Claims
- 1. A method for producing an electronic part having insulated lead terminals comprising the steps of:
- coating at least a first portion of electrical lead terminals of an electronic part unit with an insulating resin; and
- adhering insulating tape across the lead terminals from two opposing sides of the lead terminals such that said insulating tape encases at least a second portion of said lead terminals, said lead terminals extending out farther from said electronic part than said insulating tape, leaving a distal-most portion of said lead terminals uncovered by said insulating tape;
- wherein said insulating tape is adhered to said lead terminals to become a portion of said electronic part in order to insulate said lead terminals; and
- wherein said coating step is performed before said adhering step.
- 2. A method according to claim 1, wherein said electronic part is a thermo-sensitive semiconductor device formed with one of a positive temperature coefficient thermistor device and a negative temperature coefficient thermistor device wherein said first portion and said second portion are both formed with said insulating.
- 3. A method according to claim 1, wherein said step of coating further includes the step of:
- immersing said at least a portion of said lead terminals into a resin.
- 4. A method according to claim 3, further comprising the step of:
- forming said lead terminals as first and second lead terminals which extend in parallel from said electronic part unit.
- 5. A method according to claim 4, wherein said step of forming further includes the step of:
- separating said first and second lead terminals from one another by a first distance at a first location along their length, and separating said first and second lead terminals from one another by a second separation distance at a second location along their length.
- 6. A method according to claim 1, wherein said coating step also comprises coating said electronic part unit.
- 7. A method according to claim 1, wherein the distance between said lead terminals decreases in a direction toward said electronic part unit.
- 8. A method according to claim 7, wherein the distance between said lead terminals gradually decreases in a tapered configuration in a direction toward said electronic part unit.
- 9. A method according to claim 7, wherein the distance between said lead terminals decreases in a step configuration, such that the lead terminals extend in a parallel direction separated by a first distance at a first location along their lengths, and the lead terminals extend in a parallel direction separated by a second distance at a second location along their lengths, the first location being closer to the electronic part unit than said second location, and the first distance being smaller than said second distance.
- 10. A method according to claim 9, wherein said tape is applied such that it does not encase a section located directly adjacent to said electronic part unit.
- 11. A method according to claim 10, wherein said resin is applied at least in part to said section which is not to be encased by said tape.
- 12. A method according to claim 11, wherein said resin is applied such that it also covers said electronic part unit.
- 13. A method according to claim 12, wherein a portion of said tape overlaps said resin.
- 14. A method according to claim 13, wherein said tape comprises a single piece of tape which is folded over the lead terminals to encase the lead terminals.
- 15. A method according to claim 7, wherein said tape is applied such that it does not encase a section located directly adjacent to said electronic part unit.
- 16. A method according to claim 15, wherein said resin is applied at least in part to said section which is not to be-encased by said tape.
- 17. A method according to claim 1, wherein said tape is applied such that it does not encase a section located directly adjacent to said electronic part unit.
- 18. A method according to claim 17, wherein said resin is applied at least in part to said section which is not to be encased by said tape.
- 19. A method according to claim 1, wherein said tape comprises a single piece of tape which is folded over the lead terminals to encase the lead terminals.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-166884 |
Jul 1994 |
JPX |
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Parent Case Info
This application is a divisional of application Ser. No. 08/504,338, filed Jul. 19, 1995 now abandoned.
US Referenced Citations (24)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2-285602 |
Nov 1990 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
504338 |
Jul 1995 |
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