Claims
- 1. A method for spray-cooling an electronic device, comprising the steps of:
- providing a substrate having a semiconductor die thereon, the semiconductor die having a major surface;
- disposing an input region, an active region and a conductive region on the major surface, the conductive region electrically coupling, the input region and the active region;
- providing an inductive metal region in communication with the input region, the inductive metal region sized to allow real-time iterative tuning of the electronic device; and
- receiving a fluid by a nozzle, the nozzle atomizing the fluid and discharging the fluid onto the major surface.
- 2. The method according to claim 1, further comprising:
- providing the fluid to the nozzle via a fluid inlet port; and
- removing the fluid from the major surface via a fluid outlet port.
- 3. The method according to claim 2, further comprising:
- receiving the fluid from the fluid outlet port by a condenser; and
- supplying the fluid by the condenser to a fluid pump, the fluid pump in communication with the fluid inlet port,
Parent Case Info
This is a divisional of application Ser. No. 08/729,130, filed on Oct. 11, 1996 now U.S. Pat. No. 5,777,384.
US Referenced Citations (3)
Non-Patent Literature Citations (1)
Entry |
Joseph Fjelstad, "Flexible Circuits for Packaging Semiconductor Chips?", Circuitree, Jan. 1996, pp. 68-70. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
729130 |
Oct 1996 |
|