Claims
- 1. A method of coating a metal substrate to provide corrosion protection, which method comprises the following steps:
- (a) pretreating the metal substrate with a gas plasma to reduce or remove surface oxides from the metal substrate;
- (b) forming an oxygen-free film on the pretreated metal substrate by means of plasma deposition, comprising polymerizing a non-oxygen containing organic compound, wherein the plasma deposition employs DC power and is carried out in a vacuum chamber enclosing a cathode and anode, and wherein the metal substrate is the cathode; and
- (c) applying a primer by cathodic electrocoating the primer over said oxygen-free film.
- 2. The method of claim 1, wherein said anode is magnetically enhanced in step (b).
- 3. The method of claim 1, where the plasma deposition of a film in step (b) employs a compound selected from the group consisting of methylsilane, trimethylsilane, dimethylsilane, tetramethylsilane, methane, and combinations thereof.
- 4. The method of claim 1, where the metal substrate being processed is non-galvanized cold-rolled or bare steel.
- 5. The method of claim 1, further comprising a step (d) in which a monocoat, basecoat, or basecoat/clearcoat finish is applied over the primer.
- 6. The method of claim 1, where the gas plasma used for pretreating the metal substrate in step (a) is selected from the group consisting of argon, hydrogen, nitrogen, krypton, helium, neon, xenon and mixtures thereof.
- 7. The method of claim 1, wherein the primer is an epoxy-amine or epoxy-polyester melamine containing composition.
- 8. A method of coating a non-galvanized metal substrate to provide corrosion protection, which method comprises the following steps:
- (a) pretreating the non-galvanized metal substrate with a gas plasma to substantially remove oxygen and oxides from the surface of the metal substrate;
- (b) forming an organic polymeric film on the pretreated non-galvanized metal substrate by means of plasma deposition, wherein the plasma deposition employs DC power and is carried out in a vacuum chamber enclosing a cathode and anode, and wherein the metal substrate is the cathode; and
- (c) applying a primer by cathodic electrocoating the primer over said organic polymeric film.
- 9. The method of claim 8, wherein the gas plasma removes essentially all of the oxygen and oxides from the surface of the metal substrate.
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part application of application Ser. No. 07/789,485 filed Nov. 12, 1991 now U.S. Pat. No. 5,182,000.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4980196 |
Yasuda et al. |
Dec 1990 |
|
5182000 |
Antonelli et al. |
Jan 1993 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
789485 |
Nov 1991 |
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