Claims
- 1. A method of making an absorbent article that has a pattern of embossments thereon and a perimeter seal at least partially around the perimeter thereof, said method comprising the steps of:
- providing the components for said absorbent article, wherein said components have been arranged in preparation for embossing said pattern of embossments into at least some of said components and for forming said perimeter seal at least partially around the perimeter of at least some of said components;
- providing a heated sealing member and an anvil surface wherein said sealing member is heated to a first temperature, said sealing member has an embossing surface formed therein, said embossing surface comprises a recessed portion of said sealing member with at least one raised portion extending therefrom to form said pattern of embossments, said embossing surface is heated to a second temperature, and said second temperature is less than said first temperature; and
- simultaneously embossing and forming said perimeter seal in said components to make said absorbent article by placing said components for said absorbent article between said heated sealing member and said anvil surface, and applying pressure to said components while said components are between said heated sealing member and said anvil surface so that said heated sealing member forms said perimeter seal at least partially around the perimeter of at least some of said components, and said embossing surface forms said pattern of embossments into at least some of said components.
Parent Case Info
This application is a continuation-in-part U.S. patent application Ser. No. 08/383,550, which was filed on Feb. 3, 1995, which is a continuation of U.S. patent application Ser. No. 08/122,114, which was filed on Sep. 16, 1993, now abandoned and a continuation-in-part of U.S. patent applicaton Ser. No. 08/514,165, which was filed on Aug. 11, 1995 (now U.S. Pat. No. 5,569,231), which is a continuation-in-part of U.S. patent application Ser. No. 08/339,511, which was filed on Nov. 14, 1994 (now U.S. Pat. No. 5,460,623), which was a continuation of U.S. patent application Ser. No. 08/204,821, which was filled on Mar. 1, 1994, now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0 072948 A1 |
Mar 1983 |
EPX |
0 235 854 A1 |
Sep 1987 |
EPX |
2 288 412 |
Oct 1995 |
GBX |
WO 9517148 |
Jun 1995 |
WOX |
Continuations (3)
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Number |
Date |
Country |
Parent |
122114 |
Sep 1993 |
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Parent |
339511 |
Nov 1994 |
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Parent |
204821 |
Mar 1994 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
383550 |
Feb 1995 |
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