Claims
- 1. A method for the manufacture of moisture resistant products from wood chips by compression and adhesive bonding comprising the steps of
- (a) transforming lignin into water-soluble form by dissolving lignin and water-soluble derivatives thereof in an aqueous solution of pH 12.5 or less;
- (b) impregnating the wood chips and the cells of the wood chips with said aqueous lignin solution
- (c) treating the chips impregnated with said water-soluble lignin so it will not leach from said wood chips, by insolubilizing the lignin within the wood chips by impregnating the chips with a weakly acid aqueous solution of a metal salt in a further impregnating step;
- (d) drying said chips containing insolubilized lignin;
- (e) coating the outer surfaces of the wood chips impregnated with the insolubilized lignin with glue;
- (f) and then compressing the coated chips to form said product.
- 2. The method according to claim 1, wherein insolubilizing of lignin within the chips is performed with at least one salt of a lignin-insolubilizing ion selected from the group consisting of aluminum, zinc and copper salts and mixtures of such salts.
- 3. The method according to claim 2, wherein said salt is an insolubilizing amount of an aluminum salt.
- 4. The method according to claim 3, wherein a portion of said salt further contains up to 1% by dry weight of said wood chips of a lignin-insolubilizing and rot-preventing copper salt.
- 5. The method according to claim 2, wherein said salt is an insolubilizing amount of a copper salt.
- 6. The method according to claim 1, wherein the water-soluble lignin for the initial impregnation is a carboxylated lignin.
- 7. The method according to claim 1, wherein said water-soluble lignin for impregnation is a carboxyalkylated lignin.
- 8. The method according to claim 1, wherein said water-soluble lignin is a sulfonated lignin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8501688 |
Apr 1985 |
SEX |
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Parent Case Info
This application is a continuation of application Ser. No. 848,207, filed Apr. 4, 1986, now abandoned.
US Referenced Citations (7)
Continuations (1)
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Number |
Date |
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Parent |
848207 |
Apr 1986 |
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