Number | Name | Date | Kind |
---|---|---|---|
4020206 | Beil | Apr 1977 | |
4234367 | Herron et al. | Nov 1980 | |
4301324 | Kumar et al. | Nov 1981 | |
4594181 | Siuta | Jun 1986 | |
4671928 | Herron et al. | Jun 1987 | |
4776978 | Herron et al. | Oct 1988 | |
4964948 | Reed | Oct 1990 |
Entry |
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IBM patent application Ser. No. 07/758,991, Filed Sep. 10, 1991, Aoude, et al., "Copper-Based Paste Containing Copper Aluminate for Microstructural and Shrinkage Control of Copper-Filled Vias". |