Claims
- 1. A treating method of a resin composition comprising:kneading a resin composition comprising a thermoplastic resin, 0 to 0.7 part by weight, based on 1 part by weight of the thermoplastic resin, of a treating agent having a capacity of hydrogenating a halogen and a halide, at 280 to 450° C., in the presence of a metal compound selected from the group consisting of Sb or Zn, which combines with a halogen atom to generate a metal halide compound having a boiling point or sublimation point not greater than 450° C. at atmospheric pressure, to thereby convert the halide into a metal halide; and separating and collecting, from the resin composition, each of a mixture of the thermoplastic resin and the treating agent having a capacity of hydrogenating a halogen, and the metal halide.
- 2. The method according to claim 1, wherein the treating agent having a capacity of hydrogenating a halogen is an organic compound or polymer having a carbon/hydrogen element number ratio of 0.25 to 1.0.
- 3. The method according to claim 2, wherein the treating agent having a capacity of hydrogenating a halogen is a polyolefin.
- 4. The method according to claim 1, wherein reaction and deaeration are conducted by using an apparatus having a rotary stirring function under the conditions of an effective processing surface area of 5 m2 to 1000 m2 and pressure reducing degree of 13.3 kPa or less.
- 5. The method according to claim 4, wherein a specific energy applied to the resin composition until the temperature of the resin composition reaches 300° C. is 10 MJ/m3 to 300 MJ/m3.
- 6. The method according to claim 1, further comprising a step of treating the thus-separated and collected metal halide with an aqueous alkali solution, to thereby convert the metal of the metal halide into a metal oxide.
- 7. A mixture obtained by separating and collecting according to a method of any one of claims 1 to 6, comprising the thermoplastic resin and the treating agent having a capacity of hydrogenating a halogen.
Priority Claims (3)
Number |
Date |
Country |
Kind |
10-313592 |
Nov 1998 |
JP |
|
11-142807 |
May 1999 |
JP |
|
2000-28737 |
Feb 2000 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. § 371 of PCT International Application No. PCT/JP00/02795 which has an International filing date of Apr. 27, 2000, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP00/02795 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO01/83601 |
11/8/2001 |
WO |
A |
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