Claims
- 1. A method for replacing a coolant containing PCB in an electrical induction apparatus having a tank containing said coolant, an electrical winding and porous solid cellulosic electrical insulation immersed in said PCB-containing coolant with a substantially PCB-free high boiling dielectric permanent coolant to convert said electrical apparatus into one in which the rate of elution of PCB into said coolant is below the maximum allowable rate of elution into the coolant of an electrical apparatus rated as non-PCB, said solid porous electrical insulation being impregnated with said PCB-containing coolant, said method comprising the steps of:
- (a) draining said PCB-containing coolant from said tank to remove a major portion of said PCB-containing coolant contained by it;
- (b) filling said tank with an interim dielectric cooling liquid that is miscible with said PCB, is sufficiently low in viscosity to circulate within said tank and penetrate the interstices of said porous solid electrical insulation, and is capable of being readily separated from said PCB;
- (c) electrically operating said electrical induction apparatus and continuing said electrical operation for a period sufficient to elute PCB contained in said PCB-containing coolant impregnated in said porous solid insulation therefrom into said interim dielectric cooling liquid;
- (d) thereafter draining said interim dielectric cooling liquid containing said eluted PCB from said tank;
- (e) repeating the cycle of steps (b), (c) and (d), when the rate of elution of PCB into said interim dielectric cooling liquid exceeds 0.55 ppm of PCB per day based on the weight of said permanent dielectric coolant; and
- (f) filling said tank with a substantially PCB-free permanent coolant so as to reclassify said electrical apparatus to non-PCB status.
- 2. Method as claimed in claim 1 wherein said PCB-free permanent coolant is selected from the group consisting of tetrachloroethylene, trichlorobenzene, tetrachlorobenzene, and other halogenated hydrocarbons.
- 3. Method as claimed in claim 1 wherein, when carrying out step (d) of the previous cycle and step (b) of the next succeeding cycle, said interim cooling liquid is drained from the top of said tank while fresh chilled interim dielectric cooling liquid is fed into the bottom of said tank and while electrical operation of the apparatus is continued.
- 4. Method as claimed in claim 1 wherein said steps (d) and (f) are carried out by feeding said PCB-free permanent coolant into the bottom of the tank while removing the interim dielectric cooling liquid in the tank from the top of said tank, and while electrical operation of the apparatus is continued.
- 5. Method as claimed in claim 1 wherein said tank is provided with heat insulation in order to raise the temperature of the interim dielectric cooling liquid contained by it during each step (c) while electrically operating said electrical induction apparatus.
- 6. Method as claimed in claim 1 wherein said interim dielectric cooling liquid in said tank is heated during step (c) while electrically operating said electric induction apparatus.
- 7. Method as claimed in claim 1 wherein during step (c) said interim dielectric cooling liquid is removed from said tank, heated and returned to said tank while maintaining sufficient interim dielectric fluid in said tank and electrically operating said electrical induction apparatus.
- 8. Method as claimed in claim 1 wherein said interim dielectric liquid is more volatile than said PCB and is separated from said contained PCB by distilling off said interim dielectric cooling liquid.
- 9. Method as claimed in claim 1 wherein said interim dielectric cooling liquid containing PCB eluted from said solid insulation is drawn off from said tank as a slip stream while electrically operating said electrical induction apparatus adding fresh interim dielectric cooling liquid substantially equivalent to the amount of PCB-containing interim dielectric fluid drawn off in said slip stream.
- 10. Method as claimed in claim 1 wherein said tank is flushed with a solvent for said PCB following step (a) and before step (b).
- 11. Method as claimed in claim 10 wherein said flushing solvent is the same liquid as said interim dielectric cooling liquid used in step (b).
- 12. Method as claimed in claim 10 wherein said flushing solvent and said interim dielectric cooling liquid is trichlorobenzene.
Parent Case Info
This application is a continuation application of application Ser. No. 739,775, U.S. Pat. No. 4,744,905 filed June 3, 1985, which is a continuation-in-part application of application Ser. No. 675,278, filed Nov. 27, 1984, now abandoned, which is a continuation-in-part application of Ser. No. 566,306, filed Dec. 28, 1983, now abandoned.
US Referenced Citations (2)
Continuations (1)
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Number |
Date |
Country |
Parent |
739775 |
Jun 1985 |
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
675278 |
Nov 1984 |
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Parent |
566306 |
Dec 1983 |
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