Claims
- 1. A slurry for use in use in forming a surface which is engaged by a reactive metal during casting of the metal, said slurry comprising water, a binder, a source of hydroxyl ions, and yttria, said source of hydroxyl ions being sufficient to result in said slurry having a pH of at least 10.2 six days after initially forming the slurry.
- 2. A slurry as set forth in claim 1 wherein the source of hydroxyl ions is a metal alkali.
- 3. A slurry as set forth in claim 2 wherein the metal alkali is sodium hydroxide.
- 4. A slurry as set forth in claim 1 wherein the source of hydroxyl ions is an organic hydroxide.
- 5. A slurry as set forth in claim 26 wherein the organic hydroxide contains quaternary ammonium ions.
- 6. A slurry as set forth in claim 1 wherein the dry weight ratio of binder to the source of hydroxyl ions is equivalent to a silicon oxide (SiO.sub.2) to sodium oxide (Na.sub.2 O) dry weight ratio of less than thirty-to-one (30:1).
- 7. A mold having inner side surfaces made from the slurry of claim 1.
- 8. A slurry for use in forming a surface which is engaged by a reactive metal during casting of the metal, said slurry comprising water, a binder, yttria, and an amount of an alkali effective to prevent gelation of said slurry more than six days after initially mixing the slurry.
- 9. A slurry as set forth in claim 8 wherein the alkali is a metal hydroxide.
- 10. A slurry as set forth in claim 8 wherein the alkali is an organic hydroxide.
- 11. A slurry as set forth in claim 8 wherein the slurry has a pH of at least 10.2 six days after initially forming the slurry.
- 12. A slurry as set forth in claim 8 wherein the molar ratio of binder to alkali is equivalent to a molar ratio of silica to a hydroxyl ion source of less than 15.5-to-1.
- 13. A slurry as set forth in claim 8 wherein the dry weight ratio of binder to alkali is equivalent to a silicon oxide (SiO.sub.2) to sodium oxide (Na.sub.2 O) dry weight ratio of less than thirty-to-one (30:1).
- 14. A slurry for use in forming a surface which is engaged by a reactive metal during casting of the metal, said slurry comprising water, a binder, yttria and a hydration suppressant for the yttria to enable solid materials in the slurry to be readily dispersed into a suspension more than six days after initially forming the slurry.
- 15. A slurry as set forth in claim 14 wherein said slurry has a pH of at least 10.2 six days after initially forming the slurry.
- 16. A slurry as set forth in claim 15 wherein said hydration suppressant is a source of hydroxyl ions.
- 17. A slurry as set forth in claim 14 wherein said hydration suppressant is a metal alkali.
- 18. A slurry as set forth in claim 14 wherein said hydration suppressant is sodium hydroxide.
- 19. A slurry as set forth in claim 14 wherein said hydration suppressant is an organic hydroxide.
- 20. A slurry as set forth in claim 14 wherein said hydration suppressant contains quaternary ammonium ions.
- 21. A slurry as set forth in claim 14 wherein said hydration suppressant is effective to prevent gelation of said slurry more than six days after initially mixing said slurry.
- 22. A slurry as set forth in claim 14 wherein said hydration suppressant is an alkali and the dry weight ratio of binder to alkali is equivalent to a silicon oxide (SiO.sub.2) to sodium oxide (Na.sub.2 O) dry weight ratio of less than thirty-to-one (30:1).
- 23. A slurry for use in forming a surface which is engaged by a reactive metal, said slurry being formed of a mixture of water, silicon oxide (SiO.sub.2), alkali and yttria, said silicon oxide and alkali being in a dry weight ratio equivalent to a silicon oxide to sodium oxide (Na.sub.2 O) dry weight ratio of less than thirty-to-one (30:1).
- 24. A slurry as set forth in claim 23 wherein said alkali includes a metal alkali.
- 25. A slurry as set forth in claim 23 wherein said alkali includes an organic hydroxide.
- 26. A slurry as set forth in claim 23 wherein said slurry has a pH of at least 10.2 six days after initially mixing the slurry.
- 27. A slurry for use in forming a surface which is engaged by a reactive metal, said slurry being formed of a mixture of water, silicon oxide (SiO.sub.2), a source of hydroxyl ions, and yttria, said silicon oxide and source of hydroxyl ions being in a molar ratio of less than 15.5-to-1.
- 28. A slurry as set forth in claim 27 wherein said source of hydroxyl ions includes an inorganic alkali.
- 29. A slurry as set forth in claim 27 wherein said source of hydroxyl ions includes an organic hydroxide.
- 30. A slurry as set forth in claim 27 wherein said slurry has a pH of at least 10.2 six days after initially mixing the slurry.
Parent Case Info
This is a divisional of copending application Ser. No. 07/433,526 filed on Nov. 8, 1989, now U.S. Pat. No. 4,947,827.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0204674 |
Jun 1986 |
EPX |
Non-Patent Literature Citations (1)
Entry |
Publication by E. D. Calvert and entitled "An Investment Mold for Titanium Castings", Bureau of Mines, Report of Investigation 8541. |
Divisions (1)
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Number |
Date |
Country |
Parent |
433526 |
Nov 1989 |
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