Park, et al., “Fully Integrated Passives Modules for Filter Applications Using Low Temperature Processes”, pp. 592-597. |
Liakopoulos, et al., “Ultrahigh Resolution DC Magnetic Field Measurements Using Microfabricated Fluxgate Sensor Chips”, pp. 630-631. |
Taylor, et al., “Fully Integrated Magnetically Actuated Micromachined Relays”, Jun. 1998, vol. 7, pp. 181-191. |
Epstein, et al., “Power MEMS and Microengines”, Jun. 1997, pp. 753-756. |
Romankiw, et al., “Evolution of the Plating Through Lithographic Mask Technology”, pp. 253-263. |
Cros, et al., “A Single-Mask Process for Micromachined Magnetic Devices”, Jun. 4-8, 2000, pp. 138-141. |
Conedera, et al., “Potentialities of a New Positive Photoresist for the Realization of Thick Moulds”, pp. 173-175. |
Lorenz, et al., “High-Aspect-Ratio, Ultrathick, Negative-Tone Near-UV Photoresist and its Applications for MEMS”, pp. 33-39. |
Chang, et al., “UV-LIGA Process for High Aspect Ratio Structures using Stress Barrier and C-shaped Etch Holes”, pp. 1428-1431. |
Lorenz, et al. “SU-8: A Low-Cost Negative Resist for MEMS”, pp. 121-124. |
Despont, et al., “High-Aspect-Ratio, Ultrathick, Negative-Tone Near-UV Photoresist for MEMS Applications”, pp. 518-522. |
Cros, et al., “A Single-Mask Process for Micromachined Magnetic Devices”. |