Claims
- 1. A method of banding articles with wire comprising the steps of passing a wire having a leading end about the articles, clamping the leading end in a first clamping member, severing the length to be banded and clamping the severed end in a second clamping member, moving the second member to bring said ends into position for welding, welding the ends together, allowing the weld to cool, moving one of said clamping members to exert a tensional force on the wire between the points of clamping across the weld, and thereafter releasing the clamps.
- 2. A method of banding articles with wire comprising the steps of passing a wire having a leading end about the articles, clamping the leading end with a first clamping means including a welding electrode, severing the length to be banded, clamping the severed end in a second clamping means, and moving the second clamping means to bring the severed end into welding relation with the leading end, contacting the wire at a point removed from the welding electrode and leading end with a grounding contact and passing a welding current from said electrode across said ends, allowing the weld to cool, moving the second clamping means to tension said wire across the weld and thereafter releasing the clamps.
Parent Case Info
This is a division of application Ser. No. 860,873 filed Dec. 15, 1977 now U.S. Pat. No. 4,208,565 issued Jan. 17, 1980.
US Referenced Citations (4)
Non-Patent Literature Citations (1)
Entry |
Penick "Device for Testing the Adherence of Circuit Elements to a Substrate" Western Electric Tech. Digest No. 37. 1/75. p. 21. |
Divisions (1)
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Number |
Date |
Country |
Parent |
860873 |
Dec 1977 |
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