Claims
- 1. A method of producing an intermolecular bonded interface between two pieces of acrylic material comprising the steps of:
- a. preshrinking the acrylic pieces to obtain dimensional stability,
- b. forming an interface surface on each piece, the interface surfaces conforming in shape to each other,
- c. assembling the pieces with the interface surfaces in contact with each other,
- d. confining the pieces to restrict expansion in all directions except normal to the interface,
- e. applying a limited resistance to expansion normal to the interface, and
- f. applying heat to the assembled pieces to induce their expansion against their confinement to cause transmigration of molecules from one interface to another to bond the pieces together while controlled expansion takes place normal to the interface.
- 2. A method of producing a fluidic module from two pieces of acrylic material having an intermolecular bonded interface comprising the steps of:
- a. preshrinking the acrylic pieces to obtain dimensional stability,
- b. forming a first interface surface on a first piece and a second interface surface on a second piece, the interface surfaces conforming in shape to each other,
- c. forming at least one fluidic passageway in the first interface surface,
- d. assembling the pieces with the interface surfaces in contact with each other,
- e. confining the pieces to restrict expansion in all directions except normal to the interface,
- f. applying a limited resistance to expansion normal to the interface, and
- g. applying heat to the assembled pieces to induce their expansion against their confinement to cause transmigration of molecules from one interface surface to another to bond the pieces together while controlled expansion takes place normal to the interface.
- 3. A method of producing a fluidic module from two piece of acrylic material having an intermolecular bonded interface comprising the steps of:
- a. preshrinking the acrylic pieces to obtain dimensional stability,
- b. forming a first interface surface on the first piece and a second interface surface on a second piece, the interface surfaces conforming in shape to each other,
- c. forming at least one fluidic passageway in the first interface surface,
- d. removing burrs from the interface surface having the fluidic passageway,
- e. polishing both interface surfaces,
- f. assembling the pieces with the polished interface surfaces in contact with each other,
- g. confining the pieces to restrict expansion in all directions except normal to the interface,
- h. applying a limited resistance to expansion normal to the interface, and
- i. applying heat to the assembled pieces to induce their expansion against their confinement to cause transmigration of molecules from one interface surface to another to bond the pieces together while controlled expansion takes place normal to the interface.
- 4. A method according to claim 1 wherein the preshrinking is effected by heating the pieces to a temperature of approximately 185.degree. F. over a period of about 6 hours, maintaining the temperature at approximately 185.degree. F. for about 8 hours and allowing the pieces to cool for about 6 hours.
- 5. A method according to claim 2 wherein the preshrinking is effected by heating the pieces to a temperature of approximately 185.degree. F. over a period of about 6 hours, maintaining the temperature at approximately 185.degree. F. for about 8 hours and allowing the pieces to cool for about 6 hours.
- 6. A method according to claim 3 wherein the preshrinking is effected by heating the pieces to a temperature of approximately 185.degree. F. over a period of about 6 hours, maintaining the temperature at approximately 185.degree. F. for about 8 hours and allowing the pieces to cool for about 6 hours.
- 7. A method according to claim 1 including the step of relieving stress wherein the bonded pieces are annealed at a temperature of from about 170.degree. F. to about 200.degree. F. for a period of about 8 hours.
- 8. A method according to claim 2 including the step of relieving stress wherein the bonded pieces are annealed at a temperature of from about 170.degree. F. to about 200.degree. F. for a period of about 8 hours.
- 9. A method according to claim 3 including the step of relieving stress wherein the bonded pieces are annealed at a temperature of from about 170.degree. F. to about 200.degree. F. for a period of about 8 hours.
- 10. A method according to claim 2 wherein the heat applied to induce expansion is at a temperature from about 275.degree. F. to about 310.degree. F.
- 11. A method according to claim 2 wherein the heat applied to induce expansion is at a temperature from about 275.degree. F. to about 310.degree. F.
- 12. A method according to claim 3 wherein the heat applied to induce expansion is at a temperature from about 275.degree. F. to about 310.degree. F.
- 13. A method according to claim 2 wherein at least one fluidic passageway is formed in the second interface surface as a mirror image of the fluidic passageway formed in the first interface surface.
- 14. A method according to claim 3 wherein at least one fluidic passageway is formed in the second interface surface as a mirror image of the fluidic passageway formed in the first interface surface.
RELATED CASES
This is a continuation-in-part of co-pending patent application Ser. No. 07/105,607, filed in the U.S. Patent and Trademark Office on Oct. 6, 1987 now U.S. Pat. No. 4,875,956.
US Referenced Citations (23)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1918081 |
Nov 1969 |
DEX |
726690 |
Mar 1955 |
GBX |
Non-Patent Literature Citations (1)
Entry |
L. S. Luskin, "Acrylic", Modern Plastics Encyclopedia, 1983-1984, pp. 14-18. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
105607 |
Oct 1987 |
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