magnetic moment of the pinned layer 53.


The magnetic bias structures 58 may optionally be provided, via step 106. The magnetic bias structures 58 may be soft magnetic bias structures. Step 106 may thus include depositing the high permeability and any other material(s) for the magnetic bias structures 58 and defining the magnetic bias structures 58 in the track width and stripe height direction. In some embodiments, portions of steps 104 and 106 are interleaved. For example, portions of the sensor 54 may be defined in the stripe height direction as the soft magnetic bias structures are defined in the stripe height direction. Step 106 may also include depositing multiple layers for the soft magnetic bias structures 58. Further, in some embodiments, the soft magnetic bias structures 58 are provided such that they may be magnetically coupled to the shield 52 and/or 60. In other embodiments, step 106 may form hard bias structures. In such embodiments, the hard bias materials, which have a coercivity higher than that used in reading or writing, are deposited. In addition, a field may be applied to set the magnetization direction for the hard bias structures 58. In such embodiments, the hard bias magnetic field applied in step 106 is generally perpendicular to the sensor pinning direction of step 104. Thus, the hard bias pinning direction is also perpendicular to the sensor pinning direction.


The shield 60 is provided in step 108. In some embodiments, the substeps of step 108 are performed as a single processing block in a single deposition system. Thus, the ferromagnetic layers 62 and 66, nonmagnetic layer 64, pinning layer 68 and capping layer 70 are provided, via step 108. Step 108 includes depositing one or more of the layers 62, 66 and 68 in a magnetic field. These deposition magnetic fields may be oriented such that is it neither orthogonal to nor parallel to the sensor pinning direction. In some embodiments, all of the magnetic layers 62, 66 and 68 are deposited in field(s) oriented in the same direction. In some embodiments, the magnitude of the deposition magnetic field(s) for the layers 62 and 66 are also the same. In other words, the same deposition magnetic field may be used for each of the layers 62 and 66. Typically, the magnitude of the magnetic field for the layer 68 is lower than that used for the layers 62 and 66. In some embodiments, the deposition field is oriented at least forty-five degrees and not more than seventy degrees from the sensor pinning direction. In some such embodiments, the deposition field is at least fifty degrees and not more than sixty degrees from the sensor pinning direction. If a hard bias structure is used for magnetic bias structures 58, then the direction of the magnetic field used in step 108 may be between the sensor pinning direction and the hard bias magnetic field direction. However, in another embodiment, the deposition and/or annealing fields may be oriented in another direction.


In some embodiments, step 108 also includes annealing the second shield 60 in a magnetic field. This annealing magnetic field in step 108 may be oriented in the same direction as the deposition magnetic field for one or more of the layers 62, 66 and 68. However, the annealing magnetic field generally has a significantly larger magnitude than the deposition magnetic field. The annealing may be at a temperature of at least two hundred degrees and not more than two hundred and fifty degrees centigrade for a time of at least fifteen minutes and not more than two hours. In some embodiments, the anneal is at a temperature of at least two hundred twenty degrees and not more than two hundred thirty degrees centigrade for at least thirty minutes and not more than one hour. However, in other embodiments, other anneal times and/or temperatures may be used.


The orientations of the fields and pinning directions may be understood with reference to FIGS. 4-5. For example, FIG. 4 depicts an exemplary embodiment of a substrate 120 on which one or more magnetic transducers 50 may be fabricated. For simplicity, individual transducers 50 are not shown. For clarity, FIG. 4 is not to scale. FIG. 4 depicts the relevant directions of magnetic field(s) and/or pinning directions. Referring to FIGS. 2-4, the arrow 122 depicts the sensor pinning direction. Thus, the magnetic field used in step 104 is oriented along the arrow 122. As such, the arrow 122 is also the direction in which the magnetic moment of the pinned layer 53 is oriented and is referred to hereafter as the sensor pinning direction. The sensor pinning direction 122 thus indicates the direction of the magnetic field that provides the read sensor 54 and sets the direction of magnetization of the pinned layer 53. The dashed line indicates a direction perpendicular to the sensor pinning direction 122. The arrow 124 depicts the direction at which the deposition magnetic field(s) are oriented. These fields are at an angle, β, from the sensor pinning direction 122. This angle, β, neither zero nor ninety degrees. Although β is shown as being measured clockwise from the pinning direction 122, in other embodiments, β may be counterclockwise from the pinning direction 122. Further, the arrow 124 may also indicate the direction at which the shield 60 is annealed. Thus, the deposition magnetic field(s) and the annealing magnetic field(s) may oriented along the arrow 124.



FIG. 5 depicts another exemplary embodiment of a substrate 120′ on which one or more magnetic transducers 50 may be fabricated. For simplicity, individual transducers 50 are not shown. For clarity, FIG. 5 is not to scale. The components shown in FIG. 5 are analogous to those shown in FIG. 4 and are, therefore, labeled similarly. FIG. 5 depicts the relevant directions of magnetic field(s) and/or pinning directions. Referring to FIGS. 2-3 and 5, the arrow 122 depicts the sensor pinning direction, described above. The arrow 124 depicts the direction at which the deposition magnetic field(s) are oriented. These fields are at an angle, β, from the sensor pinning direction 122. This angle, β, neither zero nor ninety degrees. Although β is shown as being measured counterclockwise from the pinning direction 122, in other embodiments, β may be clockwise from the pinning direction 122. Further, the arrow 124 may also indicate the direction at which the shield 60 is annealed. Thus, the deposition magnetic field(s) and the annealing magnetic field(s) may oriented along the arrow 124.


In addition, in the embodiment shown in FIG. 5, the bias structures 58 are hard bias structures. The arrow 126 thus depicts the direction at which the magnetic moments of the hard bias structures 58 are oriented. The arrow 126 is thus termed the hard bias pinning direction 126. In the embodiment shown, the arrow 124 is between the sensor pinning direction 122 and the hard bias pinning direction 126. In other words, the deposition magnetic field(s) are oriented in a direction between the sensor pinning direction 122 and the hard bias pinning direction 126. Similarly, the annealing magnetic field for the shield 60 may be oriented in a direction between the sensor pinning direction 122 and the hard bias pinning direction 126. However, in other embodiments, the deposition magnetic field(s) and/or the annealing magnetic field(s) may be oriented in another direction.


The method 100 may result in improved performance of the magnetic transducer 50. Because the magnetic transducer 50 has an antiferromagnetically coupled second shield 60, the performance of the magnetic transducer 50 may be improved. More specifically, noise that may adversely affect the performance of a conventional magnetic transducer may be reduced or eliminated. Further, the stability of the antiferromagnetically coupled shield 60 may be enhanced. Deposition of the magnetic layers 62, 66 and/or 68 in a field as described above in conjunction with annealing the shield 60 in a field having the same direction may result in the magnetic moments of the layers 62 and 66 being more stably pinned. For example, there may be little or no change in the easy axes of the layers 62 and 66 at working temperatures of the magnetic transducer 50. The characteristics of the magnetic transducer 50 may be more stable. Thus, performance of the transducer 50 may be enhanced.



FIG. 4 is an exemplary embodiment of a portion of a shield 150. For clarity, FIG. 4 is not to scale. The shield 150 is analogous to the shield 60. However, the shield 140 includes multiple layers and/or materials rather than single monolithic layers, but may still be formed using the method 100. Referring to FIGS. 2-6, the shield 150 includes two ferromagnetic layers 160 and 180 separated by a nonmagnetic spacer layer 170. The ferromagnetic layers 160 and 180 may be magnetically soft. The ferromagnetic layers 160 and 180 are also coupled antiparallel through the nonmagnetic spacer layer 170, for example via an RKKY coupling. In some embodiments, therefore, the nonmagnetic spacer layer 170 may be Ru. The shield 150 may also include a pinning layer 190, such as an AFM layer, that pins the magnetic moment of the ferromagnetic layer 180. In some embodiments, the pinning layer 190 includes at least sixty and not more than three hundred Angstroms of IrMn. Thus, one ferromagnetic layer 160 may be adjacent to the magnetic bias structures 58 and sensor 54, while the other ferromagnetic layer 180 is adjacent to the pinning layer 190. In the embodiment shown, the ferromagnetic layer 180 is a soft magnetic layer.


The bottom ferromagnetic layer 160 includes two ferromagnetic layers 162 and 164 that are ferromagnetically coupled. In other embodiments, the ferromagnetic layer 160 may include another number of layers. Further, although depicted and described as separate layers, layers 162 and 164 may just be two portions 162 and 164 of the layer 160. For example, there may be no clear interface between the layers 162 and 164, simply change(s) in concentrations and/or types of constituents. The ferromagnetic layer 162 is a soft magnetic layer. For example, the ferromagnetic layer 162 may be a NiFe layer 162. The ferromagnetic layer 162 is also generally significantly thicker than the layer 164. In some embodiments, for example, the ferromagnetic layer 162 may be at least two hundred Angstroms thick, while the layer 164 is not more than thirty Angstroms thick. In other embodiments, the thicknesses of the layers 162 and 164 may vary.


The other ferromagnetic layer 164 is a CoFe layer. The CoFe layer 164 may include at least twenty-five atomic percent and not more than fifty atomic percent Fe. In other words, the layer 164 is Co1-xFex, where x is at least 0.25 and not more than 0.5. In some embodiments, the CoFe layer 164 includes at least thirty-five percent and not more than forty atomic percent Fe. However, other stoichiometries may be used in other embodiments. The layer 164 may also be thin. For example, the layer 164 may be not more than twenty Angstroms thick. In some embodiments, the layer 164 is not more than ten Angstroms thick. As described with respect to step 108 of the method 100, the ferromagnetic layer 160 may be deposited in a magnetic field oriented in a direction 124 at an angle, β, from the sensor pinning direction 122. Thus, the layers 162 and 164 may be deposited in the deposition magnetic field in the direction 124.


The ferromagnetic layer 180 is depicted as including layers 182, 184 and 186 that are ferromagnetically coupled. In other embodiments, the ferromagnetic layer 180 may include some combination of one or more of the layers 182, 184 and 186. In other embodiments, the ferromagnetic layer 180 may include another number of layers. The ferromagnetic layer 184 is a soft magnetic layer and may be a NiFe layer. The ferromagnetic layer 184 is also generally significantly thicker than the layer 182 or 186. In some embodiments, for example, the ferromagnetic layer 184 may be at least two hundred Angstroms thick, while the layers 182 and 186 may each be not more than thirty Angstroms thick. In some embodiments, the layers 182 and 186 may each be not more than twenty Angstroms thick. In some embodiments, the layers 182 and 186 are each not more than ten Angstroms thick. In other embodiments, the thicknesses of the layers 182, 184 and 186 may vary. The ferromagnetic layers 182 and 186 may each be a CoFe layer. The CoFe layers 182 and 186 may each includes at least twenty-five atomic percent and not more than fifty atomic percent Fe. In some embodiments, each of the CoFe layers 182 and 186 includes at least thirty-five percent and not more than forty atomic percent Fe. However, other stoichiometries are possible. As described with respect to step 108 of the method 100, the ferromagnetic layer 180 may be deposited in a magnetic field oriented in a direction 124 at an angle, β, from the sensor pinning direction 122. Thus, the layers 182, 184 and 184 may be deposited in the deposition magnetic field in the direction 124. Further, as discussed above for the method 100, the shield 150 may be annealed in a magnetic field along the direction 124.


Use of the method 100 in fabricating the shield 150 may result in the magnetic moments of the layers 162, 164, 182, 184 and 186 being more stable. Performance and stability of the magnetic shield 150, and thus the transducer 50, may be improved. Because of the presence of the CoFe layers 182 and 164, the coupling between the layers 160 and 180 may be enhanced. The saturation field, Hsat, may also be increased. In addition, peaks in the oscillations in the RKKY interaction between the layers 180 and 160 may be broadened. Thus, the antiferromagnetic coupling between the layers 160 and 180 may be less sensitive to the thickness of the layer 170. The margin for processing of the shield 150 may thus be increased. Performance of the shield 150 and, therefore, the magnetic recording transducer 50 may be enhanced. Further, the layer 180 has the CoFe layer 186 adjacent to the antiferromagnetic layer 190. In such embodiments, the exchange coupling between the ferromagnetic layer 180 and the AFM layer 190 is enhanced. Performance of the shield 150 and the magnetic recording transducer 50 may be further improved.



FIG. 7 is an exemplary embodiment of a method 200 for providing a shield having antiferromagnetically coupled layers, such as the shield(s) 60 and/or 150. For simplicity, some steps may be omitted, interleaved, and/or combined. The method 200 is also described in the context of providing a single shield 60/150 in a magnetic recording transducer 50 depicted in FIGS. 2 and 6. However, the method 200 may be used to fabricate multiple shields in multiple at substantially the same time. The method 200 may also be used to fabricate other shields. The method 200 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 200 also may start after formation of other portions of the magnetic recording transducer.


Referring to FIGS. 2 and 4-7, the first ferromagnetic layer 62/160 is deposited in a magnetic field aligned in a particular direction 124, via step 202. This field is in a direction 124 at a nonzero, nonorthogonal angle, β, from the sensor pinning direction 122. Step 202 may include depositing multiple layers 162 and 164 in the magnetic field.


The nonmagnetic spacer layer 64/170 is deposited, via step 204. This step may or may not be performed in the presence of a magnetic field. In some embodiments, step 204 includes depositing a Ru layer having a thickness of at least four and not more than ten Angstroms.


The ferromagnetic layer 66/180 is deposited in a magnetic aligned in a particular direction 124, via step 206. This field is in a direction 124 at a nonzero, nonorthogonal angle, β, from the sensor pinning direction 122. Thus, the magnetic fields used in steps 202 and 206 are aligned. In some embodiments, the same magnetic field is used in steps 202 and 206. Step 202 may include depositing multiple layers 182, 184 and 186 in the magnetic field.


The pinning layer 68/190 is deposited in a magnetic aligned in a particular direction 124, via step 208. This field is in a direction 124 at a nonzero, nonorthogonal angle, β, from the sensor pinning direction 122. Thus, the magnetic fields used in steps 202, 206 and 208 are aligned. In some embodiments, the same magnetic field is used in steps 202, 206 and 208.


The shield 60/150 is annealed in a field, via step 210. This annealing field is in a direction 124 at a nonzero, nonorthogonal angle, β, from the sensor pinning direction 122. Thus, the magnetic fields used in steps 202, 206, 208 and 210 are aligned. Note, however, that the magnitude of the magnetic field used in step 210 is generally greater than the magnitude of the field(s) used in steps 202, 206 and 208.


A more stable shield 60 and/or 150 may be provided using the method 200. Thus, the benefits of the shield 60 and/or 150 may be achieved.

Claims
  • 1. A method for providing a magnetic read transducer having an air-bearing surface (ABS) comprising: providing a first shield;providing a read sensor, the read sensor having at least one pinned layer aligned with a sensor pinning direction; andproviding a second shield, the read sensor residing between the first shield and the second shield, the at least one pinned layer being closer to the first shield than to the second shield, the step of providing the second shield further including depositing a first ferromagnetic layer, a second ferromagnetic layer and a pinning layer, at least one of the first ferromagnetic layer, the second ferromagnetic layer and the pinning layer being deposited in the presence of a first magnetic field in a first direction non-orthogonal and non-parallel to the sensor pinning direction, a nonmagnetic spacer layer residing between the first ferromagnetic layer and the second ferromagnetic layer, the pinning layer being adjacent to the second ferromagnetic layer, the first ferromagnetic layer residing between the read sensor and the nonmagnetic spacer layer, the first ferromagnetic layer being coupled antiparallel with the second ferromagnetic layer.
  • 2. The method of claim 1 wherein the step of providing the second shield further includes: annealing the second shield in a second magnetic field, the second magnetic field being aligned with the first direction.
  • 3. The method of claim 1 wherein the first direction is at least forty-five degrees and not more than seventy degrees from the sensor pinning direction.
  • 4. The method of claim 3 wherein the first direction is at least fifty degrees and not more than sixty degrees from the sensor pinning direction.
  • 5. The method of claim 1 further comprising: providing a hard bias structure adjacent to the sensor, the hard bias structure having a magnetic moment aligned in a hard bias direction, the hard bias direction being substantially perpendicular to the sensor pinning direction.
  • 6. The method of claim 1 further comprising: providing a soft bias structure adjacent to the sensor, the soft bias structure having a magnetic moment that is magnetically coupled with the second shield.
  • 7. The method of claim 1 wherein the nonmagnetic spacer layer includes Ru.
  • 8. The method of claim 7 wherein the nonmagnetic spacer layer has a thickness of at least four Angstroms and not more than ten Angstroms.
  • 9. The method of claim 7 wherein the first ferromagnetic layer and the second ferromagnetic layer each include NiFe.
  • 10. The method of claim 1 wherein the first ferromagnetic layer includes a NiFe layer and a CoFe layer, the CoFe layer residing between the NiFe layer and the nonmagnetic spacer layer.
  • 11. The method of claim 1 wherein the second ferromagnetic layer includes a NiFe layer and a CoFe layer, the CoFe layer residing between the NiFe layer and the nonmagnetic layer.
  • 12. The method of claim 11 wherein the second ferromagnetic layer includes an additional CoFe layer, the NiFe layer being between the CoFe layer and the additional CoFe layer.
  • 13. The method of claim 1 wherein the first ferromagnetic layer, the second ferromagnetic layer and the pinning layer are deposited in the presence of the magnetic field.
  • 14. The method of claim 1 wherein the pinning layer includes an antiferromagnetic layer.
  • 15. The method of claim 1 wherein the step of providing the second shield further includes: providing the second shield such that the magnetic read transducer is free of ferromagnetic materials between the free layer and the second shield.
  • 16. A method for providing a magnetic read transducer having an air-bearing surface (ABS) comprising: providing a first shield;providing a read sensor, the read sensor having at least one pinned layer aligned with a sensor pinning direction;providing a soft bias structure adjacent to the sensor, the soft bias structure having a magnetic moment; andproviding a second shield, the read sensor residing between the first shield and the second shield, the at least one pinned layer being closer to the first shield than to the second shield, the step of providing the second shield further including depositing a first ferromagnetic layer, a second ferromagnetic layer and a pinning layer in the presence of a first magnetic field in a first direction, the first direction being at least fifty-five and not more than sixty degrees from the sensor pinning direction;depositing a nonmagnetic spacer layer between the first ferromagnetic layer and the second ferromagnetic layer, the pinning layer being adjacent to the second ferromagnetic layer, the first ferromagnetic layer residing between the read sensor and the nonmagnetic spacer layer, the first ferromagnetic layer being coupled antiparallel with the second ferromagnetic layer, the nonmagnetic spacer layer including a Ru layer having a thickness of at least four and not more than ten Angstroms; andannealing the second shield in a second magnetic field, the second magnetic field being aligned with the first direction.
  • 17. The method of claim 16 wherein the first ferromagnetic layer includes a NiFe layer and a CoFe layer, the CoFe layer residing between the NiFe layer and the nonmagnetic spacer layer.
  • 18. The method of claim 16 wherein the second ferromagnetic layer includes a NiFe layer and a CoFe layer, the CoFe layer residing between the NiFe layer and the nonmagnetic spacer layer.
  • 19. The method of claim 16 wherein the nonmagnetic spacer layer is Ru.
  • 20. A method for providing a magnetic read transducer having an air-bearing surface (ABS) comprising: providing a first shield;providing a read sensor, the read sensor having at least one pinned layer aligned with a sensor pinning direction;providing a magnetic bias structure adjacent to the sensor; andproviding a second shield, the read sensor residing between the first shield and the second shield, the at least one pinned layer being closer to the first shield than to the second shield, the step of providing the second shield further including depositing a first ferromagnetic layer in the presence of a first magnetic field in a first direction non-orthogonal and non-parallel to the sensor pinning direction;depositing a nonmagnetic spacer layer;depositing a second ferromagnetic in the presence of a second magnetic field in the first direction, the nonmagnetic spacer layer being between the first ferromagnetic layer and the second ferromagnetic layer, the first ferromagnetic layer being coupled antiparallel with the second ferromagnetic layer; anddepositing a pinning layer in the presence of a third magnetic field in the first direction; andannealing the second shield in a fourth magnetic field, the fourth magnetic field being aligned with the first direction.
  • 21. The method of claim 20 wherein the first direction is at least fifty-five and not more than sixty degrees from the sensor pinning direction.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to provisional U.S. Patent Application Ser. No. 61/818,389, filed on May 1, 2013, which is hereby incorporated by reference in its entirety.

US Referenced Citations (681)
Number Name Date Kind
5583725 Coffey et al. Dec 1996 A
5804250 Yang Sep 1998 A
5838521 Ravipati Nov 1998 A
6016290 Chen et al. Jan 2000 A
6018441 Wu et al. Jan 2000 A
6025978 Hoshi et al. Feb 2000 A
6025988 Yan Feb 2000 A
6032353 Hiner et al. Mar 2000 A
6033491 Lin Mar 2000 A
6033532 Minami Mar 2000 A
6034851 Zarouri et al. Mar 2000 A
6043959 Crue et al. Mar 2000 A
6046885 Aimonetti et al. Apr 2000 A
6049650 Jerman et al. Apr 2000 A
6055138 Shi Apr 2000 A
6058094 Davis et al. May 2000 A
6073338 Liu et al. Jun 2000 A
6078479 Nepela et al. Jun 2000 A
6081499 Berger et al. Jun 2000 A
6094803 Carlson et al. Aug 2000 A
6099362 Viches et al. Aug 2000 A
6103073 Thayamballi Aug 2000 A
6108166 Lederman Aug 2000 A
6118629 Huai et al. Sep 2000 A
6118638 Knapp et al. Sep 2000 A
6125018 Takagishi et al. Sep 2000 A
6129957 Xiao et al. Oct 2000 A
6130779 Carlson et al. Oct 2000 A
6134089 Barr et al. Oct 2000 A
6136166 Shen et al. Oct 2000 A
6137661 Shi et al. Oct 2000 A
6137662 Huai et al. Oct 2000 A
6160684 Heist et al. Dec 2000 A
6163426 Nepela et al. Dec 2000 A
6166891 Lederman et al. Dec 2000 A
6173486 Hsiao et al. Jan 2001 B1
6175476 Huai et al. Jan 2001 B1
6178066 Barr Jan 2001 B1
6178070 Hong et al. Jan 2001 B1
6178150 Davis Jan 2001 B1
6181485 He Jan 2001 B1
6181525 Carlson Jan 2001 B1
6185051 Chen et al. Feb 2001 B1
6185077 Tong et al. Feb 2001 B1
6185081 Simion et al. Feb 2001 B1
6188549 Wiitala Feb 2001 B1
6190764 Shi et al. Feb 2001 B1
6193584 Rudy et al. Feb 2001 B1
6195229 Shen et al. Feb 2001 B1
6198608 Hong et al. Mar 2001 B1
6198609 Barr et al. Mar 2001 B1
6201673 Rottmayer et al. Mar 2001 B1
6204998 Katz Mar 2001 B1
6204999 Crue et al. Mar 2001 B1
6212153 Chen et al. Apr 2001 B1
6215625 Carlson Apr 2001 B1
6219205 Yuan et al. Apr 2001 B1
6221218 Shi et al. Apr 2001 B1
6222707 Huai et al. Apr 2001 B1
6229782 Wang et al. May 2001 B1
6230959 Heist et al. May 2001 B1
6233116 Chen et al. May 2001 B1
6233125 Knapp et al. May 2001 B1
6237215 Hunsaker et al. May 2001 B1
6252743 Bozorgi Jun 2001 B1
6255721 Roberts Jul 2001 B1
6258468 Mahvan et al. Jul 2001 B1
6266216 Hikami et al. Jul 2001 B1
6271604 Frank, Jr. et al. Aug 2001 B1
6275354 Huai et al. Aug 2001 B1
6277505 Shi et al. Aug 2001 B1
6282056 Feng et al. Aug 2001 B1
6296955 Hossain et al. Oct 2001 B1
6297955 Frank, Jr. et al. Oct 2001 B1
6304414 Crue, Jr. et al. Oct 2001 B1
6307715 Berding et al. Oct 2001 B1
6310746 Hawwa et al. Oct 2001 B1
6310750 Hawwa et al. Oct 2001 B1
6315839 Pinarbasi et al. Nov 2001 B1
6317290 Wang et al. Nov 2001 B1
6317297 Tong et al. Nov 2001 B1
6322640 Xiao et al. Nov 2001 B1
6322911 Fukagawa et al. Nov 2001 B1
6330136 Wang et al. Dec 2001 B1
6330137 Knapp et al. Dec 2001 B1
6333830 Rose et al. Dec 2001 B2
6340533 Ueno et al. Jan 2002 B1
6349014 Crue, Jr. et al. Feb 2002 B1
6351355 Min et al. Feb 2002 B1
6353318 Sin et al. Mar 2002 B1
6353511 Shi et al. Mar 2002 B1
6356412 Levi et al. Mar 2002 B1
6358635 Min et al. Mar 2002 B1
6359779 Frank, Jr. et al. Mar 2002 B1
6369983 Hong Apr 2002 B1
6376964 Young et al. Apr 2002 B1
6377535 Chen et al. Apr 2002 B1
6381095 Sin et al. Apr 2002 B1
6381105 Huai et al. Apr 2002 B1
6388847 Horng et al. May 2002 B1
6389499 Frank, Jr. et al. May 2002 B1
6392850 Tong et al. May 2002 B1
6396660 Jensen et al. May 2002 B1
6399179 Hanrahan et al. Jun 2002 B1
6400526 Crue, Jr. et al. Jun 2002 B2
6404600 Hawwa et al. Jun 2002 B1
6404601 Rottmayer et al. Jun 2002 B1
6404706 Stovall et al. Jun 2002 B1
6410170 Chen et al. Jun 2002 B1
6411522 Frank, Jr. et al. Jun 2002 B1
6413325 Shimazawa et al. Jul 2002 B1
6417998 Crue, Jr. et al. Jul 2002 B1
6417999 Knapp et al. Jul 2002 B1
6418000 Gibbons et al. Jul 2002 B1
6418048 Sin et al. Jul 2002 B1
6421211 Hawwa et al. Jul 2002 B1
6421212 Gibbons et al. Jul 2002 B1
6424505 Lam et al. Jul 2002 B1
6424507 Lederman et al. Jul 2002 B1
6430009 Komaki et al. Aug 2002 B1
6430015 Ju et al. Aug 2002 B2
6430806 Chen et al. Aug 2002 B1
6433965 Gopinathan et al. Aug 2002 B1
6433968 Shi et al. Aug 2002 B1
6433970 Knapp et al. Aug 2002 B1
6437945 Hawwa et al. Aug 2002 B1
6437949 Macken et al. Aug 2002 B1
6445536 Rudy et al. Sep 2002 B1
6445542 Levi et al. Sep 2002 B1
6445553 Barr et al. Sep 2002 B2
6445554 Dong et al. Sep 2002 B1
6447935 Zhang et al. Sep 2002 B1
6448765 Chen et al. Sep 2002 B1
6451514 Iitsuka Sep 2002 B1
6452385 Shimazawa et al. Sep 2002 B1
6452742 Crue et al. Sep 2002 B1
6452765 Mahvan et al. Sep 2002 B1
6456465 Louis et al. Sep 2002 B1
6456467 Mao et al. Sep 2002 B1
6459552 Liu et al. Oct 2002 B1
6462920 Karimi Oct 2002 B1
6466401 Hong et al. Oct 2002 B1
6466402 Crue, Jr. et al. Oct 2002 B1
6466404 Crue, Jr. et al. Oct 2002 B1
6468436 Shi et al. Oct 2002 B1
6469877 Knapp et al. Oct 2002 B1
6477019 Matono et al. Nov 2002 B2
6478884 Shimazawa et al. Nov 2002 B2
6479096 Shi et al. Nov 2002 B1
6482657 Shimazawa Nov 2002 B2
6483662 Thomas et al. Nov 2002 B1
6487040 Hsiao et al. Nov 2002 B1
6487056 Gibbons et al. Nov 2002 B1
6490125 Barr Dec 2002 B1
6496330 Crue, Jr. et al. Dec 2002 B1
6496334 Pang et al. Dec 2002 B1
6496335 Gill Dec 2002 B2
6504676 Hiner et al. Jan 2003 B1
6512657 Heist et al. Jan 2003 B2
6512659 Hawwa et al. Jan 2003 B1
6512661 Louis Jan 2003 B1
6512690 Qi et al. Jan 2003 B1
6515573 Dong et al. Feb 2003 B1
6515791 Hawwa et al. Feb 2003 B1
6532823 Knapp et al. Mar 2003 B1
6535363 Hosomi et al. Mar 2003 B1
6552874 Chen et al. Apr 2003 B1
6552928 Qi et al. Apr 2003 B1
6556392 Mao et al. Apr 2003 B1
6577470 Rumpler Jun 2003 B1
6583961 Levi et al. Jun 2003 B2
6583968 Scura et al. Jun 2003 B1
6597548 Yamanaka et al. Jul 2003 B1
6611398 Rumpler et al. Aug 2003 B1
6618223 Chen et al. Sep 2003 B1
6629357 Akoh Oct 2003 B1
6633464 Lai et al. Oct 2003 B2
6636393 Araki et al. Oct 2003 B1
6636394 Fukagawa et al. Oct 2003 B1
6636396 Gill Oct 2003 B1
6639291 Sin et al. Oct 2003 B1
6650503 Chen et al. Nov 2003 B1
6650506 Risse Nov 2003 B1
6654195 Frank, Jr. et al. Nov 2003 B1
6657816 Barr et al. Dec 2003 B1
6661621 Iitsuka Dec 2003 B1
6661625 Sin et al. Dec 2003 B1
6674610 Thomas et al. Jan 2004 B1
6680863 Shi et al. Jan 2004 B1
6683763 Hiner et al. Jan 2004 B1
6687098 Huai Feb 2004 B1
6687178 Qi et al. Feb 2004 B1
6687977 Knapp et al. Feb 2004 B2
6691226 Frank, Jr. et al. Feb 2004 B1
6697294 Qi et al. Feb 2004 B1
6700738 Sin et al. Mar 2004 B1
6700759 Knapp et al. Mar 2004 B1
6700760 Mao Mar 2004 B1
6704158 Hawwa et al. Mar 2004 B2
6707083 Hiner et al. Mar 2004 B1
6713801 Sin et al. Mar 2004 B1
6721138 Chen et al. Apr 2004 B1
6721149 Shi et al. Apr 2004 B1
6721203 Qi et al. Apr 2004 B1
6724569 Chen et al. Apr 2004 B1
6724572 Stoev et al. Apr 2004 B1
6724581 Westwood Apr 2004 B2
6729015 Matono et al. May 2004 B2
6735850 Gibbons et al. May 2004 B1
6737281 Dang et al. May 2004 B1
6744608 Sin et al. Jun 2004 B1
6747301 Hiner et al. Jun 2004 B1
6751055 Alfoqaha et al. Jun 2004 B1
6754048 Li et al. Jun 2004 B2
6754049 Seagle et al. Jun 2004 B1
6756071 Shi et al. Jun 2004 B1
6757140 Hawwa Jun 2004 B1
6760196 Niu et al. Jul 2004 B1
6762910 Knapp et al. Jul 2004 B1
6765756 Hong et al. Jul 2004 B1
6775902 Huai et al. Aug 2004 B1
6778358 Jiang et al. Aug 2004 B1
6781927 Heanuc et al. Aug 2004 B1
6785955 Chen et al. Sep 2004 B1
6791793 Chen et al. Sep 2004 B1
6791807 Hikami et al. Sep 2004 B1
6798616 Seagle et al. Sep 2004 B1
6798625 Ueno et al. Sep 2004 B1
6801408 Chen et al. Oct 2004 B1
6801409 Michel et al. Oct 2004 B2
6801411 Lederman et al. Oct 2004 B1
6803615 Sin et al. Oct 2004 B1
6806035 Atireklapvarodom et al. Oct 2004 B1
6807030 Hawwa et al. Oct 2004 B1
6807332 Hawwa Oct 2004 B1
6809899 Chen et al. Oct 2004 B1
6816345 Knapp et al. Nov 2004 B1
6828897 Nepela Dec 2004 B1
6829160 Qi et al. Dec 2004 B1
6829819 Crue, Jr. et al. Dec 2004 B1
6833979 Knapp et al. Dec 2004 B1
6834010 Qi et al. Dec 2004 B1
6848169 Shin et al. Feb 2005 B2
6859343 Alfoqaha et al. Feb 2005 B1
6859997 Tong et al. Mar 2005 B1
6861937 Feng et al. Mar 2005 B1
6870712 Chen et al. Mar 2005 B2
6873494 Chen et al. Mar 2005 B2
6873547 Shi et al. Mar 2005 B1
6876507 Chen et al. Apr 2005 B2
6879464 Sun et al. Apr 2005 B2
6888184 Shi et al. May 2005 B1
6888704 Diao et al. May 2005 B1
6891702 Tang May 2005 B1
6894871 Alfoqaha et al. May 2005 B2
6894877 Crue, Jr. et al. May 2005 B1
6906894 Chen et al. Jun 2005 B2
6909578 Missell et al. Jun 2005 B1
6912106 Chen et al. Jun 2005 B1
6934113 Chen Aug 2005 B1
6934129 Zhang et al. Aug 2005 B1
6940688 Jiang et al. Sep 2005 B2
6942824 Li Sep 2005 B1
6943993 Chang et al. Sep 2005 B2
6944938 Crue, Jr. et al. Sep 2005 B1
6947258 Li Sep 2005 B1
6950266 McCaslin et al. Sep 2005 B1
6954332 Hong et al. Oct 2005 B1
6958885 Chen et al. Oct 2005 B1
6961221 Niu et al. Nov 2005 B1
6969989 Mei Nov 2005 B1
6975486 Chen et al. Dec 2005 B2
6980403 Hasegawa Dec 2005 B2
6987643 Seagle Jan 2006 B1
6989962 Dong et al. Jan 2006 B1
6989972 Stoev et al. Jan 2006 B1
6998061 Cross Feb 2006 B1
7006327 Krounbi et al. Feb 2006 B2
7007372 Chen et al. Mar 2006 B1
7012832 Sin et al. Mar 2006 B1
7023658 Knapp et al. Apr 2006 B1
7026063 Ueno et al. Apr 2006 B2
7027268 Zhu et al. Apr 2006 B1
7027274 Sin et al. Apr 2006 B1
7029771 Hasegawa et al. Apr 2006 B2
7035046 Young et al. Apr 2006 B1
7041985 Wang et al. May 2006 B1
7046487 Terunuma May 2006 B2
7046490 Ueno et al. May 2006 B1
7054113 Seagle et al. May 2006 B1
7057857 Niu et al. Jun 2006 B1
7059868 Yan Jun 2006 B1
7092195 Liu et al. Aug 2006 B1
7110289 Sin et al. Sep 2006 B1
7111382 Knapp et al. Sep 2006 B1
7113366 Wang et al. Sep 2006 B1
7114241 Kubota et al. Oct 2006 B2
7116517 He et al. Oct 2006 B1
7124654 Davies et al. Oct 2006 B1
7126788 Liu et al. Oct 2006 B1
7126790 Liu et al. Oct 2006 B1
7131346 Buttar et al. Nov 2006 B1
7133253 Seagle et al. Nov 2006 B1
7134185 Knapp et al. Nov 2006 B1
7150093 Beach Dec 2006 B2
7154715 Yamanaka et al. Dec 2006 B2
7158351 Nakamoto et al. Jan 2007 B2
7166173 Beach Jan 2007 B2
7170725 Zhou et al. Jan 2007 B1
7177117 Jiang et al. Feb 2007 B1
7180712 Li et al. Feb 2007 B1
7193815 Stoev et al. Mar 2007 B1
7196880 Anderson et al. Mar 2007 B1
7199974 Alfoqaha Apr 2007 B1
7199975 Pan Apr 2007 B1
7211339 Seagle et al. May 2007 B1
7212384 Stoev et al. May 2007 B1
7238292 He et al. Jul 2007 B1
7239478 Sin et al. Jul 2007 B1
7248431 Liu et al. Jul 2007 B1
7248433 Stoev et al. Jul 2007 B1
7248449 Seagle Jul 2007 B1
7270896 Parkin Sep 2007 B2
7280325 Pan Oct 2007 B1
7283327 Liu et al. Oct 2007 B1
7284316 Huai et al. Oct 2007 B1
7286329 Chen et al. Oct 2007 B1
7289303 Sin et al. Oct 2007 B1
7292409 Stoev et al. Nov 2007 B1
7295401 Jayasekara et al. Nov 2007 B2
7296339 Yang et al. Nov 2007 B1
7307814 Seagle et al. Dec 2007 B1
7307818 Park et al. Dec 2007 B1
7310204 Stoev et al. Dec 2007 B1
7318947 Park et al. Jan 2008 B1
7333295 Medina et al. Feb 2008 B1
7337530 Stoev et al. Mar 2008 B1
7342751 Nagasaka et al. Mar 2008 B2
7342752 Zhang et al. Mar 2008 B1
7349170 Rudman et al. Mar 2008 B1
7349179 He et al. Mar 2008 B1
7354664 Jiang et al. Apr 2008 B1
7363697 Dunn et al. Apr 2008 B1
7371152 Newman May 2008 B1
7372665 Stoev et al. May 2008 B1
7375926 Stoev et al. May 2008 B1
7379269 Krounbi et al. May 2008 B1
7386933 Krounbi et al. Jun 2008 B1
7389577 Shang et al. Jun 2008 B1
7417832 Erickson et al. Aug 2008 B1
7419891 Chen et al. Sep 2008 B1
7428124 Song et al. Sep 2008 B1
7430098 Song et al. Sep 2008 B1
7436620 Kang et al. Oct 2008 B1
7436638 Pan Oct 2008 B1
7440220 Kang et al. Oct 2008 B1
7443632 Stoev et al. Oct 2008 B1
7443639 Parkin Oct 2008 B2
7444740 Chung et al. Nov 2008 B1
7493688 Wang et al. Feb 2009 B1
7508627 Zhang et al. Mar 2009 B1
7522377 Jiang et al. Apr 2009 B1
7522379 Krounbi et al. Apr 2009 B1
7522382 Pan Apr 2009 B1
7542246 Song et al. Jun 2009 B1
7551406 Thomas et al. Jun 2009 B1
7552523 He et al. Jun 2009 B1
7554767 Hu et al. Jun 2009 B1
7583466 Kermiche et al. Sep 2009 B2
7595967 Moon et al. Sep 2009 B1
7599154 Sbiaa et al. Oct 2009 B2
7606007 Gill Oct 2009 B2
7606010 Parkin Oct 2009 B2
7639457 Chen et al. Dec 2009 B1
7652854 Kagami et al. Jan 2010 B2
7660080 Liu et al. Feb 2010 B1
7666467 Parkin Feb 2010 B2
7672080 Tang et al. Mar 2010 B1
7672086 Jiang Mar 2010 B1
7684160 Erickson et al. Mar 2010 B1
7688546 Bai et al. Mar 2010 B1
7691434 Zhang et al. Apr 2010 B1
7695761 Shen et al. Apr 2010 B1
7719795 Hu et al. May 2010 B2
7726009 Liu et al. Jun 2010 B1
7729086 Song et al. Jun 2010 B1
7729087 Stoev et al. Jun 2010 B1
7736823 Wang et al. Jun 2010 B1
7785666 Sun et al. Aug 2010 B1
7796356 Fowler et al. Sep 2010 B1
7800858 Bajikar et al. Sep 2010 B1
7807218 Parkin Oct 2010 B2
7819979 Chen et al. Oct 2010 B1
7829264 Wang et al. Nov 2010 B1
7846643 Sun et al. Dec 2010 B1
7855854 Hu et al. Dec 2010 B2
7859797 Hoshino et al. Dec 2010 B2
7869160 Pan et al. Jan 2011 B1
7872824 Macchioni et al. Jan 2011 B1
7872833 Hu et al. Jan 2011 B2
7906231 Parkin Mar 2011 B2
7910267 Zeng et al. Mar 2011 B1
7911735 Sin et al. Mar 2011 B1
7911737 Jiang et al. Mar 2011 B1
7916426 Hu et al. Mar 2011 B2
7918013 Dunn et al. Apr 2011 B1
7968219 Jiang et al. Jun 2011 B1
7982989 Shi et al. Jul 2011 B1
8008097 Parkin Aug 2011 B2
8008912 Shang Aug 2011 B1
8012804 Wang et al. Sep 2011 B1
8015692 Zhang et al. Sep 2011 B1
8018677 Chung et al. Sep 2011 B1
8018678 Zhang et al. Sep 2011 B1
8024748 Moravec et al. Sep 2011 B1
8049997 Miyauchi et al. Nov 2011 B2
8072705 Wang et al. Dec 2011 B1
8074345 Anguelouch et al. Dec 2011 B1
8077418 Hu et al. Dec 2011 B1
8077434 Shen et al. Dec 2011 B1
8077435 Liu et al. Dec 2011 B1
8077557 Hu et al. Dec 2011 B1
8079135 Shen et al. Dec 2011 B1
8081403 Chen et al. Dec 2011 B1
8089734 Miyauchi et al. Jan 2012 B2
8091210 Sasaki et al. Jan 2012 B1
8097846 Anguelouch et al. Jan 2012 B1
8104166 Zhang et al. Jan 2012 B1
8116043 Leng et al. Feb 2012 B2
8116171 Lee Feb 2012 B1
8125743 Ohta et al. Feb 2012 B2
8125856 Li et al. Feb 2012 B1
8134794 Wang Mar 2012 B1
8136224 Sun et al. Mar 2012 B1
8136225 Zhang et al. Mar 2012 B1
8136805 Lee Mar 2012 B1
8141235 Zhang Mar 2012 B1
8146236 Luo et al. Apr 2012 B1
8149536 Yang et al. Apr 2012 B1
8151441 Rudy et al. Apr 2012 B1
8163185 Sun et al. Apr 2012 B1
8164760 Willis Apr 2012 B2
8164855 Gibbons et al. Apr 2012 B1
8164864 Kaiser et al. Apr 2012 B2
8165709 Rudy Apr 2012 B1
8166631 Tran et al. May 2012 B1
8166632 Zhang et al. May 2012 B1
8169473 Yu et al. May 2012 B1
8171618 Wang et al. May 2012 B1
8179636 Bai et al. May 2012 B1
8191237 Luo et al. Jun 2012 B1
8194365 Leng et al. Jun 2012 B1
8194366 Li et al. Jun 2012 B1
8196285 Zhang et al. Jun 2012 B1
8200054 Li et al. Jun 2012 B1
8203800 Li et al. Jun 2012 B2
8208350 Hu et al. Jun 2012 B1
8220140 Wang et al. Jul 2012 B1
8222599 Chien Jul 2012 B1
8225488 Zhang et al. Jul 2012 B1
8227023 Liu et al. Jul 2012 B1
8228633 Tran et al. Jul 2012 B1
8231796 Li et al. Jul 2012 B1
8233248 Li et al. Jul 2012 B1
8248896 Yuan et al. Aug 2012 B1
8254060 Shi et al. Aug 2012 B1
8257597 Guan et al. Sep 2012 B1
8259410 Bai et al. Sep 2012 B1
8259539 Hu et al. Sep 2012 B1
8262918 Li et al. Sep 2012 B1
8262919 Luo et al. Sep 2012 B1
8264797 Emley Sep 2012 B2
8264798 Guan et al. Sep 2012 B1
8270126 Roy et al. Sep 2012 B1
8276258 Tran et al. Oct 2012 B1
8277669 Chen et al. Oct 2012 B1
8279719 Hu et al. Oct 2012 B1
8284517 Sun et al. Oct 2012 B1
8288204 Wang et al. Oct 2012 B1
8289821 Huber Oct 2012 B1
8291743 Shi et al. Oct 2012 B1
8307539 Rudy et al. Nov 2012 B1
8307540 Tran et al. Nov 2012 B1
8308921 Hiner et al. Nov 2012 B1
8310785 Zhang et al. Nov 2012 B1
8310901 Batra et al. Nov 2012 B1
8315019 Mao et al. Nov 2012 B1
8316527 Hong et al. Nov 2012 B2
8320076 Shen et al. Nov 2012 B1
8320077 Tang et al. Nov 2012 B1
8320219 Wolf et al. Nov 2012 B1
8320220 Yuan et al. Nov 2012 B1
8320722 Yuan et al. Nov 2012 B1
8322022 Yi et al. Dec 2012 B1
8322023 Zeng et al. Dec 2012 B1
8325569 Shi et al. Dec 2012 B1
8333008 Sin et al. Dec 2012 B1
8334093 Zhang et al. Dec 2012 B2
8336194 Yuan et al. Dec 2012 B2
8339738 Tran et al. Dec 2012 B1
8341826 Jiang et al. Jan 2013 B1
8343319 Li et al. Jan 2013 B1
8343364 Gao et al. Jan 2013 B1
8349195 Si et al. Jan 2013 B1
8351307 Wolf et al. Jan 2013 B1
8357244 Zhao et al. Jan 2013 B1
8373945 Luo et al. Feb 2013 B1
8375564 Luo et al. Feb 2013 B1
8375565 Hu et al. Feb 2013 B2
8381391 Park et al. Feb 2013 B2
8385157 Champion et al. Feb 2013 B1
8385158 Hu et al. Feb 2013 B1
8394280 Wan et al. Mar 2013 B1
8400731 Li et al. Mar 2013 B1
8404128 Zhang et al. Mar 2013 B1
8404129 Luo et al. Mar 2013 B1
8405930 Li et al. Mar 2013 B1
8409453 Jiang et al. Apr 2013 B1
8413317 Wan et al. Apr 2013 B1
8416540 Li et al. Apr 2013 B1
8419953 Su et al. Apr 2013 B1
8419954 Chen et al. Apr 2013 B1
8422176 Leng et al. Apr 2013 B1
8422342 Lee Apr 2013 B1
8422841 Shi et al. Apr 2013 B1
8424192 Yang et al. Apr 2013 B1
8441756 Sun et al. May 2013 B1
8443510 Shi et al. May 2013 B1
8444866 Guan et al. May 2013 B1
8449948 Medina et al. May 2013 B2
8451556 Wang et al. May 2013 B1
8451563 Zhang et al. May 2013 B1
8451567 Zhou et al. May 2013 B2
8454846 Zhou et al. Jun 2013 B1
8455119 Jiang et al. Jun 2013 B1
8456961 Wang et al. Jun 2013 B1
8456963 Hu et al. Jun 2013 B1
8456964 Yuan et al. Jun 2013 B1
8456966 Shi et al. Jun 2013 B1
8456967 Mallary Jun 2013 B1
8458892 Si et al. Jun 2013 B2
8462592 Wolf et al. Jun 2013 B1
8468682 Zhang Jun 2013 B1
8472147 Singleton et al. Jun 2013 B2
8472288 Wolf et al. Jun 2013 B1
8480911 Osugi et al. Jul 2013 B1
8486285 Zhou et al. Jul 2013 B2
8486286 Gao et al. Jul 2013 B1
8488272 Tran et al. Jul 2013 B1
8491801 Tanner et al. Jul 2013 B1
8491802 Gao et al. Jul 2013 B1
8493693 Zheng et al. Jul 2013 B1
8493695 Kaiser et al. Jul 2013 B1
8495813 Hu et al. Jul 2013 B1
8498084 Leng et al. Jul 2013 B1
8506828 Osugi et al. Aug 2013 B1
8514517 Batra et al. Aug 2013 B1
8518279 Wang et al. Aug 2013 B1
8518832 Yang et al. Aug 2013 B1
8520336 Liu et al. Aug 2013 B1
8520337 Liu et al. Aug 2013 B1
8524068 Medina et al. Sep 2013 B2
8526275 Yuan et al. Sep 2013 B1
8531801 Xiao et al. Sep 2013 B1
8532450 Wang et al. Sep 2013 B1
8533937 Wang et al. Sep 2013 B1
8537494 Pan et al. Sep 2013 B1
8537495 Luo et al. Sep 2013 B1
8537502 Park et al. Sep 2013 B1
8545999 Leng et al. Oct 2013 B1
8547659 Bai et al. Oct 2013 B1
8547667 Roy et al. Oct 2013 B1
8547730 Shen et al. Oct 2013 B1
8555486 Medina et al. Oct 2013 B1
8559141 Pakala et al. Oct 2013 B1
8563146 Zhang et al. Oct 2013 B1
8565049 Tanner et al. Oct 2013 B1
8576517 Tran et al. Nov 2013 B1
8578594 Jiang et al. Nov 2013 B2
8582238 Liu et al. Nov 2013 B1
8582241 Yu et al. Nov 2013 B1
8582253 Zheng et al. Nov 2013 B1
8588039 Shi et al. Nov 2013 B1
8593914 Wang et al. Nov 2013 B2
8597528 Roy et al. Dec 2013 B1
8599520 Liu et al. Dec 2013 B1
8599657 Lee Dec 2013 B1
8603593 Roy et al. Dec 2013 B1
8607438 Gao et al. Dec 2013 B1
8607439 Wang et al. Dec 2013 B1
8611035 Bajikar et al. Dec 2013 B1
8611054 Shang et al. Dec 2013 B1
8611055 Pakala et al. Dec 2013 B1
8614864 Hong et al. Dec 2013 B1
8619512 Yuan et al. Dec 2013 B1
8625233 Ji et al. Jan 2014 B1
8625941 Shi et al. Jan 2014 B1
8628672 Si et al. Jan 2014 B1
8630068 Mauri et al. Jan 2014 B1
8634280 Wang et al. Jan 2014 B1
8638529 Leng et al. Jan 2014 B1
8643980 Fowler et al. Feb 2014 B1
8649123 Zhang et al. Feb 2014 B1
8665561 Knutson et al. Mar 2014 B1
8670211 Sun et al. Mar 2014 B1
8670213 Zeng et al. Mar 2014 B1
8670214 Knutson et al. Mar 2014 B1
8670294 Shi et al. Mar 2014 B1
8670295 Hu et al. Mar 2014 B1
8675318 Ho et al. Mar 2014 B1
8675455 Krichevsky et al. Mar 2014 B1
8681594 Shi et al. Mar 2014 B1
8689430 Chen et al. Apr 2014 B1
8693141 Elliott et al. Apr 2014 B1
8703397 Zeng et al. Apr 2014 B1
8705205 Li et al. Apr 2014 B1
8711518 Zeng et al. Apr 2014 B1
8711528 Xiao et al. Apr 2014 B1
8717709 Shi et al. May 2014 B1
8720044 Tran et al. May 2014 B1
8721902 Wang et al. May 2014 B1
8724259 Liu et al. May 2014 B1
8749790 Tanner et al. Jun 2014 B1
8749920 Knutson et al. Jun 2014 B1
8753903 Tanner et al. Jun 2014 B1
8760807 Zhang et al. Jun 2014 B1
8760818 Diao et al. Jun 2014 B1
8760819 Liu et al. Jun 2014 B1
8760822 Li et al. Jun 2014 B1
8760823 Chen et al. Jun 2014 B1
8763235 Wang et al. Jul 2014 B1
8780498 Jiang et al. Jul 2014 B1
8780505 Xiao Jul 2014 B1
8786983 Liu et al. Jul 2014 B1
8790524 Luo et al. Jul 2014 B1
8790527 Luo et al. Jul 2014 B1
8792208 Liu et al. Jul 2014 B1
8792312 Wang et al. Jul 2014 B1
8793866 Zhang et al. Aug 2014 B1
8797680 Luo et al. Aug 2014 B1
8797684 Tran et al. Aug 2014 B1
8797686 Bai et al. Aug 2014 B1
8797692 Guo et al. Aug 2014 B1
8813324 Emley et al. Aug 2014 B2
20040196681 Xiao et al. Oct 2004 A1
20050011066 Gill Jan 2005 A1
20050264948 Nakamoto et al. Dec 2005 A1
20060003185 Parkin Jan 2006 A1
20060109592 Watanabe et al. May 2006 A1
20060226940 Lee et al. Oct 2006 A1
20070053114 Uesugi et al. Mar 2007 A1
20070111332 Zhao et al. May 2007 A1
20070195467 Gill Aug 2007 A1
20080013221 Ohta et al. Jan 2008 A1
20080179699 Horng et al. Jul 2008 A1
20090027810 Horng et al. Jan 2009 A1
20090128944 Jang et al. May 2009 A1
20090229111 Zhao et al. Sep 2009 A1
20090279213 Wu et al. Nov 2009 A1
20100079917 Miyauchi et al. Apr 2010 A1
20100149689 Tsuchiya et al. Jun 2010 A1
20100214692 Kief et al. Aug 2010 A1
20100232074 Machita Sep 2010 A1
20100290157 Zhang et al. Nov 2010 A1
20100320076 Zhao et al. Dec 2010 A1
20110086240 Xiang et al. Apr 2011 A1
20110102949 Yuan et al. May 2011 A1
20120063218 Huai et al. Mar 2012 A1
20120087045 Yanagisawa et al. Apr 2012 A1
20120087046 Yanagisawa et al. Apr 2012 A1
20120111826 Chen et al. May 2012 A1
20120147504 Zhou et al. Jun 2012 A1
20120216378 Emley et al. Aug 2012 A1
20120237878 Zeng et al. Sep 2012 A1
20120250189 Degawa et al. Oct 2012 A1
20120298621 Gao Nov 2012 A1
20130216702 Kaiser et al. Aug 2013 A1
20130216863 Li et al. Aug 2013 A1
20130257421 Shang et al. Oct 2013 A1
20140154529 Yang et al. Jun 2014 A1
20140175050 Zhang et al. Jun 2014 A1
Foreign Referenced Citations (1)
Number Date Country
2002298314 Nov 2002 JP
Non-Patent Literature Citations (2)
Entry
Rongfu Xiao, et al., U.S. Appl. No. 13/607,624, filed Sep. 7, 2012, 28 pages.
Yuankai Zheng, et al., U.S. Appl. No. 13/691,729, filed Nov. 30, 2012, 15 pages.
Provisional Applications (1)
Number Date Country
61818389 May 2013 US