Claims
- 1. A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution consisting essentially of a copper compound, a reducing agent consisting of at least one saccharide having a reducing property, a complexing agent and an alkali metal hydroxide; and electroplating the coated moldingswherein the electroless copper plating solution has a pH of 10 to 14 and the reducing agent is contained in the electroless copper plating solution in amounts sufficient to function as a reducing agent.
- 2. The method according to claim 1, wherein the electroless copper plating solution is an aqueous solution comprising 0.1 to 5 g/l, calculated as copper metal, of the copper compound, 2 to 50 g/l of the complexing agent, 3 to 50 g/l of the saccharide having a reducing property, and 10 to 80 g/l of the alkali metal hydroxide.
- 3. The method according to claim 1 or 2, wherein the saccharide having a reducing property is at least one selected from the group consisting of grape sugar, glucose, sorbitol, cellulose, cane sugar, mannitol and gluconolactone, and wherein the complexing agent is at least one selected from the group consisting of hydantoin compounds and organic carboxylic acids.
- 4. The method according to claim 1 or 2, wherein the complexing agent is a hydantoin compound alone or a mixture of a hydantoin compound and an organic carboxylic acid, the amount of the organic carboxylic acid being 50% by weight or less of the hydantoin compound.
- 5. The method according to claim 1 or 2, wherein the electroless copper plating solution has a pH of 10 to 14 and a solution temperature of 20 to 70° C.
Parent Case Info
This is a national stage application of Ser. No. PCT/JP97/01187 filed Apr. 7, 1997.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/JP97/01187 |
|
WO |
00 |
11/20/1998 |
11/20/1998 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO98/45505 |
10/15/1998 |
WO |
A |
US Referenced Citations (11)
Foreign Referenced Citations (16)
Number |
Date |
Country |
2 109 013 |
May 1983 |
GB |
2134931A |
Aug 1984 |
GB |
55-22552 |
Jun 1980 |
JP |
56-16179 |
Apr 1981 |
JP |
2-1912 |
Jan 1990 |
JP |
2-14430 |
Apr 1990 |
JP |
2-24910 |
May 1990 |
JP |
2-27436 |
Jun 1990 |
JP |
3-267393 |
Nov 1991 |
JP |
3-76599 |
Dec 1991 |
JP |
5-44075 |
Feb 1993 |
JP |
5-148662 |
Jun 1993 |
JP |
5-221637 |
Aug 1993 |
JP |
7-197266 |
Aug 1995 |
JP |
2-83796 |
Mar 1996 |
JP |
WO 9514538 |
Jun 1995 |
WO |