In semiconductor device manufacturing operations, it is important to keep semiconductor device manufacturing tools clean and to limit contamination inside the tool. Contaminants inside the tool may fall on the semiconductor device being produced. Such fall-on particles can block or interfere with subsequent photolithographic, etching, and deposition operations leading to pattern defects. For example, a quartz tube furnace used in a deposition operation, such as atomic layer deposition (ALD) of a silicon nitride layer, may form a coating of silicon nitride and other reaction byproducts on a surface of the quartz. Particles of the silicon nitride and other reaction byproducts may fall off the quartz furnace side wall during furnace operation or during workpiece transfer and contaminate the device workpiece being processed. Defects formed by the contaminant particles directly affect wafer acceptance testing (WAT) results and reduce device yield and performance.
The present disclosure is best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
It is to be understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. Specific embodiments or examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, dimensions of elements are not limited to the disclosed range or values, but may depend upon process conditions and/or desired properties of the device. Moreover, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the first and second features, such that the first and second features may not be in direct contact. Various features may be arbitrarily drawn in different scales for simplicity and clarity.
Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In addition, the term “made of” may mean either “comprising” or “consisting of.”
Quartz tube furnaces are used in a number of deposition operations during semiconductor device manufacturing. The material being deposited and byproducts of the deposition operation may also coat the walls of the quartz tube furnace. Particles of the quartz tube wall coatings may fall off the quartz tube wall during semiconductor device processing and the particles may contaminate the semiconductor device workpiece. Therefore, it is desirable to prevent particulate contaminants from falling off the quartz tube walls during semiconductor device manufacturing. Embodiments of the present disclosure are directed to a cleaning apparatus for cleaning tube furnace components and economical methods of cleaning tube furnace components rather than replacing dirty tube furnace components with new components.
In some embodiments, a cleaning fluid reservoir or tank 130 stores cleaning fluid to be used to clean the tube furnace. A rinse fluid reservoir or tank 140 stores rinse fluid, such as deionized water in some embodiments. The cleaning fluid reservoir or tank 130 and the rinse fluid reservoir or tank 140 are connected to an external fluid line 150 by a cleaning fluid line 135 and a rinse fluid line 145, respectively. In some embodiments, a heater 245 heats the cleaning fluid to an elevated temperature to improve cleaning efficiency. In some embodiments, the heater 245 heats the cleaning fluid to a temperature ranging from about 35° C. to about 100° C. In some embodiments, the cleaning fluid is recovered in a cleaning fluid recovery reservoir or tank 125 after cleaning the tube furnace component. The used cleaning fluid may be filtered, treated, recycled, and reused. The used cleaning fluid passes through drains or outlets 110 in the base 235 of the enclosure, and is routed to the cleaning fluid reservoir or tank 125 through a cleaning fluid drain line 120 in some embodiments.
The cleaning operation is monitored and controlled by a controller 500 in some embodiments. In some embodiments, the controller 500 monitors or controls any or all of the flow of cleaning fluid or rinse fluid. The flow of the cleaning fluid or rinse fluid may be controlled by the controller 500 actuating valves (not shown) in the fluid flow lines. In some embodiments, the controller 500 monitors the temperature of the cleaning fluid and controls the heater 245. In some embodiments, the controller 500 controls the flow of the fluid draining through the outlet or drains 110, and monitors the level of recovered fluid in the recovery reservoir or tank 125.
In some embodiments, all components of the cleaning apparatus that contact the cleaning fluid are made of materials that are chemically resistant to the cleaning fluid. In some embodiments, the cleaning fluid is an aqueous solution. In some embodiments, the cleaning fluid is an aqueous HF solution. In some embodiments the fluid lines 60, 110, 120, 135, are made of a fluoropolymer, such as a perfluoroalkoxy alkane, or a polyolefin, such as polyethylene or polypropylene. In some embodiments, the fluid lines 60, 110, 120, is a perfluoroalkoxy alkane (PFA) bellows tube.
In some embodiments, the enclosure 50, the enclosure base 235, support 55, inlet 45, outlet/drains 110, and reservoirs/tanks 125, 130, 140 are made of polymeric or metallic materials chemically resistant or inert to the cleaning fluids. In some embodiments, these components are made of polyethylene (PE), polypropylene (PP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyphenylene oxide (PPO), polyethylene terephthalate (PET), polyvinyl chloride (PVC), hastelloy, or stainless steel.
In some embodiments, the cleaning operation of quartz tube furnace components includes a pre-rinse of the tube furnace components for about 5 to about 10 minutes. In some embodiments the tube furnace components are pre-rinsed with deionized water. After the pre-rinse alternating cycles of applying cleaning fluid and rinsing are performed. In some embodiments, the cleaning fluid is a 5% HF aqueous solution. In some embodiments, the 5% HF aqueous solution is applied for about 5 to about 10 minutes, the HF solution is drained, and then deionized water rinse is performed, and the deionized water is subsequently drained, and the cycle is repeated. In some embodiments, the cleaning, draining, rinsing, draining cycle is repeated 5 or more times, though the cycle can be repeated fewer than 5 times. After the final rinse cycle, the cleaned quartz tube furnace component is continuously flushed with deionized water for 24 hours or more and then dried in some embodiments.
As shown in
After attaching the bottom projection adapter 105 to the end cap projection 35, a clamp 165 is attached to the bottom projection adapter 105 and end cap projection 35. In some embodiments, the clamp is a pivoting screw clamp 165. When the pivoting screw clamp 165 is tightened, the bottom projection adapter 105 is urged against the end cap projection 35, thereby providing a cleaning fluid flow path from the internal cleaning fluid line 60 to the end cap 30.
In some embodiments, the end cap support 55b is made of a polymer composition, including ultra high molecular weight polyethylene (UHMWPE), polyetherimide (PEI), polyvinyl chloride (PVC), polypropylene (PP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), polyphenylene oxide (PPO), polyethylene terephthalate (PET), hastelloy, any other suitable polymer composition, or stainless steel.
In some embodiments, the annular base 230 and the vertically extending member 220 have a thickness of about 0.5 cm to about 2 cm, in other embodiments, the thickness ranges from about 0.8 cm to about 1.2 cm.
In some embodiments, the annular base 230 has an inner diameter ID ranging from about 15 cm to about 30 cm, and an inner diameter ID ranging from about 19 cm to about 21 cm in other embodiments. In some embodiments, the annular base 230 has an outer diameter OD ranging from about 24 cm to about 35 cm, and an outer diameter OD ranging from about 26 cm to about 32 cm in other embodiments. In some embodiments, a ratio of the outer diameter to the inner diameter (OD/ID) ranges from about 1.2 to about 2.3, and in other embodiments OD/ID ranges from about 1.3 to about 1.7.
In some embodiments, a height T1 of the vertically extending member 220 from the annular base 230 to the uppermost surface 220a ranges from about 15 cm to about 35 cm. In other embodiments, the height T1 ranges from about 20 cm to about 30 cm. In some embodiments, the height T1 is substantially the same for each vertically extending member 220 disposed on an annular base 230.
The vertically extending members 220 have a shelf 225 extending in a radial direction away from a center of the annular base 230. In some embodiments, the distance T2 from the top surface 225a of the shelf to the uppermost surface 220a of the vertically extending member 220 ranges from about 2 cm to about 8 cm. In other embodiments, the distance T2 ranges from about 3.5 cm to about 4.5 cm. In some embodiments, a length T3 of the shelf 225 along the radial direction from the center of the support 55b from a vertical portion of the vertically extending member 220 to an end of the shelf 225 ranges from about 3 cm to about 12 cm. In other embodiments, the length T3 ranges from about 4 cm to about 10 cm. In some embodiments, the length T3 is substantially the same for each shelf 225 on each vertically extending member 220 disposed on an annular base 230.
In some embodiments, the width of the top portion of the vertically extending member 220 is chamfered 220b, as shown in
In some embodiments, a width T4 of the vertically extending member at an upper portion above the shelf 225 ranges from about 2 to about 12 cm. In other embodiments, T4 ranges from about 4 cm to about 10 cm. In some embodiments, a width T5 of the vertically extending member at the annular base 230 ranges from about 4 to about 15 cm. In other embodiments, T5 ranges from about 5 cm to about 13 cm.
In some embodiments, a height T6 between the annular base 230 and the junction of the vertical side portion of the vertically extending member 220 and the angled underside 225b of the shelf 225 ranges from between 7 cm to about 13 cm. In other embodiments, T6 ranges from about 9.5 cm to about 10.5 cm. In some embodiments, a length T7 of the angled underside 225b of the shelf 225 ranges from about 6 cm to about 10 cm. In other embodiments, T7 ranges from about 7.5 cm to about 8.5 cm. In some embodiments, the length T8 of a vertical face 225c of the end of the shelf ranges from about 0.2 cm to about 1 cm. In other embodiments, T8 ranges from about 0.4 cm to about 0.6 cm. In some embodiments, an angle α formed by the underside 225b of the shelf and a horizontal line ranges from about 20° to about 70°. In other embodiments, the angle α ranges from about 30° to about 60°.
In some embodiments, at dimensions of the end cap support 55b smaller than those disclosed, the end cap support 55b is not big enough or the end cap support 55b is not robust enough to support the end cap 35. In addition, at dimensions of the end cap support 55b smaller than those disclosed, there may not be sufficient clearance at the bottom of the end cap 35 to attach the internal cleaning fluid line 60 to the end cap projection 35. At dimensions smaller or larger than the disclosed dimensions, the end cap 30 may not fit or sit properly on the end cap support 55b. Also, at dimensions smaller than the disclosed dimensions, the end cap support 55b may not have sufficient structural integrity to support the end cap 30. In addition, at dimensions larger than the disclosed dimensions, the end cap support 55b may be unnecessarily large, the cost of producing the end cap support 55b may be unnecessarily increased.
In some embodiments, a ratio T2/T1 of the distance T2 from a top surface 225a of the shelf to an uppermost surface 220a of the vertically extending member to the distance T1 from a top surface of the annular base to the uppermost surface 220a of the vertically extending member ranges from about 0.05 to about 0.5. In other embodiments, the ratio T2/T1 ranges from about 0.1 to about 0.3. In some embodiments, a ratio T3/T1 of a length T3 of the shelf 225 extending in the radial direction to the distance T1 from the top of the annular base 230 to the uppermost surface 220a of the vertically extending member ranges from about 0.05 to about 0.8. In other embodiments, the ratio T3/T1 ranges from about 0.1 to about 0.5. In some embodiments, a ratio T3/T2 of a length T3 of the shelf 225 extending in the radial direction to the distance T2 from the top surface 225a of the shelf to an uppermost surface 220a of the vertically extending member ranges from about 0.4 to about 6. In other embodiments, the ratio T3/T2 ranges from about 0.8 to about 3.5. In some embodiments, a ratio T1/OD of the height T1 of the vertically extending member from a top surface of the annular base 230 to the uppermost surface 220a of the vertically extending member to an outer diameter OD of the annular base 230 ranges from about 0.4 to about 1.5. In other embodiments, the ratio T1/OD ranges from about 0.6 to about 1.2. In some embodiments, a ratio T5/T4 of a width T5 of the vertically extending member 220 at the annular base 230 to a width T4 at an upper portion above the shelf 225 of the vertically extending member ranges from about 1 to about 7.5. In other embodiments, the ratio T5/T4 ranges from about 1.3 to about 3.3. At ratios outside the disclosed ranges, the end cap 30 may not fit or sit properly on the end cap support 55b, the end cap support 55b may not have sufficient structural integrity to support the end cap 30, or the cost of producing the end cap support 55b may be unnecessarily increased.
As shown in
The programs for causing the computer system 500 to execute the method for controlling the cleaning apparatus and cleaning method are stored in an optical disk 1021 or a magnetic disk 1022, which is inserted into the optical disk drive 1005 or the magnetic disk drive 1006, and transmitted to the hard disk 1014. Alternatively, the programs are transmitted via a network (not shown) to the computer system 500 and stored in the hard disk 1014. At the time of execution, the programs are loaded into the RAM 1013. The programs are loaded from the optical disk 1021 or the magnetic disk 1022, or directly from a network in various embodiments.
The stored programs do not necessarily have to include, for example, an operating system (OS) or a third-party program to cause the computer 1001 to execute the methods disclosed herein. The program may only include a command portion to call an appropriate function (module) in a controlled mode and obtain desired results in some embodiments. In various embodiments described herein, the controller 500 is in communication with the cleaning apparatus 300 to control various functions thereof.
The controller 500 is coupled to the cleaning apparatus 300 in various embodiments. The controller 500 is configured to provide control data to those system components and receive process and/or status data from those system components. For example, in some embodiments, the controller 500 comprises a microprocessor, a memory (e.g., volatile or non-volatile memory), and a digital I/O port capable of generating control voltages sufficient to communicate and activate inputs to the processing system, as well as monitor outputs from the cleaning apparatus 300. In addition, a program stored in the memory is utilized to control the aforementioned components of the cleaning apparatus 300 according to a process recipe. Furthermore, the controller 500 is configured to analyze the process and/or status data, to compare the process and/or status data with target process and/or status data, and to use the comparison to change a process and/or control a system component. In addition, the controller 500 is configured to analyze the process and/or status data, to compare the process and/or status data with historical process and/or status data, and to use the comparison to predict, prevent, and/or declare a fault or alarm.
As set forth above, the executed program causes the processor or computer 500 to monitor or control any or all of the flow of cleaning fluid or rinse fluid, actuate valves, monitor the temperature of the cleaning fluid, control the heater 245, control the flow of the fluid draining through the outlet or drains 110, and monitor the level of recovered fluid in the recovery reservoir or tank 125.
Embodiments of the disclosure reduce defects of tetraethylorthosilicate (TEOS) layer formation. As shown in
A lower silicon nitride layer 475 is subsequently formed over the planarized polysilicon layer, as shown in
A carbon-based bottom layer 490 may be formed over the silicon nitride hard mask layer 485. In some embodiments, the carbon-based bottom layer 490 is formed by chemical vapor deposition (CVD) to a thickness of about 40 to 60 nm, as shown in
Embodiments of the disclosure provide semiconductor devices with reduced defects and higher yields. Embodiments of the disclosure also provide improved uniformity of layers deposited in a quartz tube furnace. In addition, embodiments of the disclosure provide increased manufacturing economy. Tube furnace components can be cleaned and reused rather than replaced when they become contaminated by deposition process byproducts.
An embodiment of the disclosure is a method of cleaning, including placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection. In an embodiment, the semiconductor device manufacturing tool component includes one or more additional open-ended tubular quartz projections, and the method includes sealing the one or more additional open-ended tubular quartz projections before applying the cleaning fluid. In an embodiment, the sealing includes attaching an end cap to an outer end of the one or more additional open-ended tubular quartz projections. In an embodiment, the first open-ended tubular quartz projection includes a ground glass ball joint at an outer end. In an embodiment, the cleaning fluid inlet line is attached to the first open-ended tubular quartz projection using a clamp. In an embodiment, the clamp includes an opposing first and second Y-shaped plates with U-shaped openings on a first end along a length of the plates, a screw tightener attached to a second end of the first Y-shaped plate along the length of the plates, and a block attached to a second end of the second Y-shaped plate along the length of the plates opposing the screw tightener, wherein the first Y-shaped plate and the second Y-shaped plate pivot about a common axis between the first ends and second ends of the first Y-shaped plate and the second Y-shaped plate. In an embodiment, the semiconductor device manufacturing tool component is a tube portion of a quartz tube furnace, having an open end and a close end, and the first open-ended tubular quartz projection extends from the closed end. In an embodiment, the support includes an annular base and a plurality of vertically extending members arranged on the annular base, wherein each vertically extending member includes a horizontally extending shelf. In an embodiment, the semiconductor device manufacturing tool component is an end cap of a quartz tube furnace. In an embodiment, the first open-ended tubular quartz projection extends toward a base of the support.
Another embodiment of the disclosure is a support including an annular base and three or more vertically extending members arranged on the annular base. Each vertically extending member includes a shelf extending in a radial direction away from a center of the annular base. The vertically extending members are evenly arranged around the annular base. A ratio of a distance from a top surface of the shelf to an uppermost surface of the vertically extending member to a distance from a top surface of the annular base to the uppermost surface of the vertically extending member ranges from 0.05 to 0.5. A ratio of a length of the shelf extending in the radial direction to the distance from the top of the annular base to the uppermost surface of the vertically extending member ranges from 0.05 to 0.8. In an embodiment, a ratio of a length of the shelf extending in the radial direction to the distance from the top surface of the shelf to an uppermost surface of the vertically extending member ranges from 0.4 to 6. In an embodiment, a ratio of an outer diameter of the annular base to an inner diameter of the annular base ranges from 1.2 to 2.3. In an embodiment, a ratio of the distance from a top surface of the annular base to the uppermost surface of the vertically extending member to an outer diameter of the annular base ranges from 0.4 to 1.5. In an embodiment, a ratio of a width of the vertically extending member at the annular base to a width at an upper portion above the shelf of the vertically extending member ranges from 1 to 7.
Another embodiment of the disclosure is a cleaning apparatus including an enclosure and a support structure arranged inside the enclosure. The support structure includes an annular base and three or more vertically extending members arranged on the annular base. Each vertically extending member includes a shelf extending in a radial direction away from a center of the annular base. The vertically extending members are evenly arranged around the annular base. A ratio of a distance from a top surface of the shelf to an uppermost surface of the vertically extending member to a distance from a top surface of the annular base to the uppermost surface of the vertically extending member ranges from 0.05 to 0.5, and a ratio of a length of the shelf extending in the radial direction to the distance from the top surface of the annular base to the uppermost surface of the vertically extending member ranges from 0.05 to 0.8. A cleaning fluid inlet line is configured to attach to and provide cleaning fluid to a component to be cleaned in the cleaning apparatus. In an embodiment, the cleaning apparatus includes a cleaning fluid outlet line at a base of the enclosure. In an embodiment, the cleaning apparatus includes a cleaning fluid drain in a base of the enclosure. In an embodiment, the cleaning apparatus includes a ratio of an outer diameter of the annular base to an inner diameter of the annular base ranges from 1.2 to 2.3. In an embodiment, a ratio of the distance from a top surface of the annular base to the uppermost surface of the vertically extending member to an outer diameter of annular base ranges from 0.4 to 1.5.
The foregoing outlines features of several embodiments or examples so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments or examples introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
This application is a divisional of U.S. application Ser. No. 17/833,814 filed Jun. 6, 2022, the entire content of which is incorporated herein by reference.
Number | Date | Country | |
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Parent | 17833814 | Jun 2022 | US |
Child | 18638911 | US |