Claims
- 1. A method of forming a coating on a substrate which comprises coating a substrate with an organopolysiloxane composition vulcanisable at ambient temperature and above, comprising in parts by weight:
- A. 100 parts of an .alpha.,.omega.-dihydroxydiorganopolysiloxane polymer, of viscosity 500 cPo at 25.degree. C to 1 million cPo at 25.degree. C, in which each organic radical bonded to each silicon atom, independently is an alkyl radical with 1 to 3 carbon atoms, a halogenoalkyl radical with 3 or 4 carbon atoms, a vinyl radical, an aryl radical with 6 to 8 carbon atoms, a halogenoaryl radical with 6 or 7 carbon atoms or a cyanoalkyl radical with 3 or 4 carbon atoms; at least 60% of these organic radicals being methyl radicals;
- B. 10 to 50 parts of a methylpolysiloxane resin consisting of units of the formula R(CH.sub.3).sub.2 SiO.sub.0.5 and units of formula SiO.sub.2, wherein R represents an alkyl radical with 1 to 3 carbon atoms or a vinyl radical, and the value of the ratio of the number of R(CH.sub.3).sub.2 SiO.sub.0.5 units to the number of SiO.sub.2 units is 0.4:1 to 1.2:1, these polymers containing at least 0.5% but not more than 3.5% by weight of hydroxyl groups bonded to the silicon atoms;
- C. 10 to 70 parts of a filler;
- D. 0.5 to 15 parts of an aminoorganosilicon compound which is an aminoorganosilane of the general formula (i)
- (R"O).sub.3.sub.-p R'.sub.p Si[(CH.sub.2).sub.n O].sub.m (CH.sub.2).sub.t NHQ
- in which R' represents an alkyl group with 1 to 4 carbon atoms, a vinyl group or a phenyl group, R" represents a methyl, ethyl or methoxyethyl radical, Q represents a hydrogen atom or the radical --(CH.sub.2).sub.2 NH.sub.2, p and m represent 0 or 1, n represents 1, 2, 3 or 4, and t represents 2 or 3; or an aminoorganopolysiloxane produced by reacting the aminoorganosilane (i) above, in which p is 0, with a hydroxylic methylpolysiloxane polymer (ii) containing at least 2% by weight of hydroxyl groups bonded to the silicon atoms, of viscosity 1 cPo at 25.degree. C to 1,000 cPo at 25.degree. C, of the average general formula (CH.sub.3).sub.a (HO).sub.b --SiO.sub.(4.sub.-a.sub.-b/2) in which a represents any number from 1.6 to 2.3 and b represents any number ranging from 0.1 to 1; the amounts of aminoorganosilane (i) and hydroxylic methylpolysiloxane polymer (ii) being such that there are 0.4 to 1.2 mols of (i) per gram(hydroxyl group) of (ii); and
- E. 0 to 10 parts of at least one compound selected from the group consisting of alkyl silicates and alkyl polysilicates in which the alkyl radical has 1-3 carbon atoms;
- and then curing the coating of the composition on the substrate at ambient temperature or above.
- 2. A method according to claim 1, wherein component B is one in which the value of the ratio of the number of (CH.sub.3).sub.3 SiO.sub.0.5 units to the number of SiO.sub.2 units is 0.58:1 to 0.69:1 and the resin contains 1.1 to 2.2% by weight of hydroxyl groups bonded to the silicon atoms.
- 3. A method according to claim 1 wherein component D is an aminoorganosilane of the formula: H.sub.2 NCH.sub.2 CH.sub.2 NH(CH.sub.2).sub.3 Si(OCH.sub.3).sub.3 ; H.sub.2 N(CH.sub.2).sub.3 Si(OC.sub.2 H.sub.5).sub.3 ; H.sub.2 N(CH.sub.2).sub.3 SiCH.sub.3 (OC.sub.2 H.sub.5).sub.2 ; H.sub.2 N(CH.sub.2).sub.3 O(CH.sub.2).sub.3 Si(OC.sub.2 H.sub.5).sub.3 or H.sub.2 N(CH.sub.2).sub.3 O(CH.sub.2).sub.3 SiC.sub.6 H.sub.5 (OC.sub.2 H.sub.5).sub.2.
- 4. A method according to claim 1 wherein component C is an inorganic filler or an organic filler or a mixture thereof.
- 5. A method according to claim 1 wherein the substrate is an electronic connection and the cured composition protects the connection.
Priority Claims (1)
Number |
Date |
Country |
Kind |
73.17157 |
May 1973 |
FR |
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Parent Case Info
This is a division of application Ser. No. 468,871 filed May 10, 1974 now U.S. Pat. No. 3,933,729.
US Referenced Citations (8)
Divisions (1)
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Number |
Date |
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Parent |
468871 |
May 1974 |
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