Claims
- 1. In a repair procedure for repairing damage in thermoplastic film employing heat to cure an in situ patching compound covered by graining paper, the improvement comprising adding a substantially fixed quantum of heat energy to a heat transfer tool by placing said tool against a source of heat at a temperature above that temperature necessary to cure said patching compound, said heat transfer tool having a volume and geometric shape such that it can transfer a quantum of heat sufficient to cure such patching compound but insufficient to damage said thermoplastic film, heating said tool to substantially the temperature of said source and transferring said substantially fixed quantum of heat energy from said heat transfer tool to such patching compound by applying said tool to said graining paper.
- 2. A repair procedure for repairing damage in thermoplastic film comprising the steps of trimming the edges of the damage, placing a backing material behind suchddamage, filling the damage with a heat-curable, film forming patching compound, placing a graining paper over such patching compound, adding a substantially fixed quantum of heat energy to a heat transfer tool by placing said tool against a source of heat at a temperature above that temperature necessary to cure such patching compound, said heat transfer tool having a volume and geometric shape such that it can transfer a quantum of heat sufficient to cure such patching compound but insufficient to damage said thermoplastic film, heating said tool to substantially the temperature of said source, transferring said substantially fixed quantum of heat energy from said heat transfer tool by placing said tool against the graining paper over such damage for a time to effect curing of such compound and removing said tool and such graining paper.
- 3. The repair procedure of claim 2, wherein said heat transfer tool includes a substantially planar surface for contact with said graining paper.
- 4. The repair procedure of claim 1 or 2, wherein the temperature of said heat source is at least 350.degree. F.
Parent Case Info
This is a continuation of application Ser. No. 684,889 filed Jan. 14, 1976, now abandoned.
US Referenced Citations (5)
Continuations (1)
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Number |
Date |
Country |
Parent |
684889 |
Jan 1976 |
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